DRV1101 BURR-BROWN | Alldatasheet
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Technical content
HIGH POWER DIFFERENTIAL LINE DRIVER International Airport Industrial Park • Mailing Address: PO Box 11400, Tucson, AZ 85734 • Street Address: 6730 S. Tucson Blvd., Tucson, AZ 85706 • Tel: (520) 746-1111 • Twx: 910-952-1111 Internet: http://www.burr-brown.com/ • FAXLine: (800) 548-6133 (US/Canada Only) • Cable: BBRCORP • Telex: 066-6491 • FAX: (520) 889-1510 • Immediate Product Info: (800) 548-6132
DESCRIPTION
The DRV1101 is fixed gain differential line driver designed for very low distortion operation when driv- ing DSL line transformers. It is designed for use as the upstream line driver for ADSL G.Lite, and as both upstream and downstream line drivers in CAP sys- tems. Operating on a single 5V supply, the DRV1101 can supply up to 230mA peak output current. The output voltage can swing up to 9.5Vp-p on a single 5V supply. In ADSL G.Lite applications, DRV1101 can supply up to 10dBm average line power with a crest factor of 5.3 for a peak line power delivered of approximately 25dBm. It is packaged in a 8-lead SOIC.
FEATURES
l HIGH OUTPUT CURRENT: 230mA l SINGLE SUPPLY OPERATION: 5V l 10MHz BANDWIDTH: 6Vp-p into 15Ω l VERY LOW THD AT HIGH POWER: –81dBc at 6Vp-p, 100kHz, 100Ω l FIXED DIFFERENTIAL GAIN: 3V/V
APPLICATIONS
l DSL TWISTED PAIR LINE DRIVER l COMMUNICATIONS LINE DRIVER l TWISTED-PAIR CABLE DRIVER © 1998 Burr-Brown Corporation PDS-1462A Printed in U.S.A. July, 1998 DRV1101 In+ In– Out+ +5V G = 3V/V DRV1101 Patent Pending GND Out– 4Ω Protection 1:3.3 Transformer 100Ω SBWS009
PARAMETER CONDITIONS MIN TYP MAX UNITS AC PERFORMANCE –3dB Bandwidth R L = 15Ω , VO = 1Vp-p 24 MHz R L = 100Ω , VO = 1Vp-p 42 MHz R L = 15Ω , VO = 6Vp-p 17 MHz R L = 100Ω , VO = 6Vp-p 23 MHz Slew Rate R L = 100Ω , VO = 6Vp-p 100 V/ µs Step Response Delay(2) VO = 1Vp-p 25 ns Settling Time to 1%, Step Input V O = 1Vp-p, RL = 100Ω 0.12 µs Settling Time to 1%, Step Input V O = 6Vp-p, RL = 100Ω 0.13 µs Settling Time to 0.1%, Step Input V O = 1Vp-p, RL = 100Ω 0.30 µs Settling Time to 0.1%, Step Input V O = 6Vp-p, RL = 100Ω 0.32 µs THD, Total Harmonic Distortion f = 10kHz R L = 100Ω , VO = 6Vp-p –88 dB f = 10kHz R L = 15Ω , VO = 6Vp-p –85 dB f = 100kHz R L = 100Ω , VO = 6Vp-p –83 dB f = 100kHz R L = 15Ω , VO = 6Vp-p –66 –71 dB Input Voltage Noise f = 100kHz 30 nV/ √Hz Input Current Noise f = 100kHz 0.5 fA/ √Hz INPUT Differential Input Resistance 109 Ω Differential Input Capacitance 1p F Common-Mode Input Resistance 109 Ω Common-Mode Input Capacitance 6p F Input Offset Voltage 3m V Input Bias Current 1n A Common-Mode Rejection Ratio Input Referred 46 dB Power Supply Rejection Ratio Input Referred 55 76 dB Input Common-Mode Voltage Range OUTPUT Differential Output Offset, RTO ±10 ±30 mV Differential Output Offset Drift, RTO –40 °C to +85°C3 0 µV/°C Differential Output Resistance 0.16 Ω Peak Current (Continuous) R L = 15Ω 200 230 mA Differential Output Voltage Swing(5) R L = 1kΩ 9.8 Vp-p R L = 100Ω 8.5 9.7 Vp-p R L = 15Ω 7.0 Vp-p Gain Fixed Gain, Differential 3.1 V/V Gain Error ±0.25 dB POWER SUPPLY Operating Voltage Range 4.5 5.0 5.5 V Quiescent Current V DD = 5.0V 25 38 mA TEMPERATURE RANGE –40 +85 °C Thermal Resistance, θJA 8-Pin SOIC 125 °C/W NOTES: (1) Measurement Bandwidth = 500kHz. (2) Time from 50% point of input step to 50% point of output step. (3) For step input. (4) Output common-mode voltage follows input common-mode voltage; therefore, if input VCM = VDD /2, then output VCM = VDD /2. (5) THD = 1%. SPECIFICATIONS Typical at 25°C, VCM = VDD /2, VDD = +5.0V, unless otherwise specified. The information provided herein is believed to be reliable; however, BURR-BROWN assumes no responsibility for inaccuracies or omissions. BURR-BROWN assumes no responsibility for the use of this information, and all use of such information shall be entirely at the user’s own risk. Prices and specifications are subject to change without notice. No patent rights or licenses to any of the circuits described herein are implied or granted to any third party. BURR-BROWN does not authorize or warrant any BURR-BROWN product for use in life support devices and/or systems.
±10mA, Continuous ABSOLUTE MAXIMUM RATINGS PACKAGE/ORDERING INFORMATION PACKAGE DRAWING PRODUCT PACKAGE NUMBER (1) DRV1101U SO-8 Surface Mount 182 NOTE: (1) For detailed drawing and dimension table, please see end of data sheet, or Appendix C of Burr-Brown IC Data Book. ELECTROSTATIC DISCHARGE SENSITIVITY This integrated circuit can be damaged by ESD. Burr-Brown recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. In+ 2 8In– Out+ +5V GND Out– GND In+ In– GND Out– VDD (+5V) VDD (+5V) Out+
FIGURE 5. AC-Coupled Differential Input Interface.FIGURE 4. Junction Temperature Rise From Ambient for junction for loads of 15Ω and 100Ω . determine four performance requirements.
- They bias the inputs at the supply midpoint.
- They provide a DC bias current path for the input of the DRV1101.
- They set the AC input impedance of the circuit to approxi- mately 1MΩ .
- They set the low cutoff frequency along with C B . The bias resistors maybe set to a lower level if a lower input impedance is desired. R L1M Ω C B C B 1M Ω 100kΩ 100kΩ 0.01µF 0 0.5 1 1.5 INTERNAL TEMPERATURE RISE OF DRV1101 Temperature Rise Load Voltage (rms) 2 2.5 3 3.5 R L = 15Ω Limit at 85°C Ambient R L = 100Ω
Orderable Device Status(1) Package Type Package Drawing Pins Package Qty Eco Plan(2) Lead/Ball FinishMSL Peak Temp (3) DRV1101U ACTIVE SOIC D 8 100 None CU NIPDAU Level-2-220C-1 YEAR DRV1101U/2K5 ACTIVE SOIC D 8 2500 None CU NIPDAU Level-2-220C-1 YEAR (1)The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2)Eco Plan - May not be currently available - please checkhttp://www.ti.com/productcontentfor the latest availability information and additional product content details. None: Not yet available Lead (Pb-Free). Pb-Free (RoHS):TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Green (RoHS & no Sb/Br):TI defines "Green" to mean "Pb-Free" and in addition, uses package materials that do not contain halogens, including bromine (Br) or antimony (Sb) above 0.1% of total product weight. (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDECindustry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. PACKAGE OPTION ADDENDUM www.ti.com 21-Jan-2005 Addendum-Page 1
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