DRV3245A-Q1 TI1 | Alldatasheet
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PRODUCT□PREVIEW N-Channel MOSFETsMCU 3-Phase Gate Driver Protections Diagnostics 3-Channel CS Amplifiers M DRV3245-Q1 Copyright © 2016, Texas Instruments Incorporated 4.4 to 45 V EN_GATE PWM SPI nFAULT ADC Product Folder Sample & Buy T echnical Documents Tools & Software Support & Community An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCT PREVIEW Information. Product in design phase of development. Subject to change or discontinuance without notice. DRV3245A-Q1 SLVSDJ8 –APRIL 2016 DRV3245A-Q1Three-PhaseAutomotiveGateDriverWithThreeIntegratedCurrentShunt Amplifiers
1 Features
1• AEC-Q100 Qualified for Automotive Applications
- Ambient Operating Temperature Range: – Temperature Grade 1: –40°C to 125°C
- 4.4-V to 45-V Operating Voltage
- 1.25-A and 1-A Peak Gate Drive Currents
- Programmable High- and Low-Side Slew-Rate Control
- Charge-Pump Gate Driver for 100% Duty Cycle. Reverse protection FET supply
- Three Integrated Current-Shunt Amplifiers
- 3-PWM or 6-PWM Input Control up to 20 kHz
- Single PWM-Mode Commutation Capability
- Supports Both 3.3-V and 5-V Digital Interface
- Serial Peripheral Interface (SPI) for Device Settings and Fault Reporting
- Thermally-Enhanced 48-Pin HTQFP
- Protection Features: – Fault Diagnostics – DVDD, AVDD, PVDD voltage monitor – Clock monitor – SPI CRC – Analog Built in self test – Programmable Dead-Time Control – MOSFET Shoot-Through Prevention – MOSFET VDS Overcurrent Monitors – Gate-Driver Fault Detection – Overtemperature Warning and Shutdown
2 Applications
- Three-Phase BLDC and PMSM Motors
- Automotive BLDC Applications
3 Description
The DRV3245A-Q1 device is a gate driver IC for three-phase motor-drive applications. The device provides three high-accuracy and temperature compensated half-bridge drivers, each capable of driving a high-side and low-side N-channel MOSFET. A charge pump driver supports 100% duty cycle and low-voltage operation for cold crank situations. The device can tolerate load dump voltages up to 45 V. The DRV3245A-Q1 device includes three bidirectional current-shunt amplifiers for accurate low- side current measurements that support variable gain settings and an adjustable offset reference. The gate driver uses automatic handshaking when switching to prevent current shoot-through. The VDS of both the high-side and low-side MOSFETs is accurately sensed to protect the external MOSFETs from overcurrent conditions. The SPI provides detailed fault reporting, diagnostics, and device configurations such as gain options for the current shunt amplifier, individual MOSFET overcurrent detection, and gate-drive slew-rate control. Device Information (1) PART NUMBER PACKAGE BODY SIZE (NOM) DRV3245A-Q1 HTQFP (48) 7.00 mm × 7.00 mm (1) For all available packages, see the orderable addendum at the end of the data sheet. Simplified Schematic
PRODUCT□PREVIEW DRV3245A-Q1 SLVSDJ8 –APRIL 2016 www.ti.com Product Folder Links: DRV3245A-Q1 Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated
4 Device and Documentation Support
4.1 Documentation Support
For related documentation see the following:
- PowerPAD™ Thermally Enhanced Package, SLMA002
- PowerPAD™ Made Easy, SLMA004
- Sensored 3-Phase BLDC Motor Control Using MSP430, SLAA503
- Understanding IDRIVE and TDRIVE in TI Motor Gate Drivers, SLVA714.
4.2 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers. Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.
4.3 Trademarks
E2E is a trademark of Texas Instruments. All other trademarks are the property of their respective owners.
4.4 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.
4.5 Glossary
SLYZ022 — TI Glossary. This glossary lists and explains terms, acronyms, and definitions.
5 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
www.ti.com 28-Apr-2016 Addendum-Page 1 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/Ball Finish (6) MSL Peak Temp (3) Op Temp (°C) Device Marking (4/5) Samples DRV3245AQPHPRQ1 PREVIEW HTQFP PHP 48 TBD Call TI Call TI -40 to 125 DRV3245AQPHPTQ1 PREVIEW HTQFP PHP 48 TBD Call TI Call TI -40 to 125 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
www.ti.com 28-Apr-2016 Addendum-Page 2
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