DRV3233-Q1_V03 TI | Alldatasheet
Document overview
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Technical content
DRV3233-Q1 Automotive 24/12V Battery 3-Phase Gate Driver Unit With Accurate Current Sensing and Enhanced Diagnostics
1 Features
- AEC-Q100 qualified for automotive applications - Temperature options: – DRV3233EPHP: –40°C to +150°C, TA – DRV3233QPHP: –40°C to +125°C,TA
- Functional Safety-Compliant – Developed for functional safety applications – Documentation to aid ISO 26262 system design available – Systematic capability up to ASIL D targeted
- Three phase half-bridge gate driver – Drives six N-channel MOSFETs (NMOS) – 4.5 to 60V wide operating voltage range – Bootstrap architecture for high-side gate driver – Charge pump for 50mA average gate current – 100% PWM duty cycle support – Overdrive supply of external switches
- Smart Gate Drive architecture – 45-level configurable peak gate drive current up to 1000 / 2000mA (source / sink) – Three-step dynamic drive current control – Soft shutdown for power stage protection
- Low-side Current Sense Amplifier – Sub-1mV low input offset across temperature – 9-level adjustable gain
- SPI-based detailed configuration and diagnostics
- DRVOFF pin to disable driver independently
- High voltage wake up pin (nSLEEP)
- Multiple PWM interface options available – 6x, 3x, 1x PWM Modes – PWM over SPI
- Supports 3.3V, and 5V Logic Inputs
- Optional programmable OTP for reset settings
- Advanced and configurable protection features – Battery and power supply voltage monitors – Phase feedback comparator – MOSFET VDS and Rsense over current monitors – Analog Built-In-Self-Test, Clock monitors – Fault condition indicator pin
2 Applications
- 12V / 24V Automotive Motor-Control Applications – Electrical Power Steering and Steer-by-Wire – Electrical Mechanical Brake, Brake Boost Assist and Brake-by-Wire – Transmission and Shift-by-Wire – Automotive Pumps
3 Description
The DRV3233-Q1 is an integrated smart gate driver for 12V and 24V automotive three-phase BLDC applications. The device provides three half-bridge gate drivers, each capable of driving high-side and low-side N-channel power MOSFETs. The DRV3233- Q1 generates the correct gate drive voltages using an integrated bootstrap diode and a GVDD charge pump. The Smart Gate Drive architecture supports configurable peak gate drive current from 0.8mA up to 1A source and 2A sink. The DRV3233-Q1 can operate from a single power supply with a wide input range from 4.5 to 60V . A trickle charge pump enables 100% PWM duty cycle control, and provides overdrive supply voltage for external switches. The DRV3233-Q1 provides low-side current sense amplifiers to support resistor based low-side current sensing. The low offset of the amplifiers enables the system to obtain precise motor current measurement. A wide range of diagnostics and protection features integrated in the DRV3233-Q1 enable a robust motor drive system design and help eliminate the needs of external components. The highly configurable device response allows the device to be integrated seamlessly into a variety of system designs.
Package Information
PACKAGE(1) PACKAGE SIZE (NOM) (2) BODY SIZE (NOM) DRV3233-Q1 HTQFP (48) 9mm x 9mm 7mm × 7mm QFN (48) 7mm × 7mm 7mm × 7mm QFN (32)(3) 6mm × 4mm 6mm × 4mm (1) For all available packages, see the orderable addendum at the end of the data sheet. (2) The package size (length × width) is a nominal value and includes pins, where applicable. (3) Product preview only. Contact TI for more information. DRV3233-Q1 SLVSG18E – JANUARY 2021 – REVISED JANUARY 2026 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA.
PWM (6x/3x/1x) PWM_SYNC nFAULT Protection Current Sense Amplifiers N-Channel MOSFETs Current Sense Gate Drive M Current Sense 4.5 to 60V (abs max 65V) Smart Gate Drive Overdrive supplyDRVOFF 1 ~ 6 PWM generator Simplified Schematic DRV3233-Q1 SLVSG18E – JANUARY 2021 – REVISED JANUARY 2026 www.ti.com
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Product Folder Links: DRV3233-Q1
5 Mechanical, Packaging, and Orderable Information....4
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision D (December 2025) to Revision E (January 2026) Page Changes from Revision C (July 2025) to Revision D (December 2025) Page Changes from Revision B (March 2025) to Revision C (July 2025) Page Changes from Revision A (August 2024) to Revision B (July 2025) Page Changes from Revision * (September 2023) to Revision A (August 2024) Page www.ti.com DRV3233-Q1 SLVSG18E – JANUARY 2021 – REVISED JANUARY 2026 Copyright © 2026 Texas Instruments Incorporated Submit Document Feedback 3 Product Folder Links: DRV3233-Q1
5 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. DRV3233-Q1 SLVSG18E – JANUARY 2021 – REVISED JANUARY 2026 www.ti.com
4 Submit Document Feedback Copyright © 2026 Texas Instruments Incorporated
Product Folder Links: DRV3233-Q1
www.ti.com 6-Feb-2026 PACKAGING INFORMATION Orderable part number Status (1) Material type (2) Package | Pins Package qty | Carrier RoHS (3) Lead finish/ Ball material (4) MSL rating/ Peak reflow (5) Op temp (°C) Part marking (6) DRV3233EPHPRQ1 Active Production HTQFP (PHP) | 48 1000 | LARGE T&R Yes NIPDAU Level-3-260C-168 HR -40 to 150 DRV3233E DRV3233EPHPRQ1.A Active Production HTQFP (PHP) | 48 1000 | LARGE T&R Yes NIPDAU Level-3-260C-168 HR -40 to 150 DRV3233E DRV3233ERGZRQ1 Active Production VQFN (RGZ) | 48 4000 | LARGE T&R Yes NIPDAU Level-3-260C-168 HR -40 to 150 DRV3233 ERGZ Q1 DRV3233QPHPRQ1 Active Production HTQFP (PHP) | 48 1000 | LARGE T&R Yes NIPDAU Level-3-260C-168 HR -40 to 125 DRV3233Q DRV3233QPHPRQ1.A Active Production HTQFP (PHP) | 48 1000 | LARGE T&R Yes NIPDAU Level-3-260C-168 HR -40 to 125 DRV3233Q DRV3233QRGZRQ1 Active Production VQFN (RGZ) | 48 4000 | LARGE T&R Yes NIPDAU Level-3-260C-168 HR -40 to 150 DRV3233 QRGZ Q1 (1) Status: For more details on status, see our product life cycle. (2) Material type: When designated, preproduction parts are prototypes/experimental devices, and are not yet approved or released for full production. Testing and final process, including without limitation quality assurance, reliability performance testing, and/or process qualification, may not yet be complete, and this item is subject to further changes or possible discontinuation. If available for ordering, purchases will be subject to an additional waiver at checkout, and are intended for early internal evaluation purposes only. These items are sold without warranties of any kind. (3) RoHS values: Yes, No, RoHS Exempt. See the TI RoHS Statement for additional information and value definition. (4) Lead finish/Ball material: Parts may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two lines if the finish value exceeds the maximum column width. (5) MSL rating/Peak reflow: The moisture sensitivity level ratings and peak solder (reflow) temperatures. In the event that a part has multiple moisture sensitivity ratings, only the lowest level per JEDEC standards is shown. Refer to the shipping label for the actual reflow temperature that will be used to mount the part to the printed circuit board. (6) Part marking: There may be an additional marking, which relates to the logo, the lot trace code information, or the environmental category of the part. Multiple part markings will be inside parentheses. Only one part marking contained in parentheses and separated by a "~" will appear on a part. If a line is indented then it is a continuation of the previous line and the two combined represent the entire part marking for that device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. Addendum-Page 1
www.ti.com 6-Feb-2026 In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2
PACKAGE MATERIALS INFORMATION www.ti.com 7-Feb-2026 TAPE AND REEL INFORMATION Reel Width (W1) REEL DIMENSIONS A0B0K0WDimension designed to accommodate the component lengthDimension designed to accommodate the component thicknessOverall width of the carrier tapePitch between successive cavity centersDimension designed to accommodate the component width TAPE DIMENSIONSK0 P1B0WA0Cavity QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE Pocket QuadrantsSprocket HolesQ1Q1Q2Q2Q3Q3Q4Q4User Direction of Feed P1ReelDiameter *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION www.ti.com 7-Feb-2026 TAPE AND REEL BOX DIMENSIONS Width (mm) W LH *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) DRV3233EPHPRQ1 HTQFP PHP 48 1000 336.6 336.6 31.8 DRV3233ERGZRQ1 VQFN RGZ 48 4000 367.0 367.0 38.0 DRV3233QPHPRQ1 HTQFP PHP 48 1000 336.6 336.6 31.8 DRV3233QRGZRQ1 VQFN RGZ 48 4000 367.0 367.0 38.0 Pack Materials-Page 2
www.ti.com GENERIC PACKAGE VIEW Images above are just a representation of the package family, actual package may vary. Refer to the product data sheet for package details. VQFN - 1 mm max heightRGZ 48 PLASTIC QUADFLAT PACK- NO LEAD7 x 7, 0.5 mm pitch 4224671/A
www.ti.com PACKAGE OUTLINE C SEE TERMINAL DETAIL 48X 0.3 0.2 5.6 0.1 48X 0.5 0.3
1 MAX
(0.2) TYP 0.05 0.00 44X 0.5 5.5 2X 5.5
0.1 MIN
B 7.1 6.9 A 7.1 6.9 0.3 0.2 0.5 0.3 (0.05) VQFN - 1 mm max heightRGZ0048M PLASTIC QUAD FLATPACK - NO LEAD 4223578/A 03/2017 PIN 1 INDEX AREA 0.08 C SEATING PLANE 13 24 48 37 (OPTIONAL) PIN 1 ID 0.1 C A B 0.05 EXPOSED THERMAL PAD
49 SYMM
NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance. SCALE 1.900 DETAIL OPTIONAL TERMINAL TYPICAL A-A 25.000 SECTION A-A TYPICAL
www.ti.com EXAMPLE BOARD LAYOUT 10X (1.33)
0.07 MIN
0.07 MAX
48X (0.25) 48X (0.6) ( 0.2) TYP VIA 44X (0.5) (6.8) (6.8) (1.22) ( 5.6) (R0.05) TYP VQFN - 1 mm max heightRGZ0048M PLASTIC QUAD FLATPACK - NO LEAD 4223578/A 03/2017 SYMM 13 24 3748 SYMM LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE:12X NOTES: (continued) 4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature number SLUA271 (www.ti.com/lit/slua271). 5. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown on this view. It is recommended that vias under paste be filled, plugged or tented. SOLDER MASK OPENING METAL UNDER SOLDER MASK SOLDER MASK DEFINED EXPOSED METAL METAL SOLDER MASK OPENINGSOLDER MASK DETAILS NON SOLDER MASK DEFINED (PREFERRED) EXPOSED METAL
www.ti.com EXAMPLE STENCIL DESIGN 48X (0.6) 48X (0.25) 44X (0.5) (6.8) (6.8) 16X ( 1.13) (1.33) TYP (0.665 TYP) (R0.05) TYP (1.33) TYP (0.665) TYP VQFN - 1 mm max heightRGZ0048M PLASTIC QUAD FLATPACK - NO LEAD 4223578/A 03/2017 NOTES: (continued) 6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. SYMM METAL TYP SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL EXPOSED PAD 49 66% PRINTED SOLDER COVERAGE BY AREA UNDER PACKAGE SCALE:15X SYMM 13 24 3748
www.ti.com GENERIC PACKAGE VIEW This image is a representation of the package family, actual package may vary. Refer to the product data sheet for package details. TQFP - 1.2 mm max heightPHP 48 QUAD FLATPACK7 x 7, 0.5 mm pitch 4226443/A
www.ti.com PACKAGE OUTLINE C 48X 0.27 0.1744X 0.5 PIN 1 ID (0.13) TYP 0.15 0.05 0 -7 4X 5.5 9.2
8.8 TYP
5.00 4.23 0.75 0.453.80 3.13 4X (0.63) NOTE 5 B7.2 6.8 NOTE 3 A 7.2 6.8 NOTE 3 0.25 GAGE PLANE
1.2 MAX
(1) PLASTIC QUAD FLATPACK PowerPAD HTQFP - 1.2 mm max heightPHP0048P PLASTIC QUAD FLATPACK 4229139/A 10/2022 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0.15 mm per side. 4. Reference JEDEC registration MS-026. 5. Feature may not be present. TM PowerPAD is a trademark of Texas Instruments. 13 24 3748
0.08 C A B
0.08 A 16 DETAIL A TYPICAL SCALE 1.900 13 24 3748
www.ti.com EXAMPLE BOARD LAYOUT
0.05 MAX
ALL AROUND 0.05 MIN ALL AROUND (8.5) (8.5)44X (0.5) 48X (1.6) 48X (0.3) ( 0.2) TYP VIA (3.8) ( 6.5) NOTE 10 (R0.05) TYP (1.1 TYP) (1.1 TYP) (5) PowerPAD HTQFP - 1.2 mm max heightPHP0048P PLASTIC QUAD FLATPACK 4229139/A 10/2022 NOTES: (continued) 6. Publication IPC-7351 may have alternate designs. 7. Solder mask tolerances between and around signal pads can vary based on board fabrication site. 8. This package is designed to be soldered to a thermal pad on the board. See technical brief, Powerpad thermally enhanced package, 9. Vias are optional depending on application, refer to device data sheet. It is recommended that vias under paste be filled, plugged or tented. 10. Size of metal pad may vary due to creepage requirement. TM LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE:8X SYMM SYMM 48 37 13 24 SOLDER MASK DEFINED PAD METAL COVERED BY SOLDER MASK SEE DETAILS METAL SOLDER MASK OPENING NON SOLDER MASK DEFINED SOLDER MASK DETAILS EXPOSED METAL SOLDER MASK OPENING METAL UNDER SOLDER MASK SOLDER MASK DEFINED EXPOSED METAL
www.ti.com EXAMPLE STENCIL DESIGN (3.8) 44X (0.5) 48X (1.6) 48X (0.3) (R0.05) TYP (8.5) (8.5) (5) BASED ON
0.125 THICK
3.21 X 4.230.175 3.47 X 4.560.150 3.80 X 5.00 (SHOWN)0.125 4.25 X 5.590.1 SOLDER STENCIL OPENING STENCIL THICKNESS PowerPAD HTQFP - 1.2 mm max heightPHP0048P PLASTIC QUAD FLATPACK 4229139/A 10/2022 NOTES: (continued) 11. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 12. Board assembly site may have different recommendations for stencil design. TM SOLDER PASTE EXAMPLE EXPOSED PAD 100% PRINTED SOLDER COVERAGE BY AREA SCALE:8X SEE TABLE FOR DIFFERENT OPENINGS FOR OTHER STENCIL THICKNESSES BASED ON
0.125 THICK STENCIL
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