DS14185WM

DATASHEET SEARCH SITE | WWW.ALLDATASHEET.COM

Document overview

• Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
• PDF pages: 15

Technical content

www.ti.com SNLS093C –APRIL 1999–REVISED APRIL 2013 DS14185EIA/TIA-2323Driverx5Receiver Check forSamples: DS14185 1FEATURES DESCRIPTION The DS14185 isa threedriver,fivereceiverdevice 2• Replaces One 1488 and Two 1489s whichconformstotheEIA/TIA-232-Estandard.• Conforms toEIA/TIA-232-E The flow-throughpinout facilitatessimple non-• 3 Driversand 5 Receivers crossoverboard layout.The DS14185 providesa• Flow Through Pinout one-chipsolutionforthecommon 9-pinserialRS-232

• FailsafeReceiverOutputs interface between data terminal and data communicationsequipment.• 20-pinSOIC Package
• LapLink Compatible −200 kbps Data Rate Connection Diagram Figure1. SOIC See Package DW0020B FunctionalDiagram Figure2. Pleasebe aware thatan importantnoticeconcerningavailability,standardwarranty,and use incriticalapplicationsof Texas Instrumentssemiconductorproductsand disclaimerstheretoappearsattheend ofthisdatasheet. 2Alltrademarksarethepropertyoftheirrespectiveowners. PRODUCTION DATA informationiscurrentas ofpublicationdate. Copyright© 1999–2013,Texas InstrumentsIncorporatedProductsconform to specificationsper the terms of the Texas Instrumentsstandardwarranty.Productionprocessingdoes not necessarilyincludetestingofallparameters.

SNLS093C –APRIL 1999–REVISED APRIL 2013 www.ti.com These deviceshave limitedbuilt-inESD protection.The leadsshouldbe shortedtogetherorthedeviceplacedinconductivefoam duringstorageorhandlingtopreventelectrostaticdamage totheMOS gates. AbsoluteMaximum Ratings(1)(2) SupplyVoltage(VCC ) +7V SupplyVoltage(V+) +15V SupplyVoltage(V−) −15V DriverInputVoltage 0V toVCC DriverOutput(3)Voltage(PowerOff) ±15V ReceiverInputVoltage ±25V ReceiverOutputVoltage(ROUT ) 0V toVCC Maximum Package Power Dissipation@ DW Package +25°C 1488 mW DerateDW Package 11.9mW/ °C above +25°C StorageTemperatureRange −65°C to+150°C Lead TemperatureRange (Soldering,4 seconds) +260°C ESD Ratings(HBM, 1.5kΩ,100 pF) ≥1.5kV (1) AbsoluteMaximum Ratingsarethosevaluesbeyond whichthesafetyofthedevicecannotbe specified.They arenotmeant toimply thatthedevicesshouldbe operatedattheselimits.The tableofElectricalCharacteristicsspecifiesconditionsofdeviceoperation. (2) IfMilitary/Aerospacespecifieddevicesarerequired,pleasecontacttheTexas InstrumentsSalesOffice/Distributorsforavailabilityand specifications. (3) Onlyone driveroutputshortedata time. Recommended OperatingConditions Min Typ Max Units SupplyVoltage(VCC ) +4.75 +5.0 +5.25 V SupplyVoltage(V+) +9.0 +12.0 +13.2 V SupplyVoltage(V−) −13.2 −12.0 −9.0 V OperatingFreeAirTemperature(TA) 0 25 70 °C ElectricalCharacteristics(1) Over recommended supplyvoltageand operatingtemperatureranges,unlessotherwisespecified. Symbol Parameter Conditions Min Typ (2) Max Units DEVICE CHARACTERISTICS ICC VCC SupplyCurrent No Load,AllInputsat+5V 21.0 30 mA I+ V+ SupplyCurrent(1) No Load,AllDriver V+ = 9V,V− = −9V 8.7 15 mA Inputsat0.8Vor+2V V+ = 13.2V,V− = −13.2V 13 22 mAAllReceiverInputs I− V− SupplyCurrent(1) V+ = 9V,V− = −9V −12.5 −22 mAat0.8Vor2.4V. (1) Currentintodevicepinsisdefinedas positive.Currentoutofdevicepinsisdefinedas negative.Allvoltagesarereferencedtoground unlessotherwisespecified.Forcurrent,minimum and maximum valuesarespecifiedas an absolutevalueand thesignisused to indicatedirection.Forvoltagelogiclevels,themore positivevalueisdesignatedas maximum. Forexample,if−6V isa maximum, the typicalvalue(−6.8V)ismore negative. (2) Alltypicalsaregivenfor:VCC = +5.0V,V+ = +12.0V,V− = −12V,TA = +25°C.

2 SubmitDocumentationFeedback Copyright© 1999–2013,Texas InstrumentsIncorporated

ProductFolderLinks:DS14185

www.ti.com SNLS093C –APRIL 1999–REVISED APRIL 2013 ElectricalCharacteristics(1)(continued) Over recommended supplyvoltageand operatingtemperatureranges,unlessotherwisespecified. Symbol Parameter Conditions Min Typ (2) Max Units DRIVER CHARACTERISTICS VIH HighLevelInputVoltage 2.0 V VIL Low LevelInputVoltage 0.8 V IIH HighLevelInputCurrent(3) VIN = 5V 10 μA IIL Low LevelInputCurrent(3) VIN = 0V −1.24 −1.5 mA VOH HighLevelOutputVoltage(3) R L = 3 kΩ,VIN = 0.8V, 6 7 VV+ = 9V,V− = −9V R L = 3 kΩ,VIN = 0.8V, 8.5 9 VV+ = +12V, V− = −12V VOL Low LevelOutputVoltage(3) R L = 3 kΩ,VIN = 2V, −7 −6 VV+ = 9V,V− = −9V R L = 3 kΩ,VIN = 2V, −8 −7.5 VV+ = +12V, V− = −12V IOS + OutputHighShort VO = 0V,VIN = 0.8V −6 −13 −18 mACircuitCurrent(3) IOS − OutputLow Short VO = 0V,VIN = 2.0V 6 13 18 mACircuitCurrent(3) R O OutputResistance −2V ≤ VO ≤ +2V, 300 ΩV+ = V− = VCC = 0V −2V ≤ VO ≤ +2V, 300 ΩV+ = V− = VCC = Open Ckt RECEIVER CHARACTERISTICS VTH InputHighThreshold VO ≤ 0.4V,IO = 3.2mA 1.85 2.4 V(Recognizedas a HighSignal) VTL InputLow Threshold VO ≥ 2.5V,IO = −0.5mA 0.7 1.0 V(Recognizedas a Low Signal) R IN InputResistance VIN = ±3V to±15V 3.0 4.1 7.0 kΩ IIN InputCurrent(3) VIN = +15V 2.1 4.1 5.0 mA VIN = +3V 0.43 0.7 1 mA VOH HighLevelOutputVoltage(4) IOH = −0.5mA, VIN = −3V 2.6 4 V IOH = −10 μA,VIN = −3V 4.0 4.9 V IOH = −0.5mA, VIN = Open Circuit 2.6 4 V IOH = −10 μA,VIN = Open Circuit 4.0 4.9 V VOL Low LevelOutputVoltage IOL = 3.2mA, VIN = +3V 0.2 0.4 V IOSR ShortCircuitCurrent(3) VO = 0V,VIN = 0V −4 −2.7 −1.7 mA (3) Currentintodevicepinsisdefinedas positive.Currentoutofdevicepinsisdefinedas negative.Allvoltagesarereferencedtoground unlessotherwisespecified.Forcurrent,minimum and maximum valuesarespecifiedas an absolutevalueand thesignisused to indicatedirection.Forvoltagelogiclevels,themore positivevalueisdesignatedas maximum. Forexample,if−6V isa maximum, the typicalvalue(−6.8V)ismore negative. (4) Ifreceiverinputsareunconnected,receiveroutputisa logichigh. Copyright© 1999–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 3 ProductFolderLinks:DS14185

SNLS093C –APRIL 1999–REVISED APRIL 2013 www.ti.com SwitchingCharacteristics(1) TA = 25°C Symbol Parameter Conditions Min Typ (2) Max Units DRIVER CHARACTERISTICS tPHL PropagationDelayHightoLow R L = 3 kΩ,C L = 50 pF 60 350 ns (Figure3 Figure4)tPLH PropagationDelayLow toHigh 240 350 ns tr,tf OutputSlew Rate(3) 50 ns RECEIVER CHARACTERISTICS tPHL PropagationDelayHightoLow R L = 1.5kΩ,C L = 15 pF 150 350 ns (includesfixtureplusprobe),tPLH PropagationDelayLow toHigh 240 350 ns(Figure5 Figure6) tr RiseTime 87 175 ns tf FallTime 40 100 ns (1) Currentintodevicepinsisdefinedas positive.Currentoutofdevicepinsisdefinedas negative.Allvoltagesarereferencedtoground unlessotherwisespecified.Forcurrent,minimum and maximum valuesarespecifiedas an absolutevalueand thesignisused to indicatedirection.Forvoltagelogiclevels,themore positivevalueisdesignatedas maximum. Forexample,if−6V isa maximum, the typicalvalue(−6.8V)ismore negative. (2) Alltypicalsaregivenfor:VCC = +5.0V,V+ = +12.0V,V− = −12V,TA = +25°C. (3) Refertotypicalcurves.Driveroutputslewrateismeasured fromthe+3.0V tothe−3.0Vlevelon theoutputwaveform.Inputsnotunder testareconnectedtoVCC orGND. Slew rateisdeterminedby loadcapacitance.To complywitha 30 V/μs maximum slewrate,a minimum loadcapacitanceof390 pF isrecommended. Parameter Measurement Information Generatorcharacteristicsfordriverinput:f= 64 kHz (128kbits/sec),tr = tf< 10 ns,VIH = 3V,VIL= 0V,dutycycle= 50%. Figure3. DriverPropagationDelay and TransitionTime TestCircuit Figure4. DriverPropagationDelay and TransitionTime Waveforms Slew Rate (SR)= 6V/(tr or tf) Generatorcharacteristicsforreceiverinput:f= 64 kHz (128kbits/sec),tr = tf= 200 ns,VIH = 3V,VIL= −3V,dutycycle = 50%. Figure5. ReceiverPropagationDelay and TransitionTime TestCircuit

4 SubmitDocumentationFeedback Copyright© 1999–2013,Texas InstrumentsIncorporated

ProductFolderLinks:DS14185

www.ti.com SNLS093C –APRIL 1999–REVISED APRIL 2013 Figure6. ReceiverPropagationDelay and TransitionTime Waveform PIN DESCRIPTIONS Pin # Name Description 13,15,16 D IN DriverInputPins 5,6,8 D OUT DriverOutputPins,RS-232 Levels 2,3,4,7,9 R IN ReceiverInputPins,RS-232 Levels 12,14,17,18,19 R OUT ReceiverOutputPins

11 GND Ground

1 V+ PositivePower SupplyPin(+9.0≤ V+ ≤ +13.2) 10 V− NegativePower SupplyPin(−9.0≤ V− ≤ −13.2)

20 VCC PositivePower SupplyPin(+5V ±5%)

Copyright© 1999–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 5 ProductFolderLinks:DS14185

SNLS093C –APRIL 1999–REVISED APRIL 2013 www.ti.com APPLICATIONS INFORMATION In a typicalData TerminalEquipment (DTE) to Data Circuit-TerminatingEquipment (DCE) 9-pinde-facto interfaceimplementation,2 datalinesand 6 controllinesare required.The datalinesare TXD and RXD. The controllinesareRTS, DTR, DSR, DCD, CTS, and RI. The DS14185 isa 3 x 5 Driver/Receiverand offersa singlechipsolutionforthisDTE interface.As shown in Figure7, thisinterfaceallowsfordirectflow-thruinterconnect.For a more conservativedesign,the user may wishtoinsertgroundtracesbetween thesignallinestominimizecrosstalk. LapLink COMPATIBILITY The DS14185 can easilyprovide128 kbps datarateundermaximum driverloadconditionsofC L = 2500 pF and R L = 3 kΩ,whilepower suppliesare: MOUSE DRIVING A typicalmouse can be powered fromthedrivers.Two driveroutputsconnectedinparalleland settoVOH can be used tosupplypower totheV+ pinofthemouse. The thirddriveroutputissettoVOL tosinkthecurrentfromthe V− terminal.RefertotypicalcurvesofVOUT /IOUT .Typicalmouse specificationsare: 10 mA at+6V (2) 5 mA at−6V (3) Figure7. TypicalDTE Application

6 SubmitDocumentationFeedback Copyright© 1999–2013,Texas InstrumentsIncorporated

ProductFolderLinks:DS14185

www.ti.com SNLS093C –APRIL 1999–REVISED APRIL 2013 TypicalPerformance Characteristics The belowinputwaveformswere used togenerateallTypicalAC Characteristics. Figure8. Figure9. DriverOutput Slew Rate between +3V and −3V vs Load Capacitance Conditions:VCC = 5V,R L = 5 kΩ,TA = 25°C, DriverOutput Voltagevs Frequency and C L fIN = 64 kHz Square Wave Conditions:VCC = 5V,R L = 5 kΩ,TA = 25°C Figure10. Figure11. Supply Currentvs Frequency and DriverC L Supply Currentvs Frequency and DriverC L Figure12. Figure13. Copyright© 1999–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 7 ProductFolderLinks:DS14185

SNLS093C –APRIL 1999–REVISED APRIL 2013 www.ti.com TypicalPerformance Characteristics(continued) Supply Currentvs Frequency DriverOutput Currentvs Output Voltage Figure14. Figure15.

8 SubmitDocumentationFeedback Copyright© 1999–2013,Texas InstrumentsIncorporated

ProductFolderLinks:DS14185

www.ti.com SNLS093C –APRIL 1999–REVISED APRIL 2013

REVISION HISTORY

Changes from RevisionB (April2013)toRevisionC Page Copyright© 1999–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 9 ProductFolderLinks:DS14185

www.ti.com 1-Nov-2013 Addendum-Page 1 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/Ball Finish (6) MSL Peak Temp (3) Op Temp (°C) Device Marking (4/5) Samples DS14185WM NRND SOIC DW 20 36 TBD Call TI Call TI 0 to 70 DS14185WM DS14185WM/NOPB ACTIVE SOIC DW 20 36 Green (RoHS & no Sb/Br) SN | CU SN Level-3-260C-168 HR 0 to 70 DS14185WM DS14185WMX NRND SOIC DW 20 1000 TBD Call TI Call TI 0 to 70 DS14185WM DS14185WMX/NOPB ACTIVE SOIC DW 20 1000 Green (RoHS & no Sb/Br) SN | CU SN Level-3-260C-168 HR 0 to 70 DS14185WM (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and

www.ti.com 1-Nov-2013 Addendum-Page 2 continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant PACKAGE MATERIALS INFORMATION www.ti.com 24-Apr-2013 Pack Materials-Page 1

*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) DS14185WMX SOIC DW 20 1000 367.0 367.0 45.0 DS14185WMX/NOPB SOIC DW 20 1000 367.0 367.0 45.0 PACKAGE MATERIALS INFORMATION www.ti.com 24-Apr-2013 Pack Materials-Page 2

Texas InstrumentsIncorporatedand itssubsidiaries(TI)reservetherighttomake corrections,enhancements,improvementsand other changes toitssemiconductorproductsand servicesperJESD46, latestissue,and todiscontinueany productorserviceperJESD48, latest issue.Buyersshouldobtainthelatestrelevantinformationbeforeplacingordersand shouldverifythatsuch informationiscurrentand complete.Allsemiconductorproducts(alsoreferredtohereinas “components”)aresoldsubjecttoTI’s termsand conditionsofsale suppliedatthetimeoforderacknowledgment. TIwarrantsperformanceofitscomponents tothespecificationsapplicableatthetimeofsale,inaccordancewiththewarrantyinTI’s terms and conditionsofsaleofsemiconductorproducts.Testingand otherqualitycontroltechniquesareused totheextentTIdeems necessary tosupportthiswarranty.Exceptwhere mandated by applicablelaw,testingofallparametersofeach component isnotnecessarily performed. TIassumes no liabilityforapplicationsassistanceorthedesignofBuyers’products.Buyersareresponsiblefortheirproductsand applicationsusingTIcomponents.To minimizetherisksassociatedwithBuyers’productsand applications,Buyersshouldprovide adequatedesignand operatingsafeguards. TIdoes notwarrantorrepresentthatany license,eitherexpressorimplied,isgrantedunderany patentright,copyright,mask work right,or otherintellectualpropertyrightrelatingtoany combination,machine,orprocessinwhichTIcomponents orservicesareused.Information publishedby TIregardingthird-partyproductsorservicesdoes notconstitutea licensetouse such productsorservicesora warrantyor endorsementthereof.Use ofsuch informationmay requirea licensefroma thirdpartyunderthepatentsorotherintellectualpropertyofthe thirdparty,ora licensefromTIunderthepatentsorotherintellectualpropertyofTI. ReproductionofsignificantportionsofTIinformationinTIdatabooks ordatasheetsispermissibleonlyifreproductioniswithoutalteration and isaccompaniedby allassociatedwarranties,conditions,limitations,and notices.TIisnotresponsibleorliableforsuch altered documentation.Informationofthirdpartiesmay be subjecttoadditionalrestrictions. ResaleofTIcomponents orserviceswithstatementsdifferentfromorbeyond theparametersstatedby TIforthatcomponent orservice voidsallexpressand any impliedwarrantiesfortheassociatedTIcomponent orserviceand isan unfairand deceptivebusinesspractice. TIisnotresponsibleorliableforany such statements. Buyeracknowledgesand agreesthatitissolelyresponsibleforcompliancewithalllegal,regulatoryand safety-relatedrequirements concerningitsproducts,and any use ofTIcomponents initsapplications,notwithstandingany applications-relatedinformationorsupport thatmay be providedby TI.Buyerrepresentsand agreesthatithas allthenecessaryexpertisetocreateand implementsafeguardswhich anticipatedangerousconsequencesoffailures,monitorfailuresand theirconsequences,lessenthelikelihoodoffailuresthatmightcause harm and takeappropriateremedialactions.BuyerwillfullyindemnifyTIand itsrepresentativesagainstany damages arisingoutoftheuse ofany TIcomponents insafety-criticalapplications. Insome cases,TIcomponents may be promotedspecificallytofacilitatesafety-relatedapplications.Withsuch components,TI’s goalisto helpenablecustomerstodesignand createtheirown end-productsolutionsthatmeet applicablefunctionalsafetystandardsand requirements.Nonetheless,such components aresubjecttotheseterms. No TIcomponents areauthorizedforuse inFDA ClassIII(orsimilarlife-criticalmedicalequipment)unlessauthorizedofficersoftheparties have executeda specialagreementspecificallygoverningsuch use. OnlythoseTIcomponents whichTIhas specificallydesignatedas militarygradeor“enhanced plastic”aredesignedand intendedforuse in military/aerospaceapplicationsorenvironments.Buyeracknowledgesand agreesthatany militaryoraerospaceuse ofTIcomponents whichhave not been so designatedissolelyattheBuyer's risk,and thatBuyerissolelyresponsibleforcompliancewithalllegaland regulatoryrequirementsinconnectionwithsuch use. TIhas specificallydesignatedcertaincomponents as meetingISO/TS16949 requirements,mainlyforautomotiveuse.Inany case ofuse of non-designatedproducts,TIwillnotbe responsibleforany failuretomeet ISO/TS16949. Products Applications Audio www.ti.com/audio Automotiveand Transportationwww.ti.com/automotive Amplifiers amplifier.ti.com Communicationsand Telecom www.ti.com/communications Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers DLP ® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps DSP dsp.ti.com Energyand Lighting www.ti.com/energy Clocksand Timers www.ti.com/clocks Industrial www.ti.com/industrial Interface interface.ti.com Medical www.ti.com/medical Logic logic.ti.com Security www.ti.com/security Power Mgmt power.ti.com Space,Avionicsand Defense www.ti.com/space-avionics-defense Microcontrollers microcontroller.ti.com Videoand Imaging www.ti.com/video RFID www.ti-rfid.com OMAP ApplicationsProcessors www.ti.com/omap TIE2E Community e2e.ti.com WirelessConnectivity www.ti.com/wirelessconnectivity MailingAddress:Texas Instruments,PostOfficeBox 655303,Dallas,Texas 75265 Copyright© 2013,Texas InstrumentsIncorporated