DMT8012LPS

Document overview

  • Manufacturer or author: Diodes Incorporated
  • PDF pages: 7

Technical content

Features

 High Conversion Efficiency  Low RDS(ON) – Minimizes On State Losses  Low Input Capacitance  Fast Switching Speed  <1.1mm Package Profile – Ideal for Thin Applications  Lead-Free Finish; RoHS Compliant (Notes 1 & 2)  Halogen and Antimony Free. “Green” Device (Note 3)  Qualified to AEC-Q101 Standards for High Reliability Mechanical Data  Case: PowerDI®5060-8  Case Material: Molded Plastic, “Green” Molding Compound; UL Flammability Classification Rating 94V-0  Moisture Sensitivity: Level 1 per J-STD-020  Terminal Finish - Matte Tin Annealed over Copper Leadframe; Solderable per MIL-STD-202, Method 208  Weight: 0.097 grams (Approximate) Ordering Information (Note 4) Part Number Case Packaging DMT8012LPS-13 PowerDI5060-8 2,500 / Tape & Reel Notes: 1. EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. All applicable RoHS exemptions applied. 2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen - and Antimony-free, "Green" and Lead-free. 3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds. 4. For packaging details, go to our website at https://www.diodes.com/design/support/packaging/diodes -packaging/. Marking Information Bottom View Top View Pin Configuration Top View Internal Schematic PowerDI5060-8 Pin1 T8012LS S S S G D D D D YY WW =Manufacturer’s Marking T8012LS = Product Type Marking Code YYWW = Date Code Marking YY = Last Two Digits of Year (ex: 17 = 2017) WW = Week Code (01 to 53) Green S D D G D D S S PowerDI is a registered trademark of Diodes Incorporated.

Document number: DS37738 Rev. 4 - 2 2 of 7 www.diodes.com July 2017 © Diodes Incorporated DMT8012LPS Maximum Ratings (@TA = +25° C, unless otherwise specified.) Characteristic Symbol Value Unit Drain-Source Voltage VDSS 80 V Gate-Source Voltage VGSS ±20 V Continuous Drain Current, VGS = 10V (Note 5) TA = +25°C TA = +70°C ID 9 7.2 A Continuous Drain Current, VGS = 10V (Note 6) TC = +25°C TC = +70°C ID 65 51 A Maximum Continuous Body Diode Forward Current (Note 6) IS 80 A Pulsed Drain Current (10µs Pulse, Duty Cycle = 1%) IDM 80 A Avalanche Current, L=0.1mH IAS 11.6 A Avalanche Energy, L=0.1mH EAS 10.2 mJ Thermal Characteristics Characteristic Symbol Value Unit Total Power Dissipation (Note 5) TA = +25° C PD 2.1 W Thermal Resistance, Junction to Ambient (Note 5) RθJA 56 ° C/W Total Power Dissipation (Note 6) TC = +25° C PD 113 W Thermal Resistance, Junction to Case (Note 6) RθJC 1.1 ° C/W Operating and Storage Temperature Range TJ, TSTG -55 to +150 °C Electrical Characteristics (@TA = +25° C, unless otherwise specified.) Characteristic Symbol Min Typ Max Unit Test Condition OFF CHARACTERISTICS (Note 7) Drain-Source Breakdown Voltage BVDSS 80 - - V VGS = 0V, ID = 1mA Zero Gate Voltage Drain Current IDSS - - 1 μA VDS = 64V, VGS = 0V Gate-Source Leakage IGSS - - ±100 nA VGS = ±20V, VDS = 0V ON CHARACTERISTICS (Note 7) Gate Threshold Voltage VGS(TH) 1 1.3 3 V VDS = VGS, ID = 250μA Static Drain-Source On-Resistance RDS(ON) - 14 17 mΩ VGS = 10V, ID = 12A - 16.5 21 VGS = 4.5V, ID = 6A Diode Forward Voltage VSD - 0.9 1.2 V VGS = 0V, IS = 20A DYNAMIC CHARACTERISTICS (Note 8) Input Capacitance Ciss - 1,949 - pF VDS = 40V, VGS = 0V, f = 1MHz Output Capacitance Coss - 177 - Reverse Transfer Capacitance Crss - 10 - Gate Resistance Rg - 0.7 - Ω VDS = 0V, VGS = 0V, f = 1MHz Total Gate Charge (VGS = 4.5V) Qg - 15 - nC VDS = 40V, ID = 12A Total Gate Charge (VGS = 10V) Qg - 34 - Gate-Source Charge Qgs - 6 - Gate-Drain Charge Qgd - 4.5 - Turn-On Delay Time tD(ON) - 4.9 - ns VDD = 40V, VGS = 10V, ID = 12A, RG = 1.6Ω Turn-On Rise Time tR - 3.8 - Turn-Off Delay Time tD(OFF) - 16.5 - Turn-Off Fall Time tF - 3.5 - Body Diode Reverse Recovery Time tRR - 30.2 - ns IF = 12A, di/dt = 100A/μs Body Diode Reverse Recovery Charge QRR - 34.6 - nC Notes: 5. Device mounted on FR-4 substrate PC board, 2oz copper, with thermal bias to bottom layer 1inch square copper plate. 6. Thermal resistance from junction to soldering point (on the exposed drain pad). 7. Short duration pulse test used to minimize self-heating effect. 8. Guaranteed by design. Not subject to product testing.

Figure 13. Transient Thermal Resistance

Document number: DS37738 Rev. 4 - 2 6 of 7 www.diodes.com July 2017 © Diodes Incorporated DMT8012LPS Package Outline Dimensions Please see http://www.diodes.com/package-outlines.html for the latest version. PowerDI5060-8 PowerDI5060-8 Dim Min Max Typ A 0.90 1.10 1.00 A1 0.00 0.05 - b 0.33 0.51 0.41 b2 0.200 0.350 0.273 b3 0.40 0.80 0.60 c 0.230 0.330 0.277 D 5.15 BSC D1 4.70 5.10 4.90 D2 3.70 4.10 3.90 D3 3.90 4.30 4.10 E 6.15 BSC E1 5.60 6.00 5.80 E2 3.28 3.68 3.48 E3 3.99 4.39 4.19 e 1.27 BSC G 0.51 0.71 0.61 K 0.51 - - L 0.51 0.71 0.61 L1 0.100 0.200 0.175 M 3.235 4.035 3.635 M1 1.00 1.40 1.21 θ 10° 12° 11° θ1 6° 8° 7° All Dimensions in mm Suggested Pad Layout Please see http://www.diodes.com/package-outlines.html for the latest version. PowerDI5060-8 Dimensions Value (in mm) C 1.270 G 0.660 G1 0.820 X 0.610 X1 4.100 X2 0.755 X3 4.420 X4 5.610 Y 1.270 Y1 0.600 Y2 1.020 Y3 0.295 Y4 1.825 Y5 3.810 Y6 0.180 Y7 6.610 X3 Y2 X C Y(4x) G A L K M G Detail A 0(4X) c e D E Detail A b (8X) e/2 01 (4X) b2 (4X) b3 (4X)E3

Document number: DS37738 Rev. 4 - 2 7 of 7 www.diodes.com July 2017 © Diodes Incorporated DMT8012LPS IMPORTANT NOTICE DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION). Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the application or use of this document or any product described herein; neither does Diodes Incorporated convey any license unde r its patent or trademark rights, nor the rights of others. Any Customer or user of t his document or products described herein in such applications shall assume all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diod es Incorporated website, harmless against all damages. Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel. Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application , Customers shall indemnify and hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising ou t of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized application. Products described herein may be covered by one or more United States, international or foreign patents pending. Product name s and markings noted herein may also be covered by one or more United States, international or foreign trademarks. This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the final and determinative format released by Diodes Incorporated. LIFE SUPPORT Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the e xpress written approval of the Chief Executive Officer of Diodes Incorporated. As used herein: A. Life support devices or systems are devices or systems which: 1. are intended to implant into the body, or 2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided i n the labeling can be reasonably expected to result in significant injury to the user. B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or to affect its safety or effectiveness. Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support d evices or systems, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of Diodes Incorporated products in such safety -critical, life support devices or systems, notwithstanding any devices - or systems -related information or support that may be provided by Diodes Incor porated. Further, Customers must fully indemnify Diodes Incorporated and its representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems. Copyright © 2017, Diodes Incorporated www.diodes.com