DS14C232TM

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www.ti.com SNLS076C –OCTOBER 1999–REVISED APRIL 2013 DS14C232LowPower+5VPoweredTIA/EIA-232DualDriver/Receiver Check forSamples: DS14C232 1FEATURES DESCRIPTION The DS14C232 isa low power dual driver/receiver 2• Pin Compatible withIndustryStandard featuringan onboardDC toDC converter,eliminatingMAX232, LT1081,ICL232 and TSC232 the need for±12V power supplies.The deviceonly• Single+5V Power Supply requiresa +5V power supply.ICC isspecifiedat 3.0

• Low Power — ICC 3.0mA Maximum mA maximum, making the deviceidealforbattery and power consciousapplications.The drivers'slew• DS14C232C Meets TIA/EIA-232-E(RS-232)and rateissetinternallyand thereceiversfeatureinternalCCITT V.28Standards noisefiltering,eliminatingthe need forexternalslew• CMOS Technology rateand filtercapacitors.The deviceisdesignedto
• ReceiverNoise Filter interfacedata terminalequipment (DTE) with data circuit-terminatingequipment (DCE). The driver• Package Efficiency— 2 Driversand 2 Receivers inputsand receiveroutputsare TTL and CMOS• AvailableinPlasticDIP,Narrow and Wide compatible.DS14C232C driveroutputsand receiverSOIC Packages inputsmeet TIA/EIA-232-E(RS-232)and CCITT V.28
• TIA/EIA-232Compatible Extended Temperature standards. Range Option: – DS14C232T −40°C to+85°C – DS14C232E/J: −55°C to+125°C Connection Diagram Figure1. 16-PinPDIP (See NFG Package)-Top View 16-PinSOIC (See D Package) Pleasebe aware thatan importantnoticeconcerningavailability,standardwarranty,and use incriticalapplicationsof Texas Instrumentssemiconductorproductsand disclaimerstheretoappearsattheend ofthisdatasheet. 2Alltrademarksarethepropertyoftheirrespectiveowners. PRODUCTION DATA informationiscurrentas ofpublicationdate. Copyright© 1999–2013,Texas InstrumentsIncorporatedProductsconform to specificationsper the terms of the Texas Instrumentsstandardwarranty.Productionprocessingdoes not necessarilyincludetestingofallparameters.

SNLS076C –OCTOBER 1999–REVISED APRIL 2013 www.ti.com FunctionalDiagram Figure2. FunctionalBlock Diagram These deviceshave limitedbuilt-inESD protection.The leadsshouldbe shortedtogetherorthedeviceplacedinconductivefoam duringstorageorhandlingtopreventelectrostaticdamage totheMOS gates.

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www.ti.com SNLS076C –OCTOBER 1999–REVISED APRIL 2013 AbsoluteMaximum Ratings(1)(2) SupplyVoltage,VCC −0.3Vto6V V+ Pin (VCC − 0.3)Vto+14V V− Pin +0.3V to−14V DriverInputVoltage −0.3Vto(VCC + 0.3V) DriverOutputVoltage (V+ + 0.3V)to(V− − 0.3V) ReceiverInputVoltage ±25V ReceiverOutputVoltage −0.3Vto(VCC + 0.3V) JunctionTemperature +150°C Maximum Package Power Dissipation@ 25°C (3) D Package 1156 mW ShortCircuitDuration,D OUT Continuous StorageTemp. Range −65°C to+150°C Lead Temp. (Soldering,4 sec.) +260°C ESD Rating (HBM, 1.5kΩ,100 pF) ≥ 2.5kV (1) “AbsoluteMaximum Ratings”arethosevaluesbeyond whichthesafetyofthedevicecannotbe verified.They arenotmeant toimply thatthedevicesshouldbe operatedattheselimits.The tablesof“ElectricalCharacteristics”specifyconditionsfordeviceoperation. (2) Specificationsforthe883 versionofthisproductarelistedseparatelyon thefollowingpages. (3) Ratingsapplytoambienttemperatureat+25°C. Above thistemperaturederate:NFG Package 15.6mW/ °C, and D Package 10.6mW/ °C. Recommended OperatingConditions Min Max Units SupplyVoltage,VCC 4.5 5.5 V OperatingFreeAirTemp. (TA) DS14C232C 0 +70 °C DS14C232T −40 +85 °C ElectricalCharacteristics(1) Over recommended operatingconditions,unlessotherwisespecified Symbol Parameter Conditions Min Typ (2) Max Unit s DC TO DC CONVERTER CHARACTERISTICS V+ PositivePower Supply R L = 3 kΩ,C1 –C4 = 1.0μF,D IN = 0.8V 9.0 V V− NegativePower Supply R L = 3 kΩ,C1 –C4 = 1.0μF,D IN = 2.0V −8.5 V ICC Supply(VCC )Current No Load 1.0 3.0 mA DRIVER CHARACTERISTICS VIH HighLevelInputVoltage 2 VCC V VIL Low LevelInputVoltage GND 0.8 V IIH HighLevelInputCurrent VIN ≥ 2.0V −10 +10 μA IIL Low LevelInputCurrent VIN ≤ 0.8V −10 +10 μA VOH HighLevelOutputVoltage R L = 3 kΩ 5.0 8.0 V VOL Low LevelOutputVoltage R L = 3 kΩ −7.0 −5.0 V (1) Currentintodevicepinsisdefinedas positive.Currentoutofdevicepinsisdefinedas negative.Allvoltagesarereferencedtoground unlessotherwisespecified. (2) AlltypicalsaregivenforVCC = 5.0V. Copyright© 1999–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 3 ProductFolderLinks:DS14C232

SNLS076C –OCTOBER 1999–REVISED APRIL 2013 www.ti.com ElectricalCharacteristics(1)(continued) Over recommended operatingconditions,unlessotherwisespecified Symbol Parameter Conditions Min Typ (2) Max Unit s IOS+ OutputHighShortCircuit VO = 0V,VIN = 0.8V See (3) −30 −15 −5.0 mA Current IOS − OutputLow ShortCircuit VO = 0V,VIN = 2V 5.0 11 30 mA Current R O OutputResistance −2V ≤ VO ≤ +2V, 300 ΩVCC = 0V = GND RECEIVER CHARACTERISTICS VTH InputHighThreshold VCC = 5.0V 1.9 2.4 V Voltage VCC = 5.0V±10% 1.9 2.6 V VTL InputLow Threshold 0.8 1.5 V Voltage VHY Hysteresis 0.2 0.4 1.0 V R IN InputResistance −15V ≤ VIN ≤ +15V 3.0 4.7 7.0 kΩ IIN InputCurrent VIN = +15V +2.14 +3.75 +5.0 mA VOH HighLevelOutputVoltage VIN = −3V,IO = −3.2mA 3.5 4.5 V VIN = −3V,IO = −20 μA 4.0 4.9 V VOL Low LevelOutputVoltage VIN = +3V, IO = +3.2mA 0.15 0.4 V (3) IOS+ and IOS− valuesareforone outputata time.Ifmore thanone outputisshortedsimultaneously,thedevicepower dissipationmay be exceeded. SwitchingCharacteristics Over recommended operatingconditions,unlessotherwisespecified. Symbol Parameter Conditions Min Typ Ma Units x DRIVER CHARACTERISTICS tPLH PropagationDelayLow to R L = 3 kΩ (Figure5,Figure6) 1.0 4.0 μs High C L = 50 pF tPHL PropagationDelayHighto 1.0 4.0 μs Low tSK Skew |tPLH − tPHL | 0.1 1.0 μs SR1 OutputSlew Rate R L = 3 kΩ to7 kΩ,C L = 50 pF See (1) 4.0 30 V/μs SR2 OutputSlew Rate R L = 3 kΩ,C L = 2500 pF 4.5 V/μs RECEIVER CHARACTERISTICS tPLH PropagationDelayLow to InputPulseWidth> 10 μs 2.9 6.5 μs High tPHL PropagationDelayHighto C L = 50 pF 2.5 6.5 μs Low tSK Skew |tPLH − tPHL | (Figure7,Figure8) 0.4 2.0 μs tnw NoisePulseWidthRejected (Figure7,Figure8) 0.7 0.5 μs (1) Slew rateisdefinedas ΔV/Δt,measured between ±3V level.

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www.ti.com SNLS076C –OCTOBER 1999–REVISED APRIL 2013 AbsoluteMaximum Ratings(1)(2) SupplyVoltage,VCC −0.3Vto6V V+ Pin (VCC − 0.3)Vto+14V V− Pin +0.3V to−14V DriverInputVoltage −0.3Vto(VCC + 0.3V) DriverOutputVoltage (V+ + 0.3V)to(V− − 0.3V) ReceiverInputVoltage ±25V ReceiverOutputVoltage −0.3Vto(VCC + 0.3V) Maximum Package Power Dissipation@ 25°C (3) ShortCircuitDuration,D OUT Continuous StorageTemp. Range −65°C to+150°C Lead Temp. (Soldering,4 sec.) +260°C ESD Rating (HMB, 1.5kΩ,100 pF) ≥ 2.5kV (1) “AbsoluteMaximum Ratings”arethosevaluesbeyond whichthesafetyofthedevicecannotbe verified.They arenotmeant toimply thatthedevicesshouldbe operatedattheselimits.The tablesof“ElectricalCharacteristics”specifyconditionsfordeviceoperation. (2) ForcompleteMilitaryProductSpecifications,refertotheappropriateSMD orMDS. (3) Ratingsapplytoambienttemperatureat+25°C. Above thistemperaturederate:NFE Package 12.2mW/ °C and NAJ Package 13.3mW/ °C. Recommended OperatingConditions Min Max Units SupplyVoltage,VCC 4.5 5.5 V OperatingFreeAirTemp. (TA) DS14C232E/J −55 +125 °C ElectricalCharacteristics(1) Over recommended operatingconditions,unlessotherwisespecified Symbol Parameter Conditions Min Max Units DEVICE CHARACTERISTICS (C1–C4 = 1.0μF) ICC Supply(VCC )Current No Load 8.0 mA DRIVER CHARACTERISTICS VIH HighLevelInputVoltage 2 V VIL Low LevelInputVoltage 0.8 V IIH HighLevelInputCurrent VIN ≥ 2.0V 100 μA IIL Low LevelInputCurrent VIN = 0V 100 μA VOH HighLevelOutputVoltage R L = 3 kΩ 5.0 V VOL Low LevelOutputVoltage R L = 3 kΩ −5.0 V IOS+ OutputHighShortCircuit VO = 0V See (2) −25 mA Current IOS − OutputLow ShortCircuit VO = 0V 25 mA Current R O OutputResistance −2V ≤ VO ≤ +2V, TA = 25°C, 300 ΩVCC = 0V = GND (1) AlltypicalsaregivenforVCC = 5.0V. (2) IOS+ and IOS− valuesareforone outputata time.Ifmore thanone outputisshortedsimultaneously,thedevicepower dissipationmay be exceeded. Copyright© 1999–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 5 ProductFolderLinks:DS14C232

SNLS076C –OCTOBER 1999–REVISED APRIL 2013 www.ti.com ElectricalCharacteristics(1)(continued) Over recommended operatingconditions,unlessotherwisespecified Symbol Parameter Conditions Min Max Units RECEIVER CHARACTERISTICS (C1–C4 = 1.0μF) VTH InputHighThresholdVoltage 3.0 V VTL InputLow ThresholdVoltage 0.2 V VHY Hysteresis TA = 25°C, +125°C 0.1 1.0 V TA = −55°C 0.05 1.0 V R IN InputResistance VIN = ±3V and ±15V,TA = 25°C 3.0 7.0 kΩ VOH HighLevelOutputVoltage IO = −3.2mA 3.5 V IO = −20 μA 4.0 V VOL Low LevelOutputVoltage IO = +3.2mA 0.4 V SwitchingCharacteristics Over recommended operatingconditions,unlessotherwisespecified. Symbol Parameter Conditions Min Max Units DRIVER CHARACTERISTICS (C1–C4 = 1.0μF) tPLH PropagationDelayLow toHigh R L = 3 kΩ,C L = 50 pF (Figure5,Figure6) 4.0 μs tPHL PropagationDelayHightoLow 4.0 μs tSK Skew |tPLH − tPHL | 1.0 μs SR1 OutputSlew Rate R L = 3 kΩ to7 kΩ,C L = 2500 pF See (1) 1.5 30 V/μs RECEIVER CHARACTERISTICS (C1–C4 = 1.0μF) tPLH PropagationDelayLow toHigh InputPulseWidth> 10 μs 8.0 μs tPHL PropagationDelayHightoLow C L = 50 pF 8.0 μs tSK Skew |tPLH − tPHL | (Figure7,Figure8) 2.0 μs (1) Slew rateisdefinedas ΔV/Δt,measured between ±3V level. Connection Diagrams Figure3.16-Lead CDIP Figure4.20-Lead LCCC See NFE Package See NAJ Package ForCompleteMilitaryProductSpecificationssee MDS orSMD

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www.ti.com SNLS076C –OCTOBER 1999–REVISED APRIL 2013 Parameter Measurement Information Figure5. DriverLoad Circuit Figure6. DriverSwitchingWaveform Figure7. ReceiverLoad Circuit A. ReceiverAC inputwaveform fortestpurposes:tr= tf= 200 ns,VIH = 3V,VIL= −3V,f= 30 kHz. Figure8. ReceiverPropagationDelays and Noise Rejection Copyright© 1999–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 7 ProductFolderLinks:DS14C232

SNLS076C –OCTOBER 1999–REVISED APRIL 2013 www.ti.com PIN DESCRIPTIONS VCC (Pin16) Power supplypinforthedevice,+5V (±10%). V+ (Pin2) Thissupplyisnotintendedtobe loadedexternally. V− (Pin6) NegativesupplyforTIA/EIA-232-Edrivers.Recommended externalcapacitor:C3-1.0μF (16V).Capacitorvalueshouldbe largerthan1 μF. Thissupplyisnotintendedtobe loadedexternally. C1+, C1 − (Pins1,3) C2+, C2 − (Pins4,5) Externalcapacitorconnectionpins.Recommended capacitor:1.0μF (16V).Capacitorvalueshouldbe greaterthan1 μF. D IN1,D IN2 (Pins11,10) DriverinputpinsareTTL/CMOS compatible.Inputsofunused driversmay be leftopen,an internalactivepull-upresistor(500kΩ minimum, typically5 M Ω)pullsinputHIGH. Outputwillbe LOW foropen inputs. D OUT 1,D OUT 2 (Pins14,7) DriveroutputpinsconformtoTIA/EIA-232-Elevels. R IN1,R IN2 (Pins13,8) ReceiverinputpinsacceptTIA/EIA-232-Einputvoltages(±25V).Receiversfeaturea noisefilterand specifiedhysteresisof 100 mV. Unused receiverinputpinsmay be leftopen.Internalinputresistor4.7kΩ pullsinputlow,providinga failsafehighoutput. R OUT 1,R OUT 2 (Pins12,9) ReceiveroutputpinsareTTL/CMOS compatible.ReceiveroutputHIGH voltageisspecifiedforbothCMOS and TTL loadconditions. GND (Pin15) Ground Pin.

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www.ti.com SNLS076C –OCTOBER 1999–REVISED APRIL 2013 TYPICAL APPLICATION INFORMATION Figure9. ApplicationofDS14C232 and INS8250 Figure10. TypicalConnection Diagram Copyright© 1999–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 9 ProductFolderLinks:DS14C232

SNLS076C –OCTOBER 1999–REVISED APRIL 2013 www.ti.com TypicalPerformance Characteristics DRIVER SLEW RATE vs POWER DRIVER VOH & VOL vs SUPPLY VOLTAGE & LOAD POWER SUPPLY VOLTAGE CAPACITANCE Figure11. Figure12. VCC = 5.0V,R L = 3 kΩ,C L = 15 pF (includesjigand probe Ta = 25°C, R L = 5 kΩ,C P = 1 μF,ƒ = 30 KHz capacitance),C P = 1 μF Figure13. Figure14. SR = 6V/t1or6V/t2,whicheverisgreater.S1 = 2.0V,VO = VOL Figure15. Figure16.

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www.ti.com SNLS076C –OCTOBER 1999–REVISED APRIL 2013

REVISION HISTORY

Changes from RevisionB (April2013)toRevisionC Page Copyright© 1999–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 11 ProductFolderLinks:DS14C232

www.ti.com 1-Nov-2013 Addendum-Page 1 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/Ball Finish (6) MSL Peak Temp (3) Op Temp (°C) Device Marking (4/5) Samples DS14C232CM NRND SOIC D 16 48 TBD Call TI Call TI 0 to 70 DS14C232CM DS14C232CM/NOPB ACTIVE SOIC D 16 48 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 70 DS14C232CM DS14C232CMX/NOPB ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 70 DS14C232CM DS14C232CN NRND PDIP NFG 16 25 TBD Call TI Call TI 0 to 70 DS14C232CN DS14C232CN/NOPB ACTIVE PDIP NFG 16 25 Pb-Free (RoHS) Call TI Level-1-NA-UNLIM 0 to 70 DS14C232CN DS14C232TM NRND SOIC D 16 48 TBD Call TI Call TI -40 to 85 DS14C232TM DS14C232TM/NOPB ACTIVE SOIC D 16 48 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 DS14C232TM DS14C232TMX NRND SOIC D 16 2500 TBD Call TI Call TI -40 to 85 DS14C232TM DS14C232TMX/NOPB ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 DS14C232TM (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

www.ti.com 1-Nov-2013 Addendum-Page 2 (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant PACKAGE MATERIALS INFORMATION www.ti.com 23-Sep-2013 Pack Materials-Page 1

*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) DS14C232CMX/NOPB SOIC D 16 2500 367.0 367.0 35.0 DS14C232TMX SOIC D 16 2500 367.0 367.0 35.0 DS14C232TMX/NOPB SOIC D 16 2500 367.0 367.0 35.0 PACKAGE MATERIALS INFORMATION www.ti.com 23-Sep-2013 Pack Materials-Page 2

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