DS12W RECTRON | Alldatasheet

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Technical content

DESCRIPTION

Marking Code: DS12W ---S12 DS14W ---S14 DS16W ---S16 DS18W ---S18 DS110W ---S110 DS112W ---S112 DS115W ---S115 DS120W ---S120 Weight 17mg 0.0006 oz Simplified outline SOD-123F(L) and symbol 1 2 S 1 2 0 SURFACE MOUNT SCHOTTKY BARRIER RECTIFIER VOLTAGE RANGE 20 to 200 Volts CURRENT 1.0 Ampere MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS Ratings at 25 o C ambient temperature unless otherwise specified. Resistive or inductive load. DS120W THRU DS12W MAXIMUM RA TINGS (@ T A =25 O C unless otherwise noted)

ELECTRICAL CHARACTERISTICS

(@T A =25 O C unless otherwise noted) RATINGS Maximum Recurrent Peak Reverse Voltage Maximum RMS Voltage Maximum DC Blocking Voltage Maximum Average Forward Rectified Current Peak Forward Surge Current 8.3 ms single half sine-wave superimposed on rated load (JEDEC method) Typical Thermal Resistance (Note 1) Typical Junction Capacitance (Note 2) SYMBOL V RRM V DC I FSM C J T STG V RMS UNITS Volts Volts Volts Amps1.0 115 Amps C/W C Storage Temperature Range R JA I O pF Operating Temperature Range T J DS12W DS14W DS16W DS18W DS110W DS112W DS115W DS120W 20 40 60 80 100 120 150 200 -55 to + 150 C CHARACTERISTICS Maximum Average Reverse Current at Rated DC Blocking Voltage V F SYMBOL I R mA Maximum Instantaneous Forward Voltage at 1.0A DC Volts A = 25 o C A = 150 o C .55 mA UNITS .70

FEATURES

  • Metal silicon junction, majority carrier conduction * For surface mounted applications * Low power loss, high efficiency * High forward surge current capability * High surge capabitity * High reliability MECHANICAL DATA * Case: Molded plastic * Epoxy: Device has UL flammability classification 94V-O * Lead: MIL-STD-202E method 208C guaranteed * Mounting position: Any NOTES : 1. Thermal Resistance : Mounted on PCB. 2. Measured at 1 MHz and applied reverse voltage of 4.0 volts. Typical Current Square Time I T A S6.64 0.3 0.2 -55 to + 150 20 40 60 80 100 120 150 200 14 28 42 56 70 84 105 140 DS12W DS14W DS16W DS18W DS110W DS112W DS115W DS120W .85 110 0.1 2020-11/01 REV:C

Fig.1 Forward Current Derating Curve 0.2 0.4 0.6 0.8 1.0 1.2 0.0 25 50 75 100 150 200 FgarevA C rawroe ( nerrud ) At Ambient Temperature ( C) 0.01 100 100 Fig.6- Typical Transient Thermal Impedance neisnarTI amrehTt e cnadepml W/C t, Pulse Duration sec 0.1 1 10 1000 Fig.2 Typical Reverse Characteristics uoenatsnIC s nerru ( ) AmtesreveR 20 40 60 800 T= 2 5A C T =150A C Percent of Rated Peak Reverse Voltage 100 0.01 0.1 1.0 100 T= 7 5A C Fig.4 Typical Junction Capacitance 0.1 (cnaticapaCnoitcnuJ e) Fp Reverse Voltage (V) 100 200 500 1001 DS12W/DS14W DS16W-DS120W T= 2 5J C 10 100 Fig.5 Maximum Non-Repetitive Peak Forward Surage Current kae )P A( tnerruC egaruS drawroF Number of Cycles at 60Hz 8.3 ms Single Half Sine Wave (JEDEC Method) 0.1 0 0.4 1.4 Fig.3 Typical Forward Characteristic FuoenatsnI C drawros( nerru ) At Instaneous Forward Voltage (V) 1.0 DS12W~DS14W DS16W~DS18W DS110W~DS120W RATING AND CHARACTERISTICS CURVES (DS12W THRU DS120W)

Plastic surface mounted package; 2 leads A A C ğ$// 5281' VAM e UNIT mm max min mil max min 7.9 4.7 114 102 150 138 ACDE HE ğ 1.1 0.8 e Bottom View HE ğ$// 5281' E D E gpad pad TopView 0.9 0.7 g g The recommended mounting pad size 2.0 (79) 1.2 (47) mm (mil)Unit ˖ 1.2 (47) 1.2 (47)

  • • Recommended condition of flow soldering 2 to 5 min more than 1 min less than 10s 100°C 120°C 245°C 265°C Temperatur o eS f olderin ( g° C ) Preliminary Heating Soldering Cooling (in air) 100 150 200 250 300
  • Recommended condition of reflow soldering Recommended peak temperature is over 245 eC. If peak temperature is below 245 °C, you may adjust the following parameters; time length of peak temperature (longer), time length of soldering (longer), thickness of solder paste (thicker) Temperature: 350°C Time: 3s max. Times: one time
  • Condition of hand soldering
  • Remark: Lead free solder paste (96.5Sn/3.0Ag/0.5Cu) Temperatur o eS f olderin ( g° C ) Pre Heating Rate 1 to 5°C / s Preliminary Heating 130 to 170°C, 50 to 120s Soldering 230°C 20 to 30s Cooling more than 60s Reflow Heating Rate 1 to 5°C / s Peak Temperature 245 to 260°C, 10s max. 100 150 200 250 300 2 times max.

PACKAGING OF DIODE AND BRIDGE RECTIFIERS REEL PACK PACKAGE GROSS WEIGHT(Kg) EA PER REEL COMPONENT SPACE TAPE SPACE (mm) CARTON SIZE (mm) (mm) EA PER CARTON REEL DIA PACKING CODE (mm) EA PER BOX 15,000 INNER

Rectron Inc reserves the right to make changes without notice to any product specification herein, to make corrections, modifications, enhancements or other changes. Rectron Inc or anyone on its behalf assumes no responsibility or liabi- lity for any errors or inaccuracies. Data sheet specifications and its information contained are intended to provide a product description only. "Typical" paramet- ers which may be included on RECTRON data sheets and/ or specifications ca- n and do vary in different applications and actual performance may vary over ti- me. Rectron Inc does not assume any liability arising out of the application or use of any product or circuit. Rectron products are not designed, intended or authorized for use in medical, life-saving implant or other applications intended for life-sustaining or other rela- ted applications where a failure or malfunction of component or circuitry may di- rectly or indirectly cause injury or threaten a life without expressed written appr- oval of Rectron Inc. Customers using or selling Rectron components for use in such applications do so at their own risk and shall agree to fully indemnify Rect- ron Inc and its subsidiaries harmless against all claims, damages and expendit- ures. DISCLAIMER NOTICE