DRV2603 TI | Alldatasheet
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Copyright © 2016, Texas Instruments Incorporated Product Folder Sample & Buy T echnical Documents Tools & Software Support & Community Reference Design An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. DRV2603 SLOS754C –JUNE 2012–REVISED AUGUST 2016 DRV2603HapticDriveWithAuto-ResonanceDetectionforLinearResonanceActuators (LRA)
1 Features
1• Flexible Haptic/Vibra Driver – LRA (Linear Resonance Actuator) – ERM (Eccentric Rotating Mass)
- Auto Resonance Tracking for LRA – No Frequency Calibration Required – Automatic Drive Commutation – Automatic Braking Algorithm – Wide Input PWM Frequency Range
- Constant Vibration Strength Over Supply
- Automatic Input Level Translation
- 0% to 100% Duty Cycle Control Range
- Fast Start Up Time
- Differential Drive from Single-Ended Input
- Wide Supply Voltage Range of 2.5 V to 5.2 V
- Immersion TouchSense® 3000 Compatible
- 1.8-V Compatible, 5-V Tolerant Digital Pins
- Available in a 2 mm × 2 mm × 0.75 mm Leadless
2 Applications
- Mobile Phones and Tablets
- Watches and Wearable Technology
- Remote Controls, Mice, and Peripheral Devices
- Electronic Point of Sale (ePOS)
- Vibration Alerts and Notifications
- Touch-Enabled Devices
- Industrial Human-Machine Interfaces
3 Description
The DRV2603 is a haptic driver designed specifically to solve common obstacles in driving both Linear Resonance Actuator (LRA) and Eccentric Rotating Mass (ERM) haptic elements. The DRV2603 is designed for low latency, high efficiency, and more drive strength for actuators commonly used for tactile feedback in the portable market. LRA actuators typically have a narrow frequency band over which they have an adequate haptic response. This frequency window is typically ±2.5 Hz wide or less, so driving an LRA actuator presents a challenge. The DRV2603 solves this problem by employing auto resonance tracking, which automatically detects and tracks the LRA resonant frequency in real time. This means that any input PWM frequency within the input range (10 kHz to 250 kHz) will automatically produce the correct resonant output frequency. As an additional benefit, the DRV2603 implements an automatic braking algorithm to prevent LRA ringing at the end of waveforms, leaving the user with a crisp haptic sensation. For both ERM and LRA actuators, the automatic input level translation solves issues with low voltage PWM sources without adding additional external components, so if the digital I/O levels vary, the output voltage does not change. The DRV2603 also has supply correction that ensures no supply regulation is required for constant vibration strength, allowing an efficient, direct-battery connection. Device Information(1) PART NUMBER PACKAGE BODY SIZE (NOM) DRV2603 WQFN (10) 2.00 mm × 2.00 mm (1) For all available packages, see the orderable addendum at the end of the datasheet. DRV2603 Block Diagram
SLOS754C –JUNE 2012–REVISED AUGUST 2016 www.ti.com Product Folder Links: DRV2603 Submit Documentation Feedback Copyright © 2012–2016, Texas Instruments Incorporated Table of Contents
12.3 Receiving Notification of Documentation Updates 15
13 Mechanical, Packaging, and Orderable
4 Revision History
Changes from Revision B (September 2015) to Revision C Page
- Auto Resonance Engine for LRA, changed text From: "tracking range for LRA devices is 140 Hz to 140 Hz" To: Changes from Revision A (January 2014) to Revision B Page
- Added Pin Configuration and Functions section, ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device Changes from Original (June 2012) to Revision A Page
www.ti.com SLOS754C –JUNE 2012–REVISED AUGUST 2016 Product Folder Links: DRV2603 Submit Documentation FeedbackCopyright © 2012–2016, Texas Instruments Incorporated (1) I = Input, O = Output, P = Power
5 Pin Configuration and Functions
I/O/P(1) DESCRIPTION NAME NO. EN 1 I Device enable GND 5, 8, 10 P Supply ground LRA/ERM 3 I Mode selection. ERM = Low, LRA = High NC 4 I No Connection OUT+ 9 O Positive haptic driver differential output OUT– 6 O Negative haptic driver differential output PWM 2 I Input signal VDD 7 P Supply Input (2.5 V to 5.5 V) (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
6 Specifications
6.1 Absolute Maximum Ratings(1)
over operating free-air temperature range, TA = 25°C (unless otherwise noted) MIN MAX UNIT Supply voltage VDD –0.3 6 V VI Input voltage EN, PWM, LRA/ERM –0.3 VDD + 0.3 V TA Operating free-air temperature range –40 85 °C TJ Operating junction temperature range –40 150 °C Tstg Storage temperature range –65 150 °C (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.2 ESD Ratings
V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±500
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6.3 Recommended Operating Conditions
VDD Supply voltage VDD 2.5 5.2 V fPWM PWM Input frequency 10 250 kHz RL Load Impedance VDD = 5.2 V 8 Ω F0 Supported LRA frequency Auto resonance tracking range for LRA 140 220 Hz VIL Digital input low voltage EN, PWM, LRA/ERM 0.6 V VIH Digital input high voltage EN, PWM, LRA/ERM 1.2 V TA Operating free-air temperature range -40 85 °C (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.
6.4 Thermal Information
THERMAL METRIC(1) DRV2603 UNITRUN (WQFN)
10 PINS
RθJA Junction-to-ambient thermal resistance 153.7 °C/W RθJC(top) Junction-to-case (top) thermal resistance 86 °C/W RθJB Junction-to-board thermal resistance 70.4 °C/W ψJT Junction-to-top characterization parameter 1.3 °C/W ψJB Junction-to-board characterization parameter 70.4 °C/W
6.5 Electrical Characteristics
TA = 25°C, VDD = 3.6 V (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT |IIL| Digital input low current EN, PWM, LRA/ERM VDD = 5.0 V, VIN = 0 V 1 µA |IIH| Digital input high current EN VDD = 5.0 V, VIN = VDD 6 µA PWM, LRA/ERM VDD = 5.0 V, VIN = VDD 3 µA ISD Shut down current VEN = 0 V 0.3 3 µA IDDQ Quiescent current VEN = VDD, ERM Mode, 50% duty cycle input, No load 1.7 2.5 mA ROUT Output impedance in shutdown OUT+ to GND, OUT– to GND 15 kΩ tSU Start-up time Time from EN high to output signal 1.3 ms fSW PWM output frequency 19.5 20.3 21.5 kHz IBAT,AVG Average battery current during operation Duty Cycle = 100%, LRA Mode, Load = 25 Ω LRA 55 mADuty Cycle = 80%, ERM Mode, RL = 17 Ω, 2V rated ERM 59 RDS-HS Drain to source resistance, high-side 1.05 Ω RDS-LS Drain to source resistance, low-side 0.85 Ω VOUT Differential output voltage Duty Cycle = 100%, LRA Mode, Load = 25 Ω LRA 2.2 VRMS Duty Cycle = 100%, ERM Mode, RL = 20 Ω ERM 3.3 V Thermal threshold 145 °C Thermal Hysteresis 18 °C
6.6 Typical Characteristics
Figure 1. Startup Waveform Figure 2. LRA Full-Scale Drive Figure 3. LRA Click Figure 4. ERM Click Figure 5. LRA PWM Modulation Figure 6. ERM PWM Modulation
7 Parameter Measurement Information
7.1 Test Setup for Graphs
Characteristic figures. A 1st order, low-pass filter corner between 1 kHz and 3.5 kHz is recommended. Figure 7. Test Setup for Graphs
7.2 Alternate Test Setup
Figure 8. Alternate Test Setup
Copyright © 2016, Texas Instruments Incorporated DRV2603 www.ti.com SLOS754C –JUNE 2012–REVISED AUGUST 2016 Product Folder Links: DRV2603 Submit Documentation FeedbackCopyright © 2012–2016, Texas Instruments Incorporated
8 Detailed Description
8.1 Overview
The DRV2603 is a haptic and vibratory driver designed specifically to meet the needs of haptic and vibration applications in the portable market. The DRV2603 has two modes of operation, ERM mode and LRA mode. ERM mode is designed to drive Eccentric Rotating Mass motors, which are generally DC motors of the bar or coin type. LRA mode is designed to drive Linear Resonance Actuators, also known as linear vibrators, which require an alternating signal that commutates at or very near the natural mechanical resonance frequency of the actuator. These actuators present a unique control challenge that is solved in the DRV2603 by auto resonance tracking.
8.2 Functional Block Diagram
8.3 Feature Description
8.3.1 Supply Voltage Rejection for Constant Vibration Strength
The DRV2603 features power supply feedback, so no external supply regulation is required. If the supply voltage drifts over time (due to battery discharge, for example), the vibration strength will remain the same so long as there is enough supply voltage to sustain the required output voltage. The DRV2603 can be connected directly to the battery.
8.3.2 Low-Voltage Control Logic for Constant Vibration Strength
The PWM input uses a digital level-shifter, so as long as the input voltage meets the VIH and VIL levels, the vibration strength will remain the same even if the digital levels were to vary. These benefits apply to both ERM mode and LRA mode.
8.3.3 Thermal Protection
The DRV2603 has thermal protection that will shut down the device to prevent internal overheating. See the Specifications for typical over temperature thresholds.
8.3.4 Overcurrent Protection
8.3.5 Linear Resonance Actuators (LRA)
tracking auto-resonant algorithm critical when driving LRA to achieve consistent, optimized performance. Figure 9. Typical LRA Response
8.3.6 Auto Resonance Engine for LRA
8.3.7 Eccentric Rotating Mass Motors (ERM)
Figure 10. Reversal of Motor Direction
2.2 Vrms
1.1 Vrms
reversing the magnetic field of the driving coil(s).
8.3.8 Edge Rate Control
in mobile and portable platforms. Because of ERC, no output filter or ferrites are necessary.
8.4 Device Functional Modes
8.4.1 LRA Mode
therefore, no software changes are required when switching between ERMs and LRAs with the DRV2603. Figure 11. LRA Mode give a small amount of back-EMF during full scale vibration, and other LRA devices give a much larger amount. adjusted so that the relationship in the above equation will hold true regardless of the supply voltage.
8.4.2 ERM Mode
a wide input PWM frequency range. constructed at the output to precisely drive the motor. Figure 12. ERM Mode approximately 3.3 V. When driving a 10 Ω ERM at full-scale, the output voltage is approximately 3.0 V. The voltage seen at the outputs as a function of input duty cycle is given by this equation. duty cycle in ERM mode can be approximated by the following equation.
9 Application and Implementation
validate and test their design implementation to confirm system functionality.
9.1 Application Information
communication, button replacement, and tactile feedback for touch surface or screens. click, bumps, pulses, ramps and many more.
9.2 Typical Application
Figure 13. System Diagram for LRA
Figure 14. System Diagram for ERM
9.2.1 Design Requirements
This design assumes the values listed in Table 1. Table 1. Design Parameters
9.2.2 Detailed Design Procedure
9.2.2.1 Actuator Selection
component to consider when designing the system. The following can be used to select the minimum required supply voltage.
- Find the rated and/or maximum operating voltage in the actuator datasheet; some actuator datasheets may
only have the rated voltage listed.
- Using the larger of the rated and maximum operating voltage, add 250mV to get the minimum operating
voltage. Adding 250mV provides operating headroom to account for internal driver losses.
- Check the supply voltage to ensure that the desired output is achieved.
capability of the battery or voltage supply.
9.2.2.2 Power Supply Selection
the DRV2603 eliminates the need for a voltage regulator between the battery and VDD.
9.2.2.3 Sending a Haptic Effect
achieved by using the following steps.
- At or very near the same time, bring the EN pin high and start sourcing PWM waveform. No delays are
to 50 ms. Reference the specifications of the actuator for optimum overdrive characteristics.
- Change the PWM level as needed to achieve the desired effect.
- When the effect is complete, set the PWM duty cycle to 0% if braking is desired. The EN pin must remain
zero vibration, so no significant reverse-phase vibration will ever occur.
9.2.3 Application Curves
Figure 15. LRA Click Figure 16. ERM Click Figure 17. LRA PWM Modulation Figure 18. ERM PWM Modulation
10 Power Supply Recommendations
10.1 Decoupling Capacitor
operation of the output driver and the digital portion of the device.
11 Layout
11.1 Layout Guidelines
- The decoupling capacitor for the power supply should be placed close to the device pin (VDD).
- The supply ground should be connected to all GND pins
11.2 Layout Example
Figure 19 shows the recommended layout for the DRV2603. Figure 19. DRV2603 Layout Example
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12 Device and Documentation Support
12.1 Device Support
12.1.1 Development Support
The DRV2603 is featured in several TI Designs, available online at http://www.ti.com/general/docs/refdesignsearch.tsp. TI Designs are analog solutions created by TI’s applications experts and offer the theory of operation, component selection, simulation, complete PCB schematic and layout, bill of materials, and measured performance of many useful circuits.
- Haptics Enabled Gaming Controller Design - http://www.ti.com/tool/TIDM-LPBP-HAPTOUCH
- DRV2603 Capacitive Touch Evaluation Module - http://www.ti.com/tool/drv2603evm-ct
12.2 Documentation Support
12.2.1 Related Documentation
- Haptic Energy Consumption – SLOA194
- Benefits of LRA Auto-Resonance Tracking - SLOA188
- Haptics: Solutions for ERM and LRA Actuators - SSZB151
12.3 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper right corner, click on Alert me to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document.
12.4 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers. Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.
12.5 Trademarks
E2E is a trademark of Texas Instruments. TouchSense is a registered trademark of Immersion Corporation. All other trademarks are the property of their respective owners.
12.6 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.
12.7 Glossary
SLYZ022 — TI Glossary. This glossary lists and explains terms, acronyms, and definitions.
13 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
www.ti.com 17-Jun-2025 PACKAGING INFORMATION Orderable part number Status (1) Material type (2) Package | Pins Package qty | Carrier RoHS (3) Lead finish/ Ball material (4) MSL rating/ Peak reflow (5) Op temp (°C) Part marking (6) DRV2603RUNR Active Production QFN (RUN) | 10 3000 | LARGE T&R Yes NIPDAU Level-2-260C-1 YEAR -40 to 85 2603 DRV2603RUNR.A Active Production QFN (RUN) | 10 3000 | LARGE T&R Yes NIPDAU Level-2-260C-1 YEAR -40 to 85 2603 DRV2603RUNR.B Active Production QFN (RUN) | 10 3000 | LARGE T&R Yes NIPDAU Level-2-260C-1 YEAR -40 to 85 2603 DRV2603RUNRG4 Active Production QFN (RUN) | 10 3000 | LARGE T&R Yes NIPDAU Level-2-260C-1 YEAR -40 to 85 2603 DRV2603RUNRG4.A Active Production QFN (RUN) | 10 3000 | LARGE T&R Yes NIPDAU Level-2-260C-1 YEAR -40 to 85 2603 DRV2603RUNRG4.B Active Production QFN (RUN) | 10 3000 | LARGE T&R Yes NIPDAU Level-2-260C-1 YEAR -40 to 85 2603 DRV2603RUNT Active Production QFN (RUN) | 10 250 | SMALL T&R Yes NIPDAU Level-2-260C-1 YEAR -40 to 85 2603 DRV2603RUNT.A Active Production QFN (RUN) | 10 250 | SMALL T&R Yes NIPDAU Level-2-260C-1 YEAR -40 to 85 2603 DRV2603RUNT.B Active Production QFN (RUN) | 10 250 | SMALL T&R Yes NIPDAU Level-2-260C-1 YEAR -40 to 85 2603 (1) Status: For more details on status, see our product life cycle. (2) Material type: When designated, preproduction parts are prototypes/experimental devices, and are not yet approved or released for full production. Testing and final process, including without limitation quality assurance, reliability performance testing, and/or process qualification, may not yet be complete, and this item is subject to further changes or possible discontinuation. If available for ordering, purchases will be subject to an additional waiver at checkout, and are intended for early internal evaluation purposes only. These items are sold without warranties of any kind. (3) RoHS values: Yes, No, RoHS Exempt. See the TI RoHS Statement for additional information and value definition. (4) Lead finish/Ball material: Parts may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two lines if the finish value exceeds the maximum column width. (5) MSL rating/Peak reflow: The moisture sensitivity level ratings and peak solder (reflow) temperatures. In the event that a part has multiple moisture sensitivity ratings, only the lowest level per JEDEC standards is shown. Refer to the shipping label for the actual reflow temperature that will be used to mount the part to the printed circuit board. (6) Part marking: There may be an additional marking, which relates to the logo, the lot trace code information, or the environmental category of the part. Multiple part markings will be inside parentheses. Only one part marking contained in parentheses and separated by a "~" will appear on a part. If a line is indented then it is a continuation of the previous line and the two combined represent the entire part marking for that device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative Addendum-Page 1
www.ti.com 17-Jun-2025 and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2
PACKAGE MATERIALS INFORMATION www.ti.com 11-Jul-2025 TAPE AND REEL INFORMATION Reel Width (W1) REEL DIMENSIONS A0B0K0WDimension designed to accommodate the component lengthDimension designed to accommodate the component thicknessOverall width of the carrier tapePitch between successive cavity centersDimension designed to accommodate the component width TAPE DIMENSIONSK0 P1B0WA0Cavity QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE Pocket QuadrantsSprocket HolesQ1Q1Q2Q2Q3Q3Q4Q4User Direction of Feed P1ReelDiameter *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION www.ti.com 11-Jul-2025 TAPE AND REEL BOX DIMENSIONS Width (mm) W LH *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) DRV2603RUNR QFN RUN 10 3000 210.0 185.0 35.0 DRV2603RUNR QFN RUN 10 3000 213.0 191.0 35.0 DRV2603RUNRG4 QFN RUN 10 3000 210.0 185.0 35.0 DRV2603RUNT QFN RUN 10 250 213.0 191.0 35.0 DRV2603RUNT QFN RUN 10 250 210.0 185.0 35.0 Pack Materials-Page 2
www.ti.com GENERIC PACKAGE VIEW This image is a representation of the package family, actual package may vary. Refer to the product data sheet for package details. WQFN - 0.8 mm max heightRUN 10 PLASTIC QUAD FLATPACK - NO LEAD2 X 2, 0.5 mm pitch 4228249/A
www.ti.com PACKAGE OUTLINE 2.1 1.9 2.1 1.9 0.8 0.7 0.05 0.00 2X 1.5 6X 0.5 10X 0.6 0.4 10X 0.3 0.2 (0.2) TYP WQFN - 0.8 mm max heightRUN0010A PLASTIC QUAD FLATPACK - NO LEAD 4220470/A 05/2020 0.08 C
0.1 C A B
0.05 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. PIN 1 INDEX AREA SEATING PLANE PIN 1 ID SYMM SYMM SCALE 5.000 AB C
www.ti.com EXAMPLE BOARD LAYOUT 6X (0.5) (R0.05) TYP
0.07 MAX
0.07 MIN
10X (0.7) 10X (0.25) (1.7) (1.7) WQFN - 0.8 mm max heightRUN0010A PLASTIC QUAD FLATPACK - NO LEAD 4220470/A 05/2020 NOTES: (continued) 3. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature number SLUA271 (www.ti.com/lit/slua271). SYMM SYMM LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE: 20X SEE SOLDER MASK DETAIL METAL EDGE SOLDER MASK OPENING EXPOSED METAL METAL UNDER SOLDER MASK SOLDER MASK OPENING EXPOSED METAL NON SOLDER MASK DEFINED (PREFERRED) SOLDER MASK DEFINED SOLDER MASK DETAILS
www.ti.com EXAMPLE STENCIL DESIGN 10X (0.7) 10X (0.25) 6X (0.5) (1.7) (1.7) (R0.05) TYP WQFN - 0.8 mm max heightRUN0010A PLASTIC QUAD FLATPACK - NO LEAD 4220470/A 05/2020 NOTES: (continued) 4. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. SOLDER PASTE EXAMPLE BASED ON 0.125 MM THICK STENCIL SCALE: 20X SYMM SYMM
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