DS150DF1610 TI1 | Alldatasheet
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PRODUCT□PREVIEW VDD RX_0_0P RX_0_0N RX_1_7P RX_1_7N REF_CLK_N CLK_MON_N SCL_IO ADDR0 SDA_IO INTERR_IO TX_0_0P TX_0_0N TX_1_7P TX_1_7N TDI_IO TDO_IO TRST_IO TMS_IO TCK_IO 100nF 100nF
312.5 MHz
2.5V or 3.3V 22/c1dF (1x) 0.1/c1dF (8x) 2.5V REF_CLK_P CLK_MON_P EN_SMB RESET_IO GND 1k/c3a1k/c3a1k/c3a 1k/c3a 2k/c3a2k/c3a 2k/c3a2k/c3a ADDR1 1/c1dF 1/c1dF READ_EN 100nF 100nF Product Folder Sample & Buy T echnical Documents Tools & Software Support & Community DS150DF1610 SNLS490 –NOVEMBER 2014 DS150DF161012.5to15Gbps16-ChannelRetimer
1 Features 3 Description
The DS150DF1610 is a sixteen-channel multi-rate 1• Pin-Compatible Family retimer with integrated signal conditioning features.– DS150DF1610: 12.5 to 15G The device includes a fully adaptive Continuous Time – DS125DF1610: 9.8 to 12.5G Linear Equalizer (CTLE), Decision Feedback Equalizer (DFE), clock and data recovery (CDR), and– DS110DF1610: 8.5 to 11.3G a transmit FIR filter to enhance the reach and• Fully Adaptive CTLE robustness over long, lossy, crosstalk impaired high
- Self tuning DFE, with Optional Continuous speed serial links to achieve BER < 1×10-15. Adaption Each channel of the DS150DF1610 independently• Configurable VGA locks to serial data rates between 12.5 and 15 Gbps
- Adjustable Transmit VOD plus the divide by 2, 4 and 8 sub-multiples. A simple external oscillator (±100ppm) that is synchronous or• Adjustable 3-tap Transmit FIR Filter asynchronous with the incoming data stream is used• On-chip AC Coupling on Receive Inputs as a calibration clock.
- Locks to Half/Quarter/Eighth Data Rates for A programmable transmit Finite Impulse ResponseLegacy Support (FIR) filter offers control of the pre-cursor, main tap• On-chip Eye Monitor(EOM), PRBS Checker, and post-cursor for transmit equalization. The fullyPattern Generator adaptive receive equalization (CTLE and DFE) enables longer distance transmission in lossy copper• Supports JTAG Boundary Scan interconnects and backplanes with multiple• Programmable Output Polarity Inversion connectors.• Input Signal Detection, CDR Lock Detection A non-disruptive mission mode eye-monitor feature• Single 2.5 V ±5% Power Supply allows link monitoring internal to the receiver. The• SMBus Based Register Configuration built-in PRBS generator and checker compliment the
- Optional EEPROM Configuration internal diagnostic features to complete standalone BERT measurements. Built-in JTAG enables• 15 mm x 15 mm, 196-pin FCBGA Package manufacturing tests.• Operating Temp Range : –10°C to +85°C To download the full datasheet, please send a request to: highspeed_datasheets@list.ti.com2 Applications
- Backplane/Midplane reach extension Device Information(1) PART NUMBER PACKAGE BODY SIZE NOM DS150DF1610 FCBGA (196) 15.00 mm x 15.00 mm (1) For all available packages, see the orderable addendum at the end of the datasheet An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCT PREVIEW Information. Product in design phase of development. Subject to change or discontinuance without notice.
PRODUCT□PREVIEW DS150DF1610 SNLS490 –NOVEMBER 2014 www.ti.com
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version. DATE REVISION COMMENTS November 2014 * Initial Release
5 Device and Documentation Support
5.1 Trademarks
All trademarks are the property of their respective owners.
5.2 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
5.3 Glossary
SLYZ022 — TI Glossary. This glossary lists and explains terms, acronyms, and definitions.
6 Mechanical, Packaging, and Orderable Information
The following pages include mechanical packaging and orderable information. This information is the most current data available for the designed devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
2 Submit Documentation Feedback Copyright © 2014, Texas Instruments Incorporated
Product Folder Links: DS150DF1610
www.ti.com 17-Dec-2015 Addendum-Page 1 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/Ball Finish (6) MSL Peak Temp (3) Op Temp (°C) Device Marking (4/5) Samples DS150DF1610FB/NOPB PREVIEW FCBGA ABB 196 Green (RoHS & no Sb/Br) SNAGCU Level-4-245C-72 HR -10 to 85 DS150 DF1610 DS150DF1610FBE/NOPB PREVIEW FCBGA ABB 196 Green (RoHS & no Sb/Br) SNAGCU Level-4-245C-72 HR -10 to 85 DS150 DF1610 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
www.ti.com 17-Dec-2015 Addendum-Page 2 In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
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