DMG963H10R PANASONICBATTERY | Alldatasheet

Document overview

  • Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
  • PDF pages: 6

Technical content

Ver. DEDPublication date: February 2013 1 DMG963H1 Silicon NPN epitaxial planar type (Tr1) Silicon PNP epitaxial planar type (Tr2) For digital circuits DMG563H1 in SSMini5 type package  Features  Low collector-emitter saturation voltage VCE(sat)  Halogen-free / RoHS compliant (EU RoHS / UL-94 V-0 / MSL: Level 1 compliant)  Marking Symbol: T1  Basic Part Number DRC2144E + DRA2143X (Collector-base connection)  Packaging DMG963H10R Embossed type (Thermo-compression sealing): 8 000 pcs / reel (standard)  Absolute Maximum Ratings Ta = 25°C Parameter Symbol Rating Unit Tr1 Collector-base voltage (Emitter open) VCBO 50 V Collector-emitter voltage (Base open) VCEO 50 V Collector current IC 100 mA Tr2 Collector-base voltage (Emitter open) VCBO –50 V Collector-emitter voltage (Base open) VCEO –50 V Collector current IC –100 mA Overall Total power dissipation PT 125 mW Junction temperature Tj 150 °C Storage temperature Tstg –55 to +150 °C Unit: mm 1: Emitter (Tr1) 2: Base (Tr1) 3: Emitter (Tr2) 4: Collecter (Tr2) 5: Base (Tr2) Collecter (Tr1) Panasonic SSMini5-F4-B JEITA SC-107BB Code SOT-665 (C2) Tr1 Tr2 (B2, C1) (E1) (E2) (B1) R2R2 Resistance value Tr1 R1 47 kΩ R2 47 kΩ Tr2 R1 4.7 kΩ R2 10 kΩ

Ver. DED DMG963H1  Electrical Characteristics Ta = 25°C±3°C  Tr1 Parameter Symbol Conditions Min Typ Max Unit Collector-base voltage (Emitter open) VCBO IC = 10 µA, IE = 0 50 V Collector-emitter voltage (Base open) VCEO IC = 2 mA, IB = 0 50 V Collector-base cutoff current (Emitter open) ICBO VCB = 50 V, IE = 0 0.1 µA Collector-emitter cutoff current (Base open) ICEO VCE = 50 V, IB = 0 0.5 µA Emitter-base cutoff current (Collector open) IEBO VEB = 6 V, IC = 0 0.1 mA Forward current transfer ratio hFE VCE = 10 V, IC = 5 mA 80  Collector-emitter saturation voltage VCE(sat) IC = 10 mA, IB = 0.5 mA 0.25 V Input voltage (ON) VI(on) VCE = 0.2 V, IC = 5 mA 3.6 V Input voltage (OFF) VI(off) VCE = 5 V, IC = 100 µA 0.8 V Input resistance R1 –30% 47 +30% kΩ Resistance ratio R1 / R2 0.8 1.0 1.2  Note) Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7030 measuring methods for transistors.  Tr2 Parameter Symbol Conditions Min Typ Max Unit Collector-base voltage (Emitter open) VCBO IC = –10 µA, IE = 0 –50 V Collector-emitter voltage (Base open) VCEO IC = –2 mA, IB = 0 –50 V Collector-base cutoff current (Emitter open) ICBO VCB = –50 V, IE = 0 – 0.1 µA Collector-emitter cutoff current (Base open) ICEO VCE = –50 V, IB = 0 – 0.5 µA Emitter-base cutoff current (Collector open) IEBO VEB = –6 V, IC = 0 –1.0 mA Forward current transfer ratio hFE VCE = –10 V, IC = –5 mA 30  Collector-emitter saturation voltage VCE(sat) IC = –10 mA, IB = – 0.5 mA – 0.25 V Input voltage (ON) VI(on) VCE = – 0.2 V, IC = –5 mA –1.7 V Input voltage (OFF) VI(off) VCE = –5 V, IC = –100 µA – 0.6 V Input resistance R1 –30% 4.7 +30% kΩ Resistance ratio R1 / R2 0.37 0.47 0.57  Note) Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7030 measuring methods for transistors.

Ver. DED DMG963H1 IO  VIN VIN  IO 0 2.01.51.00.510−3 10−1 10−2 DMG963H1(Tr1)_IO-VIN VO = 5 V Input voltage VIN (V) Output current IO (mA) 25°C −30°C Ta = 85°C 0.1 0.1 100 1 1 0 100 Input voltage VIN (V) Output current IO (mA) DMG963H1(Tr1)_VIN-IO VO = 0.2 V 25°C 85°C Ta = −30°C PT  Ta 0 20016040 12080 100 150 125 DMG963H1_PT-Ta Ambient temperature Ta (°C) Total power dissipation PT (mW) IC  VCE hFE  IC VCE(sat)  IC 0 122 104 8 6 120 100 Collector current IC (mA) Collector-emitter voltage VCE (V) DMG963H1(Tr1)_IC-VCE Ta = 25°C IB = 500 µA 300 µA 350 µA 400 µA450 µA 200 µA 250 µA 150 µA 100 µA 50 µA 0.1 500 300 400 200 100 1 1 0 100 Forward current transfer ratio hFE Collector current IC (mA) DMG963H1(Tr1)_hFE-IC 25°C −30°C Ta = 85°C VCE = 10 V 0.01 0.1 0.1 1 1 0 100 Collector-emitter saturation voltage VCE(sat) (V) Collector current IC (mA) DMG963H1(Tr1)_VCEsat-IC 25°C −30°C Ta = 85°C IC / IB = 20 Common characteristics chart Characteristics charts of Tr1

Ver. DED DMG963H1 IC  VCE hFE  IC VCE(sat)  IC −120 −100 −80 −60 −40 −20 Collector current IC (mA) Collector-emitter voltage VCE (V) DMG963H1(Tr2)_IC-VCE Ta = 25°C IB = −800 µA −500 µA −600 µA −700 µA −300 µA −400 µA −200 µA −100 µA − 0.1 300 250 200 150 100 −1 −10 −100 Forward current transfer ratio hFE Collector current IC (mA) DMG963H1(Tr2)_hFE-IC 25°C −30°C Ta = 85°C VCE = −10 V − 0.01 − 0.1 − 0.1 −10 −1 −10 −100 DMG963H1(Tr2)_VCEsat-IC Collector-emitter saturation voltage VCE(sat) (V) Collector current IC (mA) 25°C −30°C Ta = 85°C IC / IB = 20 IO  VIN VIN  IO −10−1 −10−2 −10 DMG963H1(Tr2)_IO-VIN VO = −5 V Input voltage VIN (V) Output current IO (mA) 25°C −30°C Ta = 85°C − 0.1 − 0.1 −10 −100 −1 −10 −100 Input voltage VIN (V) Output current IO (mA) DMG963H1(Tr2)_VIN-IO VO = − 0.2 V 25°C 85°C Ta = −30°C Characteristics charts of Tr2

Ver. DED DMG963H1 SSMini5-F4-B Unit: mm  Land Pattern (Reference) (Unit: mm)

Request for your special attention and precautions in using the technical information and semiconductors described in this book (1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and regulations of the exporting country, especially, those with regard to security export control, must be observed. (2) The technical information described in this book is intended only to show the main characteristics and application circuit examples of the products. No license is granted in and to any intellectual property right or other right owned by Panasonic Corporation or any other company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other company which may arise as a result of the use of technical information described in this book. (3) The products described in this book are intended to be used for general applications (such as office equipment, communications equipment, measuring instruments and household appliances), or for specific applications as expressly stated in this book. Consult our sales staff in advance for information on the following applications: – Special applications (such as for airplanes, aerospace, automotive equipment, traffic signaling equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body. It is to be understood that our company shall not be held responsible for any damage incurred as a result of or in connection with your using the products described in this book for any special application, unless our company agrees to your using the products in this book for any special application. (4) The products and product specifications described in this book are subject to change without notice for modification and/or im- provement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product Standards in advance to make sure that the latest specifications satisfy your requirements. (5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions (operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any defect which may arise later in your equipment. Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products. (6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS, thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages. (7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of our company. 20100202