DMK2783-000 ALPHA | Alldatasheet

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Technical content

Features

I Designed for High Volume Designs I High Frequency (20–100 GHz) I Exceeds Environmental Requirements for MIC & Hybrid Applications I Designed for Low Junction Capacitance and Low Series Resistance I Applications Include PCN Mixers and Circuits, As Well As Low Power, Fast Switching I Low Parasitic Flip Chip Configuration

Description

This new series of GaAs Schottky barrier diodes offer high performance at commercial market prices. They are designed for low junction capacitance, as well as low series resistance. Diodes are designed for MIC work (hard and soft substrates), but the leadless design eliminates the problems associated with mounting of beam lead diodes. Due to its rigid construction, it exceeds environmental requirements for MIC and hybrid applications. Diodes can be supplied on expandable film frame for high speed pick and place process. Standard packing will be in a gel pack. Flexible conductive epoxy is the most effective method for circuitry attachments. Standard mounting temperatures should not exceed 175°C. Single - DMK2783-000, DMK2790-000 Anti-Parallel - DMK2308-000 Series Pair - DMK8001-000 Electrical Specifications at 25°C 1. VB cannot be measured nondestructively in anti-parallel configuration. 2. CT = junction capacitance plus 0.02 pF (overlay). Recommended V B1 CT2 Frequency @ 10 µµA 0 V, 1 MHz R S @ 10 mA V F @ 1 mA Single Series Pair Anti-Parallel (GHz) (V) (pF) ( ΩΩ) (mV) 20–100 3.0 0.03 0.05 9 680 780 DMK2783-000 20–100 3.0 0.04 0.07 7 650 750 DMK2790-000 DMK2308-000 20–100 3.0 0.05 0.08 7 650 750 DMK8001-000

VF 1 mA (mV) 680 700 720 740 Number of Obs VF = Mixer DMK2790 x = 719 mV σ = 6.3 mV Capacitance/Voltage Variation Bias Voltage (V) Device Capacitance (pF) 0.028 0.032 0.036 0.040 0.044 0.048 0.052 0.056 0.060 0.064 0.068 0.072 0.076 0.080 Histogram RT 10 mA (Ω) Number of Obs 110 121 132 143 154 165 RT = Mixer DMK2790 x = 5.0 Ω σ = 0.25 Ω x = 5.0 σ = 0.25 Histogram Capacitance 0 V (pF) 0.055 0.060 0.065 0.070 Number of Obs Aug 0.063 pF SD = 0.002 pF CJ 0.0063 pF Average 0.0014 pF SD Typical Parameter Distribution on Wafer GaAs Flip Chip Schottky Diodes 2 Alpha Industries, Inc. [781] 935-5150 • Fax [617] 824-4579 • Email sales@alphaind.com • www.alphaind.com Specifications subject to change without notice. 3/00A Spice Parameters (Per Junction) IS RS TD CJ0E G VJ BV IBV Amp ΩΩ nS p Fm e V e V X TI FC V A

GaAs Flip Chip Schottky Diodes Alpha Industries, Inc. [781] 935-5150 • Fax [617] 824-4579 • Email sales@alphaind.com • www.alphaind.com 3 Specifications subject to change without notice. 3/00A Flexible Conductive Epoxy Mounting of Alpha Beamless Flip Chip Diodes – To Soft or Hard Substrate – As Plated Deposit Conductive Epoxy Cure Epoxy & DC Continuity Check  Inspect for Adequate Epoxy Fillet  Cure According to Mfg. Preferred Schedule. Typically 110–150°C @ 60 Minutes, or 150°C,

4 Minutes for Snap-Cure Epoxies

10 Mil Gap

Drops (Minimum Amount) Approximately 8 mil Diameter 1–2 mil height Perform Die Attach  Flip Device  Align Bond Pads to Epoxy Dot (Alignment Marks Help)  Use Even Pressure to Make Correct Connection Suggested Setup Values For WEST-BOND Model 7200A Epoxy Die Bonder Materials Epoxy Microelectronic grade one component, solvent-free silver-filled, electrically conductive adhesive — example: Ablebond 8380 by Ablestick. Dispense Tube WEST -BOND B-1831-1 with 9.5 mil I.D., or WEST -BOND B-1831-2 with 15.5 mil I.D. Other sizes available. Die Pickup Tool SPT Part Number 2101-W625-CT -031 x 0.016 x 0.0075. Use vacuum pressure to pick and place chip. Adjustment Bond Force 35 grams at tool. Dispense Air 30 psi. Dispense Time To give diameter of dot required. Curing Time Temperature Time 250°C 10 min. 130°C 20 min. 100°C 60 min. 85°C 120 min.

GaAs Flip Chip Schottky Diodes 4 Alpha Industries, Inc. [781] 935-5150 • Fax [617] 824-4579 • Email sales@alphaind.com • www.alphaind.com Specifications subject to change without notice. 3/00A 0.008 (0.20 mm) ± 0.001 (0.025 mm) 0.005 (0.13 mm) ± 0.001 (0.025 mm) 0.026 (0.66 mm) ± 0.001 (0.025 mm) 0.013 (0.33 mm) ± 0.001 (0.025 mm) 0.013 (0.33 mm) ± 0.001 (0.025 mm) 0.005 (0.13 mm) ± 0.001 (0.025 mm) MAX. Outline Drawings 540-011 CL 0.005 (0.127 mm) ± 0.001 (0.025 mm) 0.008 (0.203 mm) ± 0.001 (0.025 mm) TYP. 0.005 (0.127 mm) ± 0.001 (0.025 mm) TYP. 0.009 (0.229 mm) ± 0.001 (0.025 mm) 0.019 (0.483 mm) ± 0.001 (0.025 mm) 0.009 (0.229 mm) ± 0.001 (0.025 mm) LC 0.020 (0.508 mm) ± 0.001 (0.025 mm) 0.010 (0.254 mm) ± 0.001 (0.025 mm) 0.028 (0.711 mm) ± 0.001 (0.025 mm) CATHODE LEAD SCHEMATIC 0.005 (0.13 mm) 540-012 0.008 (0.20 mm) ± 0.001 (0.025 mm) 0.005 (0.13 mm) ± 0.001 (0.025 mm) 0.026 (0.66 mm) ± 0.001 (0.025 mm) 0.013 (0.33 mm) ± 0.001 (0.025 mm) 0.013 (0.33 mm) ± 0.001 (0.025 mm) 0.005 (0.13 mm) 540-025