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In– Out+ +5V G = 3V/V DRV1100 Patent Pending GND Out– 4Ω Protection 1:4 Transformer 135Ω HIGH POWER DIFFERENTIAL DRIVER AMPLIFIER OPA658 DRV1100 DRV1100 International Airport Industrial Park • Mailing Address: PO Box 11400, Tucson, AZ 85734 • Street Address: 6730 S. Tucson Blvd., Tucson, AZ 85706 • Tel: (520) 746-1111 • Twx: 910-952-1111 Internet: http://www.burr-brown.com/ • FAXLine: (800) 548-6133 (US/Canada Only) • Cable: BBRCORP • Telex: 066-6491 • FAX: (520) 889-1510 • Immediate Product Info: (800) 548-6132
DESCRIPTION
The DRV1100 is fixed gain differential line driver designed for very low harmonic distortion at the high powers required of xDSL line interface standards. Operating on a single +5V supply, it can deliver 230mA peak output current and 9.5Vp-p differential output voltage swing. This high output power on a single +5V supply makes the DRV1100 an excellent choice for the xDSL applications that require up to 17dBm power onto the line with high crest factors. The DRV1100 is available in both 8-pin plastic DIP and SO-8 packages.
FEATURES
l HIGH OUTPUT CURRENT: 230mA l SINGLE SUPPLY OPERATION: 5V l 5MHz BANDWIDTH: 6Vp-p into 15Ω l VERY LOW THD AT HIGH POWER: –72dBc at 6Vp-p, 100kHz, 100Ω l LOW QUIESCENT CURRENT: 11mA l FIXED DIFFERENTIAL GAIN: 3V/V
APPLICATIONS
l xDSL TWISTED PAIR LINE DRIVER l COMMUNICATIONS LINE DRIVER l TRANSFORMER DRIVER l SOLENOID DRIVER l HIGH POWER AUDIO DRIVER l CRT YOKE DRIVER © 1996 Burr-Brown Corporation PDS-1354 Printed in U.S.A. December, 1996 SBWS004
DRV1100P, U PARAMETER CONDITIONS MIN TYP MAX UNITS AC PERFORMANCE –3dB Bandwidth R L = 15Ω , VO = 1Vp-p 8 MHz R L ≥ 100Ω , VO = 1Vp-p 11 MHz R L = 15Ω , VO = 6Vp-p 5 MHz R L ≥ 100Ω , VO = 6Vp-p 6 MHz Differential Slew Rate R L = 100Ω , VO = 6Vp-p 80 V/ µs Step Response Delay(1) VO = 1Vp-p 25 ns Settling Time to 1%, Step Input V O = 1Vp-p, RL = 100Ω 0.25 µs Settling Time to 1%, Step Input V O = 6Vp-p, RL = 100Ω 0.3 µs Settling Time to 0.1%, Step Input V O = 1Vp-p, RL = 100Ω 0.8 µs Settling Time to 0.1%, Step Input V O = 6Vp-p, RL = 100Ω 1.1 µs THD, Total Harmonic Distortion(2) f = 10kHz R L = 100Ω , VO = 6Vp-p –85 dBc f = 10kHz R L = 15Ω , VO = 6Vp-p –66 –76 dBc f = 100kHz R L = 100Ω , VO = 6Vp-p –72 dBc f = 100kHz R L = 15Ω , VO = 6Vp-p –65 dBc Input Voltage Noise f = 100kHz 30 nV/ √Hz Input Current Noise f = 100kHz 0.5 fA/ √Hz INPUT CHARACTERISTICS Differential Input Resistance 1011 Ω Differential Input Capacitance 1p F Common-Mode Input Resistance 1011 Ω Common-Mode Input Capacitance 6p F Input Offset Voltage 5m V Input Bias Current 1p A Common-Mode Rejection Ratio Input Referred 62 dB Power Supply Rejection Ratio Input Referred 60 76 dB Input Common-Mode Voltage Range OUTPUT CHARACTERISTICS Differential Output Offset, RTO 10 25 mV Differential Output Offset Drift, RTO –40 °C to +85°C3 0 µV/°C Differential Output Resistance 0.16 Ω Peak Current (Continuous) R L = 15Ω 200 230 mA Differential Output Voltage Swing R L = 1kΩ 9.6 Vp-p R L = 100Ω 8.5 9.5 Vp-p R L = 15Ω 6.0 6.6 Vp-p Output Voltage Swing, Each Side R L = 1kΩ 0.125 4.875 V Gain Fixed Gain, Differential 3 V/V Gain Error ±0.25 dB POWER SUPPLY Operating Voltage Range +4.5 +5.0 +5.5 V Quiescent Current V DD = 5.0V +11 +16 mA TEMPERATURE RANGE –40 +85 °C Thermal Resistance, θJA DRV1100P 8-Pin DIP 100 °C/W DRV1100U 8-Pin SO-8 125 °C/W NOTES: (1) Time from 50% point of input step to 50% point of output step. (2) Measurement Bandwidth = 500kHz. (3) Output common-mode voltage follows input common-mode voltage; therefore, if input VCM = VDD /2, then output VCM = VDD /2. SPECIFICATIONS At VDD = +5.0V, VCM = VDD /2, TA = 25°C, unless otherwise specified. The information provided herein is believed to be reliable; however, BURR-BROWN assumes no responsibility for inaccuracies or omissions. BURR-BROWN assumes no responsibility for the use of this information, and all use of such information shall be entirely at the user’s own risk. Prices and specifications are subject to change without notice. No patent rights or licenses to any of the circuits described herein are implied or granted to any third party. BURR-BROWN does not authorize or warrant any BURR-BROWN product for use in life support devices and/or systems.
±10mA, Continuous ABSOLUTE MAXIMUM RATINGS In+ 2 8In– Out+ +5V GND Out– PACKAGE/ORDERING INFORMATION PACKAGE DRAWING PRODUCT PACKAGE NUMBER (1) DRV1100P 8-Pin PDIP 006 DRV1100U 8-Lead SO-8 182 NOTE: (1) For detailed drawing and dimension table, please see end of data sheet, or Appendix C of Burr-Brown IC Data Book. ELECTROSTATIC DISCHARGE SENSITIVITY This integrated circuit can be damaged by ESD. Burr-Brown recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. GND In+ In– GND Out– VDD (+5V) VDD (+5V) Out+
TYPICAL PERFORMANCE CURVES At VDD = +5.0V, VCM = VDD /2, TA = 25°C, unless otherwise specified. –40 –45 –50 –55 –60 –65 –70 –75 –80 100K SMALL SIGNAL 2ND HARMONIC DISTORTION 2nd Harmonic (dB) Frequency (Hz) 1M 10M R L = 15Ω VO = 1Vp-p R L = 100Ω –40 –45 –50 –55 –60 –65 –70 –75 –80 100K SMALL SIGNAL 3RD HARMONIC DISTORTION 3rd Harmonic (dB) Frequency (Hz) 1M 10M VO = 1Vp-p R L = 100Ω R L = 15Ω –40 –45 –50 –55 –60 –65 –70 –75 –80 100K LARGE SIGNAL 2ND HARMONIC DISTORTION 2nd Harmonic (dB) Frequency (Hz) 1M 10M R L = 15Ω VO = 6Vp-p R L = 100Ω –40 –45 –50 –55 –60 –65 –70 –75 –80 100K LARGE SIGNAL 3RD HARMONIC DISTORTION 3rd Harmonic (dB) Frequency (Hz) 1M 10M VO = 6Vp-p R L = 100Ω R L = 15Ω 9.5 8.5 7.5 6.5 5.5 4.5 3.5 2.5 1.5 10K 100K SMALL SIGNAL FREQUENCY RESPONSE Differential Gain (dB) Frequency (Hz) 1M 10M R L = 1kΩ R L = 100Ω R L = 15Ω VO = 1Vp-p 9.5 8.5 7.5 6.5 5.5 4.5 3.5 2.5 1.5 10K 100K LARGE SIGNAL FREQUENCY RESPONSE Differential Gain (dB) Frequency (Hz) 1M 10M R L = 1kΩ R L = 100Ω R L = 15Ω VO = 6Vp-p
TYPICAL PERFORMANCE CURVES (CONT) At VDD = +5.0V, VCM = VDD /2, TA = 25°C, unless otherwise specified. –40 –50 –60 –70 –80 –90 12 3 4 10kHz THD THD (dBc) Differential Output Voltage (Vp-p) 56 7 8 9 1 0 R L = 15Ω R L = 100Ω R L = 1kΩ –40 –50 –60 –70 –80 –90 12 3 4 100kHz THD THD (dBc) Differential Output Voltage (Vp-p) 56 7 8 9 1 0 R L = 15Ω R L = 100Ω R L = 1kΩ +0.5V –0.5V SMALL SIGNAL STEP RESPONSE Differential Voltage (125mV/div) Time (50ns/div) Output Input R L = 100Ω +3V –3V LARGE SIGNAL STEP RESPONSE Differential Voltage (750mV/div) Time (50ns/div) Output Input R L = 100Ω MAXIMUM V O vs SUPPLY VOLTAGE Differential Output Voltage (Vp-p) Supply Voltage (VDD ) 4.5 4.75 5 5.25 5.5 R L = 100Ω R L = 1kΩ R L = 15Ω 10K1K 100K LARGE SIGNAL OPERATING RANGE Differential Output Swing (Vp-p) Frequency (Hz) 1M 10M R L = 15Ω R L = 1kΩ R L = 100Ω1% THD
TYPICAL PERFORMANCE CURVES (CONT) At VDD = +5.0V, VCM = VDD /2, TA = 25°C, unless otherwise specified. 1000 100 DIFFERENTIAL INPUT VOLTAGE NOISE Voltage Noise (nV/√Hz) Frequency (Hz) 100 1K 10K 100K 1M 0.1 DIFFERENTIAL OUTPUT IMPEDANCE Impedance (Ω ) Frequency 1k 10K 100K 1M 10M –40 –20 0 20 40 60 80 100 QUIESCENT CURRENT vs TEMPERATURE Quiescent Current (mA) Temperature (°C) VDD = +5V 10K1K 100K POWER SUPPLY REJECTION vs FREQUENCY PSRR (dB) Frequency (Hz) 1M 10M
Orderable Device Status(1) Package Type Package Drawing Pins Package Qty Eco Plan(2) Lead/Ball FinishMSL Peak Temp (3) DRV1100U NRND SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR DRV1100U/2K5 NRND SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR DRV1100U/2K5G4 NRND SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR DRV1100UG4 NRND SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR (1)The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2)Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontentfor the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS):TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt):This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br):TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. PACKAGE OPTION ADDENDUM www.ti.com 11-Nov-2008 Addendum-Page 1
*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) A0 (mm) B0 (mm) K0 (mm) P1 (mm) W (mm) Pin1 Quadrant PACKAGE MATERIALS INFORMATION www.ti.com 11-Mar-2008 Pack Materials-Page 1
*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) DRV1100U/2K5 SOIC D 8 2500 346.0 346.0 29.0 PACKAGE MATERIALS INFORMATION www.ti.com 11-Mar-2008 Pack Materials-Page 2
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