DMP1200UFR4 DIODES | Alldatasheet

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Document number: DS36557 Rev. 2 - 2 1 of 6 www.diodes.com October 2014 © Diodes Incorporated DMP1200UFR4 NEW PRODUCT P-CHANNEL ENHANCEMENT MODE MOSFET Product Summary V(BR)DSS RDS(ON) ID TA = +25°C -12V 100mΩ @ VGS = -4.5 V -2A 160mΩ @ VGS = -2.5V -1A 200mΩ @ VGS = -1.8V -0.5A 380mΩ @ VGS = -1.5V -0.2A Description and Applications This new generation MOSFET is designed to minimize the on-state resistance (RDS(on)) and yet maintain superior switching performance, making it ideal for high efficiency power management applications.  Power Management Functions  Backlighting  Load Switch Features and Benefits  Low On-Resistance  ESD Protected Gate  Low Input/Output Leakage  Fast Switching Speed  Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)  Halogen and Antimony Free. “Green” Device (Note 3) Mechanical Data  Case: X2-DFN1010-3  Case Material: Molded Plastic, “Green” Molding Compound. UL Flammability Classification Rating 94V-0  Moisture Sensitivity: Level 1 per J-STD-020  Terminal Connections: See Diagram  Terminals: Finish - NiPdAu Annealed over Copper Leadframe. Solderable per MIL-STD-202, Method 208  Weight: 0.0015 grams (Approximate) Ordering Information (Note 4) Part Number Case Packaging DMP1200UFR4-7 X2-DFN1010-3 3000/Tape & Reel Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. 2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Hal ogen- and Antimony-free, "Green" and Lead-free. 3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds. Marking Information Date Code Key Year 2011 2012 2013 2014 2015 2016 2017 Code Y Z A B C D E Month Jan Feb Mar Apr May Jun Jul Aug Sep Oct Nov Dec Code 1 2 3 4 5 6 7 8 9 O N D X2-DFN1010-3 ESD PROTECTED 12 = Product Type Marking Code YM = Date Code Marking Y = Year (ex: Y = 2011) M = Month (ex: 9 = September) YM Pin-out Top view Equivalent Circuit Bottom View

Document number: DS36557 Rev. 2 - 2 2 of 6 www.diodes.com October 2014 © Diodes Incorporated DMP1200UFR4 NEW PRODUCT Maximum Ratings (@TA = +25°C unless otherwise specified.) Characteristic Symbol Value Units Drain-Source Voltage VDSS -12 V Gate-Source Voltage VGSS ±8 V Drain Current (Note 6) Steady TA = +25C ID 2 A Thermal Characteristics Characteristic Symbol Value Units Total Power Dissipation (Note 5) PD 0.48 W Thermal Resistance, Junction to Ambient @TA = +25°C (Note 5) RJA 266 °C/W Total Power Dissipation (Note 6) PD 1.26 W Thermal Resistance, Junction to Ambient @TA = +25°C (Note 6) RJA 102 °C/W Operating and Storage Temperature Range TJ, TSTG -55 to +150 °C Electrical Characteristics (@TA = +25°C unless otherwise specified.) Characteristic Symbol Min Typ Max Unit Test Condition OFF CHARACTERISTICS (Note 7) Drain-Source Breakdown Voltage BVDSS -12   V VGS = 0V, ID = -250µA Zero Gate Voltage Drain Current IDSS   -1 µA VDS = -9.6V, VGS = 0V Gate-Source Leakage IGSS   10 µA VGS = 6V, VDS = 0V ON CHARACTERISTICS (Note 7) Gate Threshold Voltage VGS(th) -0.35  -1.0 V VDS = VGS, ID = -250µA Static Drain-Source On-Resistance RDS (ON)  115 145 100 160 200 380 mΩ VGS = -4.5V, ID = -2A VGS = -2.5V, ID = -1A VGS = -1.8V, ID = -0.5A VGS = -1.5V, ID = -0.2A Forward Transfer Admittance |Yfs| 40   mS VDS = -5V, ID = -0.5A Diode Forward Voltage VSD   -1.2 V VGS = 0V, IS = -0.2A DYNAMIC CHARACTERISTICS (Note 8) Input Capacitance Ciss  514  pF VDS = -5V, VGS = 0V, f = 1.0MHz Output Capacitance Coss  131  pF Reverse Transfer Capacitance Crss  60  pF Total Gate Charge Qg  5.8  nC VGS = -4.5V, VDS = -5V, ID = -2A Gate-Source Charge Qgs  0.8  nC Gate-Drain Charge Qgd  1.2  nC Turn-On Delay Time tD(on)  15  nS VDD = -5V, VGEN = -4.5V, RGEN = 6Ω Turn-On Rise Time tr  62  nS Turn-Off Delay Time tD(off)  332  nS Turn-Off Fall Time tf  166  nS Notes: 5. Device mounted on FR-4 substrate PC board, 2oz copper, with minimum recommended pad layout . 6. Device mounted on 1” x 1” FR-4 PCB with high coverage 2oz. Copper, single sided. 7. Short duration pulse test used to minimize self-heating effect. 8. Guaranteed by design. Not subject to production testing .

Document number: DS36557 Rev. 2 - 2 5 of 6 www.diodes.com October 2014 © Diodes Incorporated DMP1200UFR4 NEW PRODUCT t1, PULSE DURATION TIMES (sec) Figure 13 Transient Thermal Resistance r(t), TRANSIENT THERMAL RESISTANCE D = 0.005 D = 0.01 D = 0.05 D = 0.7 Single Pulse D = 0.1 D = 0.5 D = 0.3 D = 0.02 0.001 0.01 0.1 D = 0.9 Rthja(t)=r(t) * Rthja Rthja=262C/W Duty Cycle, D=t1 / t2 Package Outline Dimensions Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for the latest version. Suggested Pad Layout Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for the latest version. X2-DFN1010-3 Dim Min Max Typ A - 0.40 0.39 A1 0.00 0.05 0.02 A3 - - 0.13 b 0.18 0.28 0.23 D 0.95 1.05 1.00 D2 0.70 0.90 0.80 E 0.95 1.05 1.00 E2 0.36 0.56 0.46 e - - 0.50 K - - 0.20 L 0.195 0.295 0.245 All Dimensions in mm X2-DFN1010-3 Dimensions Value C 0.500 G 0.150 X 0.330 X1 0.900 Y 0.445 Y1 0.505 Y2 0.200 All Dimensions in mm A A1 Seating Plane D E b e L (Pin #1 ID) KD2 Y1X1 G X C Y X

Document number: DS36557 Rev. 2 - 2 6 of 6 www.diodes.com October 2014 © Diodes Incorporated DMP1200UFR4 NEW PRODUCT IMPORTANT NOTICE DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION). Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes without further notice to this document and any product described herein. Diodes Incorporated do es not assume any liability arising out of the application or use of this document or any product described herein; neither does Diodes Incorporated convey any license unde r its patent or trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diod es Incorporated website, harmless against all damages. Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel. Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized applicati on, Customers shall indemnify and hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising ou t of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized application. Products described herein may be covered by one or more United States, international or foreign patents pending. Product nam es and markings noted herein may also be covered by one or more United States, international or foreign trademarks. This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the final and determinative format released by Diodes Incorporated. LIFE SUPPORT Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without t he express written approval of the Chief Executive Officer of Diodes Incorporated. As used herein: A. Life support devices or systems are devices or systems which: 1. are intended to implant into the body, or 2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the labeling can be reasonably expected to result in significant injury to the user. B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or to affect its safety or effectiveness. Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support d evices or systems, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of Diodes Incorporated products in such safety -critical, life support devices or systems, notwithstanding any devices - or systems -related information or support that may be provided by Diodes In corporated. Further, Customers must fully indemnify Diodes Incorporated and its representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems. Copyright © 2014, Diodes Incorporated www.diodes.com