DS26C31T NSC | Alldatasheet
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n Typical propagation delays: 6 ns n Typical output skew: 0.5 ns n Outputs will not load line when VCC = 0V n DS26C31T meets the requirements of EIA standard RS-422 n Operation from single 5V supply n TRI-STATE outputs for connection to system buses n Low quiescent current n Available in surface mount n Mil-Std-883C compliant Connection Diagrams Truth Table ENABLE ENABLE Input Non-Inverting Inverting Output Output LH X Z Z All other L L H combinations of H H L enable inputs L = Low logic state X = Irrelevant H = High logic state Z = TRI-STATE (high impedance) TRI-STATE® is a registered trademark of National Semiconductor Corporation. FACT ™ is a trademark of National Semiconductor Corporation. Dual-In-Line Package DS008574-1 Top View Order Number DS26C31TM or DS26C31TN See NS Package Number M16A or N16E For Complete Military Product Specifications, refer to the appropriate SMD or MDS. Order Number DS26C31ME/883, DS26C31MJ/883 or DS26C31MW/883 See NS Package Number E20A, J16A or W16A 20-Lead Ceramic Leadless Chip Carrier (E) DS008574-12 June 1998 DS26C31T/DS26C31M CMOS Quad TRI-STATE Differential Line Driver © 1998 National Semiconductor Corporation DS008574 www.national.com
Absolute Maximum Ratings(Notes 1, 2) If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/ Distributors for availability and specifications. Supply Voltage (V CC ) −0.5V to 7.0V DC Input Voltage (VIN) −1.5V to V CC +1.5V DC Output Voltage (VOUT ) −0.5V to 7V Clamp Diode Current (IIK,IOK ) ±20 mA DC Output Current, per pin (IOUT ) ±150 mA DC V CC or GND Current, per pin (ICC ) ±150 mA Storage Temperature Range (TSTG ) −65˚C to +150˚C Max. Power Dissipation (PD ) @25˚C (Note 3) Ceramic “J” Pkg. 2419 mW Plastic “N” Pkg. 1736 mW SOIC “M” Pkg. 1226 mW Ceramic “W” Pkg. 1182 mW Ceramic “E” Pkg. 2134 mW Lead Temperature (T (Soldering, 4 sec.) 260˚C This device does not meet 2000V ESD Rating. (Note 13) Operating Conditions Min Max Units Supply Voltage (VCC ) 4.50 5.50 V DC Input or Output Voltage (VIN,V OUT )0 V CC V Operating Temperature Range (TA) DS26C31T −40 +85 ˚C DS26C31M −55 +125 ˚C Input Rise or Fall Times (t r,tf) 500 ns VCC = 5V ± 10% (unless otherwise specified) (Note 4) Symbol Parameter Conditions Min Typ Max Units VIH High Level Input Voltage 2.0 V VIL Low Level Input Voltage 0.8 V VOH High Level Output Voltage V IN = VIH or VIL, 2.5 3.4 V IOUT = −20 mA VOL Low Level Output V IN = VIH or VIL, 0.3 0.5 V Voltage I OUT = 20 mA VT Differential Output R L = 100Ω 2.0 3.1 V Voltage (Note 5) |VT|−| VT | Difference In R L = 100Ω 0.4 V Differential Output (Note 5) VOS Common Mode R L = 100Ω 1.8 3.0 V Output Voltage (Note 5) |VOS −V OS | Difference In R L = 100Ω 0.4 V Common Mode Output (Note 5) IIN Input Current V IN = VCC , GND, VIH,o rVIL ±1.0 µA ICC Quiescent Supply DS26C31T V IN = VCC or GND 200 500 µA Current (Note 6) I OUT = 0µ A V IN = 2.4V or 0.5V 0.8 2.0 mA (Note 6) DS26C31M V IN = VCC or GND 200 500 µA IOUT = 0µ A V IN = 2.4V or 0.5V 0.8 2.1 mA (Note 6) IOZ TRI-STATE Output V OUT = VCC or GND Leakage Current ENABLE = VIL ±0.5 ±5.0 µA ENABLE = VIH ISC Output Short V IN = VCC or GND −30 −150 mA Circuit Current (Notes 5, 7) www.national.com 2
VCC = 5V ± 10% (unless otherwise specified) (Note 4) Symbol Parameter Conditions Min Typ Max Units IOFF Output Leakage Current DS26C31T V OUT = 6V 100 µA Power Off (Note 5) V CC = 0V V OUT = −0.25V −100 µA DS26C31M V OUT = 6V 100 µA VCC = 0V V OUT = 0V −100 µA (Note 8) Note 1:Absolute Maximum Ratings are those values beyond which the safety of the device cannot be guaranteed. They are not meant to imply that the device should be operated at these limits. The table of “Electrical Characteristics” provide conditions for actual device operation. Note 2:Unless otherwise specified, all voltages are referenced to ground. All currents into device pins are positive, all currents out of device pins are negative. Note 3:Ratings apply to ambient temperature at 25˚C. Above this temperature derate N package at 13.89 mW/˚C, J package 16.13 mW/˚C, M package 9.80 mW/˚C, E package 12.20 mW/˚C, and W package 6.75 mW/˚C. Note 4:Unless otherwise specified, min/max limits apply across the recommended operating temperature range. All typicals are given for VCC = 5V and TA = 25˚C. Note 5:See EIA Specification RS-422 for exact test conditions. Note 6:Measured per input. All other inputs at VCC or GND. Note 7:This is the current sourced when a high output is shorted to ground. Only one output at a time should be shorted. Note 8:The DS26C31M (−55˚C to +125˚C) is tested with VOUT between +6V and 0V while RS-422A condition is +6V and −0.25V. Switching Characteristics VCC = 5V ±10% ,tr ≤ 6 ns, tf ≤ 6n s(Figures 1, 2, 3, 4) (Note 4) Symbol Parameter Conditions Min Typ Max Units DS26C31T CS26C31M tPLH ,tPHL Propagation Delays S1 Open 2 6 11 14 ns Input to Output Skew (Note 9) S1 Open 0.5 2.0 3.0 ns t TLH ,tTHL Differential Output Rise S1 Open 6 10 14 ns And Fall Times t PZH Output Enable Time S1 Closed 11 19 22 ns tPZL Output Enable Time S1 Closed 13 21 28 ns tPHZ Output Disable Time S1 Closed 5 9 12 ns (Note 10) t PLZ Output Disable Time S1 Closed 7 11 14 ns (Note 10) C PD Power Dissipation 50 pF Capacitance (Note 11) C IN Input Capacitance 6 pF Note 9:Skew is defined as the difference in propagation delays between complementary outputs at the 50% point. Note 10:Output disable time is the delay from ENABLE or ENABLE being switched to the output transistors turning off. The actual disable times are less than in- dicated due to the delay added by the RC time constant of the load. Note 11:C PD determines the no load dynamic power consumption, PD = C PD VCC 2f+I CC VCC , and the no load dynamic current consumption, IS = C PD VCC f+ ICC . Comparison Table of Switching Characteristics into “LS-Type” Load VCC = 5V, TA = 25˚C, tr ≤ 6 ns, tf ≤ 6n s(Figures 2, 4, 5, 6) (Note 12) Symbol Parameter Conditions DS26C31T DS26LS31C Units Typ Max Typ Max tPLH ,tPHL Propagation Delays C L = 30 pF Input to Output S1 Closed 6 8 10 15 ns S2 Closed Skew (Note 9) C L = 30 pF S1 Closed 0.5 1.0 2.0 6.0 ns S2 Closed www.national.com3
Note:C1 = C2 = C3 = 40 pF (Including Probe and Jig Capacitance), R1= R2 = 50Ω ,R 3= 500Ω . FIGURE 1. AC Test Circuit
Typical Performance Characteristics Differential Propagation Delay vs Temperature DS008574-14 Differential Propagation Delay vs Power Supply Voltage DS008574-15 Differential Skew vs Temperature DS008574-16 Differential Skew vs Power Supply Voltage DS008574-17 Differential Transition Time vs Temperature DS008574-18 Differential Transition Time vs Power Supply Voltage DS008574-19 Complementary Skew vs Temperature DS008574-20 Complementary Skew vs Power Supply Voltage DS008574-21 Differential Output Voltage vs Output Current DS008574-22 www.national.com7
Typical Performance Characteristics(Continued) Differential Output Voltage vs Output Current DS008574-23 Output High Voltage vs Output High Current DS008574-24 Output High Voltage vs Output High Current DS008574-25 Output Low Voltage vs Output Low Current DS008574-26 Output Low Voltage vs Output Low Current DS008574-27 Supply Current vs Temperature DS008574-28 Supply Current vs Power Supply Voltage DS008574-29 No Load Supply Current vs Data Rate DS008574-30 Loaded Supply Current vs Data Rate DS008574-31 www.national.com 8
Typical Performance Characteristics(Continued) Output Short Circuit Current vs Temperature DS008574-32 Output Short Circuit Current vs Power Supply Voltage DS008574-33 www.national.com9
Physical Dimensionsinches (millimeters) unless otherwise noted 20-Lead Ceramic Leadless Chip Carrier (E) Order Number DS26C31ME/883 16-Lead Ceramic Dual-In-Line Package (J) Order Number DS26C31MJ/883 www.national.com 10
Physical Dimensionsinches (millimeters) unless otherwise noted (Continued) Molded Package Small Outline (M) Order Number DS26C31TM 16-Lead Molded Dual-In-Line Package (N) Order Number DS26C31TN www.national.com11
Physical Dimensionsinches (millimeters) unless otherwise noted (Continued) LIFE SUPPORT POLICY NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DE- VICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL SEMI- CONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or sys- tems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and whose fail- ure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury to the user. 2. A critical component in any component of a life support device or system whose failure to perform can be rea- sonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. National Semiconductor Corporation Americas Tel: 1-800-272-9959 Fax: 1-800-737-7018 Email: support@nsc.com www.national.com National Semiconductor Europe Fax: +49 (0) 1 80-530 85 86 Email: europe.support@nsc.com Deutsch Tel: +49 (0) 1 80-530 85 85 English Tel: +49 (0) 1 80-532 78 32 Français Tel: +49 (0) 1 80-532 93 58 Italiano Tel: +49 (0) 1 80-534 16 80 National Semiconductor Asia Pacific Customer Response Group Tel: 65-2544466 Fax: 65-2504466 Email: sea.support@nsc.com National Semiconductor Japan Ltd. Tel: 81-3-5620-6175 Fax: 81-3-5620-6179 16-Lead Ceramic Flatpak Package (W) Order Number DS26C31MW/883 DS26C31T/DS26C31M CMOS Quad TRI-STATE Differential Line Driver National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications.