DRV5011_V01 TI1 | Alldatasheet
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B southnorth OUT 0 mT BOP VCC BRP BHYS DRV5011 VCC Controller VCC GND NS S S S N N N OUT GPIO Copyright © 2017, Texas Instruments Incorporated Product Folder Order Now T echnical Documents Tools & Software Support & Community An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. DRV5011 SLVSCY6B –DECEMBER 2017–REVISED JANUARY 2020 DRV5011Low-Voltage,Digital-LatchHallEffectSensor
1 Features
1• Ultra-small X2SON, SOT-23, DSBGA or TO-92 package
- High magnetic sensitivity: ±2 mT (typical)
- Robust hysteresis: 4 mT (typical)
- Fast sensing bandwidth: 30-kHz
- VCC operating range: 2.5-V to 5.5-V
- Push-pull CMOS output – Capable of 5-mA sourcing, 20-mA sinking
- Operating temperature: –40°C to +135°C
2 Applications
- Brushless dc motor sensors
- Incremental rotary encoding: – Brushed dc motor feedback – Motor speed (tachometer) – Mechanical travel – Fluid measurement – Knob turning – Wheel speed
- E-bikes
- Flow meters
3 Description
The DRV5011 device is a digital-latch Hall effect sensor designed for motors and other rotary systems. The device has an efficient low-voltage architecture that operates from 2.5 V to 5.5 V. The device is offered in standard SOT-23, low-profile X2SON, DSBGA and TO-92 packages. The output is a push- pull driver that requires no pullup resistor, enabling more compact systems. When a south magnetic pole is near the top of the package and the BOP threshold is exceeded, the device drives a low voltage. The output stays low until a north pole is applied and the BRP threshold is crossed, which causes the output to drive a high voltage. Alternating north and south poles are required to toggle the output, and integrated hysteresis separates BOP and BRP to provide robust switching. The device produces consistent performance across a wide ambient temperature range of –40°C to +135°C. Device Information(1) PART NUMBER PACKAGE BODY SIZE (NOM) DRV5011 DSBGA (4) 0.80 mm × 0.80 mm SOT-23 (3) 2.92 mm × 1.30 mm X2SON (4) 1.10 mm × 1.40 mm TO-92 (3) 4.00 mm × 3.15 mm (1) For all available packages, see the package option addendum at the end of the data sheet. Typical Schematic Magnetic Response
SLVSCY6B –DECEMBER 2017–REVISED JANUARY 2020 www.ti.com Product Folder Links: DRV5011 Submit Documentation Feedback Copyright © 2017–2020, Texas Instruments Incorporated Table of Contents
11.3 Receiving Notification of Documentation Updates 16
12 Mechanical, Packaging, and Orderable
4 Revision History
Changes from Revision A (April 2019) to Revision B Page Changes from Original (December 2017) to Revision A Page
- Added recommendation to limit power supply voltage variation to less than 50 mVPP to Power Supply
A B Not to scale GND NC VCC OUT
1 VCC
2 GND
3 OUT
1 V CC 2GND
3 GND
www.ti.com SLVSCY6B –DECEMBER 2017–REVISED JANUARY 2020 Product Folder Links: DRV5011 Submit Documentation FeedbackCopyright © 2017–2020, Texas Instruments Incorporated
5 Pin Configuration and Functions
4-Pin X2SON With Exposed Thermal Pad Top View 4-Pin DSBGA Top View 3-Pin TO-92 Top View Pin Functions PIN I/O DESCRIPTION NAME DSBGA SOT-23 X2SON TO-92 GND A1 3 2 2 — Ground reference NC A2 — 3 — — No-connect. This pin is not connected to the silicon. Leave this pin floating or tied to ground, and soldered to the board for mechanical support. OUT B2 2 4 3 O Push-pull CMOS output. Drives a VCC or ground level. VCC B1 1 1 1 — 2.5-V to 5.5-V power supply. TI recommends connecting this pin to a ceramic capacitor to ground with a value of at least 0.01 µF. Thermal Pad — — Thermal Pad — — Leave thermal pad floating or tied to ground, and soldered to the board for mechanical support.
SLVSCY6B –DECEMBER 2017–REVISED JANUARY 2020 www.ti.com Product Folder Links: DRV5011 Submit Documentation Feedback Copyright © 2017–2020, Texas Instruments Incorporated (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1) MIN MAX UNIT VCC Power-supply voltage VCC –0.3 5.5 V Power-supply voltage slew rate VCC Unlimited V/µs VO Output voltage OUT –0.3 VCC + 0.3 V IO Output current OUT –5 30 mA B Magnetic flux density Unlimited T TJ Operating junction temperature 140 °C TA Operating ambient temperature For SOT-23 (DBZ), X2SON (DMR) and TO- 92 (LPG) –40 135 For DSBGA (YBH) –40 125 Tstg Storage temperature –65 150 °C (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.2 ESD Ratings
V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±6000 V Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±750 (1) Device-sourced current is negative. Device-sunk current is positive.
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT VCC Power supply voltage VCC 2.5 5.5 V VO Output voltage OUT 0 VCC V IO Output current(1) OUT –5 20 mA TJ Operating junction temperature 140 °C TA Operating ambient temperature For SOT-23 (DBZ), X2SON (DMR) and TO-92 (LPG) –40 135 For DSBGA (YBH) -40 125
www.ti.com SLVSCY6B –DECEMBER 2017–REVISED JANUARY 2020 Product Folder Links: DRV5011 Submit Documentation FeedbackCopyright © 2017–2020, Texas Instruments Incorporated (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.
6.4 Thermal Information
THERMAL METRIC(1) DRV5011 UNITDBZ (SOT-23) DMR (X2SON) YBH (DSBGA) LPG (TO-92)
3 PINS 4 PINS 4 PINS 3 PINS
RθJA Junction-to-ambient thermal resistance 356 159 194.1 183.1 °C/W RθJC(top) Junction-to-case (top) thermal resistance 128 77 1.6 74.2 °C/W RθJB Junction-to-board thermal resistance 94 102 68 158.8 °C/W ψJT Junction-to-top characterization parameter 11.4 0.9 0.8 15.2 °C/W ψJB Junction-to-board characterization parameter 92 100 67.9 158.8 °C/W
6.5 Electrical Characteristics
for VCC = 2.5 V to 5.5 V, over operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT ICC Operating supply current 2.3 3 mA tON Power-on time (see Figure 10) 40 70 µs td Propagation delay time From change in B to change in OUT 13 25 µs VOH High-level output voltage IO = –1 mA VCC – 0.35 VCC – 0.1 V VOL Low-level output voltage IO = 20 mA 0.15 0.4 V
6.6 Magnetic Characteristics
for VCC = 2.5 V to 5.5 V, over operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT fBW Sensing bandwidth 30 kHz BOP Magnetic threshold operate point (see Figure 8) 0.6 2 3.8 mT BRP Magnetic threshold release point (see Figure 8) –3.8 –2 –0.6 mT BHYS Magnetic hysteresis: |BOP – BRP| 2 4 6 mT
6.7 Typical Characteristics
Figure 1. BOP vs Temperature Figure 2. BRP vs Temperature Figure 3. BOP vs VCC Figure 4. BRP vs VCC Figure 5. ICC vs Temperature
7 Detailed Description
7.1 Overview
previous state, whether low or high.
7.2 Functional Block Diagram
7.3 Feature Description
7.3.1 Magnetic Flux Direction
Figure 6. Direction of Sensitivity
The magnetic flux that travels from the bottom to the top of the package is considered positive in this data sheet. Figure 7. Flux Direction Polarity
7.3.2 Magnetic Response
Figure 8 shows the device functionality and hysteresis. Figure 8. Device Functionality
7.3.3 Output Driver
Figure 9 shows the device push-pull CMOS output that can drive a VCC or ground level. Figure 9. Push-Pull Output (Simplified)
7.3.4 Power-On Time
Figure 10. tON Definition
7.3.5 Hall Element Location
shows the tolerances and side-view dimensions. Figure 11. Hall Element Location
7.4 Device Functional Modes
The DRV5011 has one mode of operation that applies when the Recommended Operating Conditions are met.
6 Gate Drivers
8 Application and Implementation
validate and test their design implementation to confirm system functionality.
8.1 Application Information
effects, and magnet variation. Magnets generally produce weaker fields as temperature increases.
8.2 Typical Applications
8.2.1 BLDC Motor Sensors Application
Figure 12. BLDC Motor System
8.2.1.1 Design Requirements
For this design example, use the parameters listed in Table 1. Table 1. Design Parameters
8.2.1.2 Detailed Design Procedure
generate magnetic fields that apply forces to the permanent magnets on the rotor. Space the three Hall sensors across the printed-circuit board (PCB) so that they are 120 electrical degrees apart.
8.2.1.3 Application Curve
Figure 13. Phase Voltages and Hall Signals for 3-Phase BLDC Motor
8.2.2 Incremental Rotary Encoding Application
Figure 14. Incremental Rotary Encoding System
8.2.2.1 Design Requirements
For this design example, use the parameters listed in Table 2. Table 2. Design Parameters
8.2.2.2 Detailed Design Procedure
Incremental encoders are used on knobs, wheels, motors, and flow meters to measure relative rotary movement. Automotive Hall Sensor Rotary Encoder, uses a 66-pole magnet with changes every 2.7°. applying a stronger magnetic field that has peaks significantly higher than the maximum BOP.
8.2.2.3 Application Curve
has unique adjacent 2-bit states for clockwise and counterclockwise. Figure 15. Quadrature Output (2-Bit)
8.3 Dos and Don'ts
orientations when using a ring magnet. Figure 16. Correct and Incorrect Magnet Orientations
9 Power Supply Recommendations
source. TI recommends limiting the supply voltage variation to less than 50 mVPP.
10 Layout
10.1 Layout Guidelines
effect sensors within plastic or aluminum enclosures and sensing magnets on the outside is common practice.
10.2 Layout Examples
Figure 17. Layout Examples
SLVSCY6B –DECEMBER 2017–REVISED JANUARY 2020 www.ti.com Product Folder Links: DRV5011 Submit Documentation Feedback Copyright © 2017–2020, Texas Instruments Incorporated
11 Device and Documentation Support
11.1 Device Support
11.1.1 Development Support
For additional design reference, see the Automotive Hall Sensor Rotary Encoder TI design (TIDA-00480). TI also offers the following evaluation modules (EVMs) for the DRV5011:
- Texas Instruments, DRV5011 Ultra-Low Power, Digital-Latch Hall Effect Sensor Evaluation Module
- Texas Instruments, Breakout Adapter for SOT-23 and TO-92 Hall Sensor Evaluation
11.2 Documentation Support
11.2.1 Related Documentation
For related documentation see the following:
- DRV5011-5012EVM user's guide
- HALL-ADAPTER-EVM user's guide
11.3 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper right corner, click on Alert me to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document.
11.4 Community Resources
TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight from the experts. Search existing answers or ask your own question to get the quick design help you need. Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.
11.5 Trademarks
E2E is a trademark of Texas Instruments. All other trademarks are the property of their respective owners.
11.6 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
11.7 Glossary
SLYZ022 — TI Glossary. This glossary lists and explains terms, acronyms, and definitions.
12 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
www.ti.com 17-Jan-2020 Addendum-Page 1 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/Ball Finish (6) MSL Peak Temp (3) Op Temp (°C) Device Marking (4/5) Samples DRV5011ADDBZR ACTIVE SOT-23 DBZ 3 3000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 135 1AD DRV5011ADDBZT ACTIVE SOT-23 DBZ 3 250 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 135 1AD DRV5011ADDMRR ACTIVE X2SON DMR 4 3000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 135 1AD DRV5011ADDMRT ACTIVE X2SON DMR 4 250 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 135 1AD DRV5011ADLPG PREVIEW TO-92 LPG 3 1000 Green (RoHS & no Sb/Br) CU SN N / A for Pkg Type -40 to 135 11AD DRV5011ADLPGM PREVIEW TO-92 LPG 3 3000 Green (RoHS & no Sb/Br) CU SN N / A for Pkg Type -40 to 135 11AD DRV5011ADYBHR ACTIVE DSBGA YBH 4 3000 Green (RoHS & no Sb/Br) SAC396 Level-1-260C-UNLIM -40 to 125 A DRV5011ADYBHT ACTIVE DSBGA YBH 4 250 Green (RoHS & no Sb/Br) SAC396 Level-1-260C-UNLIM -40 to 125 A (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement. (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
www.ti.com 17-Jan-2020 Addendum-Page 2 (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant PACKAGE MATERIALS INFORMATION www.ti.com 16-Jan-2020 Pack Materials-Page 1
*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) DRV5011ADDBZR SOT-23 DBZ 3 3000 183.0 183.0 20.0 DRV5011ADDBZT SOT-23 DBZ 3 250 183.0 183.0 20.0 DRV5011ADDMRR X2SON DMR 4 3000 203.0 203.0 35.0 DRV5011ADDMRT X2SON DMR 4 250 203.0 203.0 35.0 DRV5011ADYBHR DSBGA YBH 4 3000 182.0 182.0 20.0 DRV5011ADYBHT DSBGA YBH 4 250 182.0 182.0 20.0 PACKAGE MATERIALS INFORMATION www.ti.com 16-Jan-2020 Pack Materials-Page 2
www.ti.com PACKAGE OUTLINE C0.4 MAX 0.16 0.10 0.4 TYP 0.4 TYP 4X 0.225 0.185 B E A D 4224051/A 11/2017 DSBGA - 0.4 mm max heightYBH0004 DIE SIZE BALL GRID ARRAY NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. BALL A1 CORNER SEATING PLANE BALL TYP 0.05 C A 1 2
0.015 C A B
B SCALE 12.000 D: Max = E: Max = 0.82 mm, Min = 0.784 mm, Min = 0.76 mm 0.724 mm
www.ti.com EXAMPLE BOARD LAYOUT 0.05 MIN0.05 MAX 4X ( 0.2) (0.4) TYP (0.4) TYP ( 0.2) SOLDER MASK OPENING ( 0.2) METAL 4224051/A 11/2017 DSBGA - 0.4 mm max heightYBH0004 DIE SIZE BALL GRID ARRAY NOTES: (continued) 3. Final dimensions may vary due to manufacturing tolerance considerations and also routing constraints. See Texas Instruments Literature No. SNVA009 (www.ti.com/lit/snva009). SOLDER MASK DETAILS NOT TO SCALE SYMM SYMM 1 2 A B LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE: 50X NON-SOLDER MASK DEFINED EXPOSED METAL SOLDER MASK OPENING SOLDER MASK DEFINED (PREFERRED) METAL UNDER SOLDER MASK EXPOSED METAL
www.ti.com EXAMPLE STENCIL DESIGN (0.4) TYP (0.4) TYP 4224051/A 11/2017 DSBGA - 0.4 mm max heightYBH0004 DIE SIZE BALL GRID ARRAY NOTES: (continued) 4. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. SYMM SYMM 1 2 A B SOLDER PASTE EXAMPLE BASED ON 0.075 mm THICK STENCIL SCALE: 50X METAL TYP
www.ti.com PACKAGE OUTLINE C TYP0.20 0.08 0.25 2.64 2.10
1.12 MAX
TYP0.10 0.01 3X 0.5 0.3 TYP0.6 0.2 1.9 0.95 TYP -80 A 3.04 2.80 B1.4 1.2 (0.95) SOT-23 - 1.12 mm max heightDBZ0003A SMALL OUTLINE TRANSISTOR 4214838/C 04/2017 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. Reference JEDEC registration TO-236, except minimum foot length.
0.2 C A B
0.1 C SCALE 4.000
www.ti.com EXAMPLE BOARD LAYOUT
0.07 MAX
0.07 MIN
3X (1.3) 3X (0.6) (2.1) 2X (0.95) (R0.05) TYP 4214838/C 04/2017 SOT-23 - 1.12 mm max heightDBZ0003A SMALL OUTLINE TRANSISTOR NOTES: (continued) 4. Publication IPC-7351 may have alternate designs. 5. Solder mask tolerances between and around signal pads can vary based on board fabrication site. SYMM LAND PATTERN EXAMPLE SCALE:15X PKG SOLDER MASK OPENING METAL UNDER SOLDER MASK SOLDER MASK DEFINED METALSOLDER MASK OPENING NON SOLDER MASK DEFINED (PREFERRED) SOLDER MASK DETAILS
www.ti.com EXAMPLE STENCIL DESIGN (2.1) 2X(0.95) 3X (1.3) 3X (0.6) (R0.05) TYP SOT-23 - 1.12 mm max heightDBZ0003A SMALL OUTLINE TRANSISTOR 4214838/C 04/2017 NOTES: (continued) 6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 7. Board assembly site may have different recommendations for stencil design. SOLDER PASTE EXAMPLE BASED ON 0.125 THICK STENCIL SCALE:15X SYMM PKG
www.ti.com PACKAGE OUTLINE C 4X 0.27 0.17 0.8±0.05 4X 0.25 0.15 0.6±0.05 0.05 0.00
0.4 MAX
2X 0.5 A 1.45 1.35 B 1.15 1.05 X2SON - 0.4 mm max heightDMR0004A PLASTIC SMALL OUTLINE - NO LEAD 4222825/A 03/2016 PIN 1 INDEX AREA SEATING PLANE 0.08 C 2 3 (OPTIONAL) PIN 1 ID
0.1 C B A
0.05 C EXPOSED THERMAL PAD SYMM SYMM NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance. SCALE 9.000
www.ti.com EXAMPLE BOARD LAYOUT
0.05 MIN
0.05 MAX
(0.6) (1.4) 4X (0.22) (0.8) ( ) VIA0.2 4X (0.4) (R ) TYP0.05 2X (0.5) X2SON - 0.4 mm max heightDMR0004A PLASTIC SMALL OUTLINE - NO LEAD 4222825/A 03/2016 SYMM 2 3 SYMM LAND PATTERN EXAMPLE SCALE:35X NOTES: (continued) 4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature number SLUA271 (www.ti.com/lit/slua271). 5. Vias are optional depending on application, refer to device data sheet. If all or some are implemented, recommended via locations are shown. It is recommended that vias under paste be filled, plugged or tented. SOLDER MASK OPENING SOLDER MASK METAL UNDER SOLDER MASK DEFINED METAL SOLDER MASK OPENINGSOLDER MASK DETAILS NON SOLDER MASK DEFINED (PREFERRED)
www.ti.com EXAMPLE STENCIL DESIGN 4X (0.22) 4X (0.4) (1.4) (0.76) (0.57) (R ) TYP0.05 2X (0.5) X2SON - 0.4 mm max heightDMR0004A PLASTIC SMALL OUTLINE - NO LEAD 4222825/A 03/2016 NOTES: (continued) 6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. SOLDER PASTE EXAMPLE BASED ON 0.1 mm THICK STENCIL EXPOSED PAD 5: 90% PRINTED SOLDER COVERAGE BY AREA SCALE:50X SYMM 2 3 SYMM METAL TYP
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