DMP1012UCB9 DIODES | Alldatasheet

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Technical content

Features

  • LD-MOS Technology with the Lowest Figure of Merit: RDS(on) = 8.2mΩ to Minimize On-State Losses Qg = 8.1nC for Ultra-Fast Switching
  • V gs(th) = -0.8V typ. for a Low Turn-On Potential
  • CSP with Footprint 1.5mm × 1.5mm
  • Height = 0.62mm for Low Profile
  • ESD = 6kV HBM Protection of Gate
  • Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
  • Halogen and Antimony Free. “Green” Device (Note 3)
  • Qualified to AEC-Q101 Standards for High Reliability Mechanical Data
  • Case: U-WLB1515-9
  • Terminal Connections: See Diagram Below Ordering Information (Note 4) Part Number Case Packaging DMP1012UCB9-7 U-WLB1515-9 3,000/Tape & Reel Notes: 1. No purposely added lead. Fully EU Directi ve 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) complian t. 2. See http://www.diodes.com/quality/lead_free.htm l for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green" and Lead-free. 3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <9 00ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds. Marking Information U-WLB1515-9 Date Code Key Year 2012 2013 2014 2015 2016 2017 2018 Code Z A B C D E F Month Jan Feb Mar Apr May Jun Jul Aug Sep Oct Nov Dec Code 1 2 3 4 5 6 7 8 9 O N D Top-View Pin Configuration XW = Product Type Marking Code YM = Date Code Marking Y or Y = Year (ex: B = 2014) M or M = Month (ex: 9 = September) Equivalent Circuit G S S D D D S SS U-WLB1515 -9

Document number: DS36844 Rev. 7 - 2 2 of 6 www.diodes.com January 2015 © Diodes Incorporated DMP1012UCB9 NEW PRODUCT ADVANCE INFORMATION ADVANCED INFORMATION Maximum Ratings (@TA = +25° C, unless otherwise specified.) Characteristic Symbol Value Units Drain-Source Voltage VDSS -8 V Gate-Source Voltage VGSS -6 V Continuous Drain Current (Note 5) V GS = -4.5V Steady State TA = +25° C TA = +70° C ID -10 -8 A Continuous Drain Current (Note 6) V GS = -4.5V Steady State TA = +25° C TA = +70° C ID -7.4 -6.0 A Pulsed Drain Current (Pulse duration 10 µs, duty cycle ≤1%) IDM -50 A Continuous Source Pin Current (Note 6) IS -2  Pulsed Source Pin Current (Pulse duration 10µs, duty cycle ≤ 1%) ISM -15  Continuous Gate Current IG -0.5 A Thermal Characteristics (@TA = +25° C, unless otherwise specified.) Characteristic Symbol Value Units Total Power Dissipation (Note 5) PD 0.89 W Total Power Dissipation (Note 6) PD 1.57 W Thermal Resistance, Junction to Ambient (Note 5) RθJA +142.1 ° C/W Thermal Resistance, Junction to Ambient (Note 6) RθJA +80.5 ° C/W Operating and Storage Temperature Range TJ, TSTG -55 to +150 ° C Electrical Characteristics (@TA = +25° C, unless otherwise specified.) Characteristic Symbol Min Typ Max Unit Test Condition OFF CHARACTERISTICS (Note 7) Drain-Source Breakdown Voltage BV DSS -8 — — V VGS = 0V, I D = -250 µA Gate to Source Voltage BV SGS -6 — — V VDS = 0V, I G = -250 µA Zero Gate Voltage Drain Current @TC = +25° C IDSS — — -1 µA VDS = -4.0V, V GS = 0V Gate-Source Leakage IGSS — — -100 nA VGS = -4.0V, V DS = 0V ON CHARACTERISTICS (Note 7) Gate Threshold Voltage VGS(th) -0.4 -0.8 -1.1 V VDS = V GS , I D = -250 µA Static Drain-Source On-Resistance RDS (ON) — 8.2 10 mΩ VGS = -4.5V, I D = -2A 10 13 VGS = -3.0V, I D = -2A 11 14 VGS = -2.5V, I D = -2A Forward Transfer Admittance |Y fs | — 16.8 — S VDS = -4V, I D = -2A Diode Forward Voltage (Note 6) VSD — -0.7 -1 V VGS = 0V, I S = -2A Reverse Recovery Charge Qrr — 6.3 — nC Vdd = -5V, I F = -2A, di/dt = 200A/ µs Reverse Recovery Time trr — 18.5 — ns DYNAMIC CHARACTERISTICS (Note 8) Input Capacitance Ciss — 817 1060 pF VDS = -4V, V GS = 0V, f = 1.0MHz Output Capacitance Coss — 595 770 pF Reverse Transfer Capacitance Crss — 269 350 pF Series Gate Resistance RG — 1.9 — Ω VDS = 0V, V GS = 0V, f = 1.0MHz Total Gate Charge (4.5V) Qg — 8.1 10.5 nC VGS = -4.5V, V DS = -4V, ID = -2A Gate-Source Charge Qgs — 0.9 — nC Gate-Drain Charge Qgd — 1.8 — nC Turn-On Delay Time tD(on) — 6.2 10 ns VDD = -4V, V GS = -4.5V, IDS = -2A, RG = 10 Ω, Turn-On Rise Time tr — 22.6 — ns Turn-Off Delay Time tD(off) — 30.1 48 ns Turn-Off Fall Time tf — 22.7 — ns Notes: 5. Device mounted on FR-4 PCB with minimum recommended pad layout. 6. Device mounted on FR4 material with 1-inch 2 (6.45cm 2), 2oz (0.071mm thick) Cu. 7. Short duration pulse test used to minimize self- heating effect. 8. Guaranteed by design. Not subject to production testing.

Document number: DS36844 Rev. 7 - 2 5 of 6 www.diodes.com January 2015 © Diodes Incorporated DMP1012UCB9 NEW PRODUCT ADVANCE INFORMATION ADVANCED INFORMATION Package Outline Dimensions Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for the latest version. Suggested Pad Layout Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for the latest version. U-WLB1515 -9 Dim Min Max Typ A - 0.62 - A2 - 0.36 0.36 A3 0.020 0.030 0.025 b 0.27 0.37 0.32 D 1.47 1.49 E 1.47 1.49 e - - 0.50 All Dimensions in mm Dimensions Value (in mm) C 0.50 C1 1.00 C2 1.00 D 0.25 C C D D E PIN ID e e 6X-Ø b e A2 A SEATING PLANE e

Document number: DS36844 Rev. 7 - 2 6 of 6 www.diodes.com January 2015 © Diodes Incorporated DMP1012UCB9 NEW PRODUCT ADVANCE INFORMATION ADVANCED INFORMATION IMPORTANT NOTICE DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTI ES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION). Diodes Incorporated and its subsidiaries reserve th e right to make modifications, enhancements, improv ements, corrections or other changes without further notice to this document and any pro duct described herein. Diodes Incorporated does not assume any liability arising out of the application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or trademark rights, nor the rights of others. Any Cu stomer or user of this document or products describ ed herein in such applications shall assume all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated website, harmless against all damages. Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel. Should Customers purchase or use Diodes Incorporate d products for any unintended or unauthorized appli cation, Customers shall indemnify and hold Diodes Incorporated and its representatives ha rmless against all claims, damages, expenses, and a ttorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized application. Products described herein may be covered by one or more United States, international or foreign patent s pending. Product names and markings noted herein may also be covered by one or more United States, international or foreign trademarks. This document is written in English but may be tran slated into multiple languages for reference. Only the English version of this document is the final and determinative format released by Diodes Incorporated. LIFE SUPPORT Diodes Incorporated products are specifically not a uthorized for use as critical components in life su pport devices or systems without the express written approval of the Chief Executive Officer of Diodes Incorporated. As used herein: A. Life support devices or systems are devices or systems which: 1. are intended to implant into the body, or 2. support or sustain life and whose failure to per form when properly used in accordance with instruct ions for use provided in the labeling can be reasonably expected to result in significant injury to the user. B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or to affect its safety or effectiveness. Customers represent that they have all necessary ex pertise in the safety and regulatory ramifications of their life support devices or systems, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of Diodes Incorporated products in such safety- critical, life support devices or systems, notwiths tanding any devices- or systems-related information or support that may be provided by Diod es Incorporated. Further, Customers must fully ind emnify Diodes Incorporated and its representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems. Copyright © 2015, Diodes Incorporated www.diodes.com