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Technical content

High power density, high efficiency, low profile shielded drum core power inductors Product features

  • Low profile surface mount inductor
  • 12.5 mm x 12.5 mm x 4.5 mm shielded drum core
  • Inductance range from 0.47 µH to 1000 µH
  • Current range from 0.44 A to 24.4 A
  • Frequency range up to 1 MHz
  • Ferrite core material

Applications

  • Notebook power
  • LCD panels
  • Desktop and servers
  • DVD players and portable power devices
  • DC-DC Converters
  • Buck, boost, forward, and resonant converters
  • Noise filtering and filter chokes Environmental Data
  • Storage temperature range (Component): -40 °C to +125 °C
  • Operating temperature range: -40 °C to +125 °C (ambient plus self-temperature rise)
  • Solder reflow temperature: J-STD-020 (latest revision) compliant Pb HALOGEN HFFREE

www.eaton.com/electronics DR124 High power density, high efficiency, low profile shielded drum core power inductors Technical Data 4141 Effective March 2019 Product specifications 1. Open Circuit Inductance Test Parameters: 100 kHz, 0.25 V, 0.0 Adc. 2. Irms: DC current for an approximate ∆T of 40 °C without core loss. Derating is necessary for AC currents. PCB layout, trace thickness and width, air-flow, and proximity of other heat generating components will affect the temperature rise. It is recommended that the temperature of the part not exceed + 125 °C under worst case operating conditions verified in the end application. 3. Isat Amps peak for approximately 25% rolloff (@ +25 °C). 4. K-factor: Used to determine B p-p for core loss (see graph). Bp-p = K*L*∆I, Bp-p (mT), K: (K factor from table), L: (Inductance in μH), ∆I (Peak to peak ripple current in Amps). 5. Part Number Definition: DR124-xxx-R - DR124 = Product code and size; -xxx = Inductance value in uH; - R = decimal point; If no R is present, third character = # of zeros. - “-R” suffix = RoHS compliant Part Number Rated Inductance (μH) OCL1 μH±20% Irms (A) Isat (A) DCR mΩ @20°C Typ DCR mΩ @ +20°C Max K-factor4

www.eaton.com/electronics DR124 High power density, high efficiency, low profile shielded drum core power inductors Dimensions- mm Packaging- mm Dimensions are in millimeters. Do not route traces or vias underneath the inductor. wwlly = Date code, R = Revision level. 12.50 Max 4.5 Max DR124-### wwllyy R SCHEMATIC BOTTOM VIEW 5.00 Typ 2.05 Typ. 1 12.50 Max FRONT VIEW TOP VIEW 5.50 3.85 13.8 RECOMMENDED PCB LAYOUT 1 2 DR124-### wwllyy R 4.0 Ko=5.2 mm B1=10 mm A1=10mm Bo=13.2 mm Ao=13.2 mm Bo Ko SECTION A-A 1.5 dia +0.1/-0.0 1.5 dia min A 1.75 A User direction of feed 24.0 Ao 12.6 16.0 Parts packaged on 13" Diameter reel, 750 parts per reel. Temperature rise vs. total loss 120 100 0 0.4 0.8 1.2 1.6 2 Total Power Loss (W) Temperature Rise (°C)

www.eaton.com/electronics Technical Data 4141 Effective March 2019 Core loss vs. Bp-p DR124 High power density, high efficiency, low profile shielded drum core power inductors Inductance characteristics 100 500 kHz

1 MHz 300 kHz

0.1 0.01 0.001 0.0001 1 10 100 1000 Bp-p (mT) Core Loss (W) OCL vs. Isat 120.0 100.0 -40 °C 80.0 +25 °C 60.0 40.0 +85 °C 20.0 0.0 % Isat % OCL

© 2019 Eaton All Rights Reserved Printed in USA Publication No. 4141 BU-SB14114 March 2019 Eaton is a registered trademark. All other trademarks are property of their respective owners. Technical Data 4141 Effective March 2019 Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also reserves the right to change or update, without notice, any technical information contained in this bulletin. Eaton Electronics Division

1000 Eaton Boulevard

Cleveland, OH 44122 United States www.eaton.com/electronics Temperature t tP ts TC -5°C Time 25°C to Peak Time 25°C Tsmin Tsmax TL TP Preheat A Max. Ramp Up Rate = 3°C/s Max. Ramp Down Rate = 6°C/s Solder reflow profile Reference JDEC J-STD-020 Profile Feature Standard SnPb Solder Lead (Pb) Free Solder Preheat and Soak • Temperature min. (Tsmin) 100°C 150°C

  • Temperature max. (Tsmax) 150°C 200°C
  • Time (Tsmin to Tsmax) (ts) 60-120 Seconds 60-120 Seconds Average ramp up rate Tsmax to Tp 3°C/ Second Max. 3°C/ Second Max. Liquidous temperature (Tl) Time at liquidous (tL) 183°C 60-150 Seconds 217°C 60-150 Seconds Peak package body temperature (TP)* Table 1 Table 2 Time (tp) within 5 °C of the specified classification temperature (T c) 20 Seconds 30 Seconds** Average ramp-down rate (Tp to Tsmax) 6°C/ Second Max. 6°C/ Second Max. Time 25°C to Peak Temperature 6 Minutes Max. 8 Minutes Max. * Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum. ** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum. Table 1 - Standard SnPb Solder (Tc) Package Thickness Volume mm3 <350 Volume mm3 ≥350 ≥2.5mm 220°C 220°C Table 2 - Lead (Pb) Free Solder (Tc) Package Thickness Volume mm3 <350 Volume mm3 350 - 2000 Volume mm3 >2000 <1.6mm 260°C 260°C 260°C 1.6 – 2.5mm 260°C 250°C 245°C >2.5mm 250°C 245°C 245°C DR124 High power density, high efficiency, low profile shielded drum core power inductors