DMG3407SSN-7

DMG3407SSN DIODES | Alldatasheet

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Document number: DS35135 Rev. 5 - 2 1 of 6 www.diodes.com April 2012 © Diodes Incorporated DMG3407SSN ADVANCE INFORMATION P-CHANNEL ENHANCEMENT MODE MOSFET Product Summary V(BR)DSS R DS(ON) ID TA = 25°C -30V 50mΩ @ VGS = -10V -4.0A 72mΩ @ VGS = -4.5V -3.3A Description and Applications This new generation MOSFET has been designed to minimize the on- state resistance (RDS(on)) and yet maintain superior switching performance, making it ideal for high efficiency power management applications.

• Load Switch
• DC-DC Converters
• Power management functions Features and Benefits
• Low On-Resistance
• Low Input Capacitance
• Fast Switching Speed
• Low Input/Output Leakage
• Lead-Free Finish; RoHS compliant (Note 1)
• Halogen and Antimony Free. “Green” Device (Note 2)
• Qualified to AEC-Q101 Standards for High Reliability Mechanical Data
• Case: SC59
• Case Material – Molded Plasti c. UL Flammability Rating 94V-0
• Moisture Sensitivity: Level 1 per J-STD-020
• Terminals: Finish - Matte Tin Solderable per MIL-STD-202, Method 208
• Terminal Connections: See Diagram
• Weight: 0.014 grams (approximate) Ordering Information (Note 3) Part Number Case Packaging DMG3407SSN-7 SC59 3000 / Tape & Reel Notes: 1. EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. No purposely added lead. Halogen and Antimony free 3. For packaging details, go to our website at http://www.diodes.com. Marking Information Date Code Key Year 2010 2011 2012 2013 2014 2015 2016 Code X Y Z A B C D Month Jan Feb Mar Apr May Jun Jul Aug Sep Oct Nov Dec Code 1 2 3 4 5 6 7 8 9 O N D SC59 Top View Pin Configuration Source Gate Drain Internal Schematic D G S G32 = Product Type Marking Code YM = Date Code Marking Y = Year (ex: X = 2010) M = Month (ex: 9 = September) G32 YM

Document number: DS35135 Rev. 5 - 2 2 of 6 www.diodes.com April 2012 © Diodes Incorporated DMG3407SSN ADVANCE INFORMATION Maximum Ratings @TA = 25°C unless otherwise specified Characteristic Symbol Value Units Drain-Source Voltage VDSS -30 V Gate-Source Voltage VGSS ±20 V Continuous Drain Current (Note 5) VGS = -10V Steady State TA = 25°C TA = 70°C ID -4.0 -3.2 A t<10s TA = 25°C TA = 70°C ID -4.6 -3.6 A Continuous Drain Current (Note 5) VGS = -4.5V Steady State TA = 25°C TA = 70°C ID -3.3 -2.6 A t<10s TA = 25°C TA = 70°C ID -3.9 -3.1 A Pulsed Drain Current (10μs pulse, duty cycle = 1%) IDM -30 A Maximum Body Diode Forward Current (Note 5) IS -2.0 A Thermal Characteristics @TA = 25°C unless otherwise specified Characteristic Symbol Value Units Total Power Dissipation (Note 4) TA = 25°C PD 1.1 W TA = 70°C 0.7 Thermal Resistance, Junction to Ambient (Note 4) Steady state RθJA 166 °C/W t<10s 118 Total Power Dissipation (Note 5) TA = 25°C PD 1.8 W TA = 70°C 1.1 Thermal Resistance, Junction to Ambient (Note 5) Steady state RθJA 98 °C/W t<10s 71 Thermal Resistance, Junction to Case (Note 5) RθJC 18 Operating and Storage Temperature Range TJ, TSTG -55 to +150 °C Electrical Characteristics @ TA = 25°C unless otherwise stated Characteristic Symbol Min Typ Max Unit Test Condition OFF CHARACTERISTICS (Note 6) Drain-Source Breakdown Voltage BVDSS -30 - - V VGS = 0V, ID = -250μA Zero Gate Voltage Drain Current TJ = 25°C IDSS - - -1 μA VDS = -30V, VGS = 0V Gate-Source Leakage IGSS - - ±100 nA VGS = ±20V, VDS = 0V ON CHARACTERISTICS (Note 6) Gate Threshold Voltage VGS(th) -1.0 -1.5 -2.1 V VDS = VGS, ID = -250μA Static Drain-Source On-Resistance RDS (ON) - 39 50 mΩ VGS = -10V, ID = -4.1A Forward Transfer Admittance |Yfs| - 8.2 - S VDS = -5V, ID = -4A Diode Forward Voltage VSD - -0.75 -1.1 V VGS = 0V, IS = -1A DYNAMIC CHARACTERISTICS (Note 7) Input Capacitance Ciss 466 582 700 pF VDS = -15V, VGS = 0V, f = 1.0MHz Output Capacitance Coss 80 114 148 Reverse Transfer Capacitance Crss 47 76 105 Gate Resistance Rg 2 5 8 Ω VDS = 0V, VGS = 0V, f = 1MHz Total Gate Charge Qg 10.6 13.3 16 nC VGS = -10V, VDS = -15V, ID = -4A Total Gate Charge Qg 5.2 6.5 8.5 VGS = -4.5V, VDS = -15V,ID = -4A Gate-Source Charge Qgs 1.3 1.7 2 Gate-Drain Charge Qgd 1.1 1.9 2.7 Turn-On Delay Time tD(on) - 6.0 - ns VGS = -10V, VDS = -15V, RL = 3.6Ω, RG = 3Ω Turn-On Rise Time tr - 12.9 - Turn-Off Delay Time tD(off) - 35.4 - Turn-Off Fall Time tf - 30.7 - Notes: 4. Device mounted on FR-4 PCB with minimum recommended pad layout, single sided. The power dissipation P D is based on t<10s RθJA 5. Device mounted on 1” x 1” FR-4 PCB with high co verage 2 oz. Copper, single sided. The power dissipation PD is based on t<10s RθJA 6. Short duration pulse test used to minimize self-heating effect. 7. Guaranteed by design. Not subject to production testing.

Document number: DS35135 Rev. 5 - 2 3 of 6 www.diodes.com April 2012 © Diodes Incorporated DMG3407SSN ADVANCE INFORMATION -V , DRAIN -SOURCE VOLTAGE(V) Fig. 1 Typical Output Characteristics DS 012345 -I , D RAIN CURRENT (A)D V = -2.0VGS V = -2.5VGS V = -3.5VGS V = -3.0VGS V = -4.0VGS V = -4.5VGS -V , GATE-SOURCE VOLTAGE (V)GS Fig. 2 Typical Transfer Characteristics -I , D RAIN CURRENT (A)D T = 1 5 0 CA ° T = 1 2 5 CA ° T = 8 5 CA ° T = 2 5 CA ° T = - 5 5 CA ° V = -5.0VDS 0.02 0.04 0.06 0.08 0.12 0.10 R ,DRAIN-SOURCE ON-RESISTANCE( )DS(ON) Ω 02 4 6 8 1 0 -I , DRAIN SOURCE CURRENT Fig. 3 Typical On-Resistance vs. Drain Current and Gate Voltage D 02 4 68 1 0 -I , DRAIN SOURCE CURRENT (A) Fig. 4 Typical On-Resistance vs. Drain Current and T emperature D R , DRAIN-SOURCE ON-RESISTANCE( )DS(ON) Ω V = -4.5VGS T = - 5 5 CA ° T = 2 5 CA ° T = 8 5 CA ° T = 1 2 5 CA ° T = 1 5 0 CA ° 0.5 0.7 0.9 1.1 1.3 1.5 1.7 -50 -25 0 25 50 75 100 125 150 T , JUNCTION TEMPERATURE ( C)J ° Fig. 5 On-Resistance Variation with Temperature R , DRAIN-SOURCE ON-RESISTANCE (Normalized) DS(ON) 0.02 0.04 0.06 0.08 0.10 0.12 R , DRAIN-SOURCE ON-RESISTANCE ( )DS(ON) Ω -50 -25 0 25 50 75 100 125 150 T , JUNCTION TEMPERATURE ( C)J ° Fig. 6 On-Resistance Variation with Temperature V= - 1 0 V I= A GS D -10 V= . 5 V I= A GS D

Document number: DS35135 Rev. 5 - 2 4 of 6 www.diodes.com April 2012 © Diodes Incorporated DMG3407SSN ADVANCE INFORMATION 0.5 1.0 1.5 2.0 2.5 -50 -25 0 25 50 75 100 125 150 T , AMBIENT TEMPERATURE (°C) Fig. 7 Gate Threshold Variation vs. Ambient Temperature A -V , GATE THRESHOLD VOLTAGE(V)GS(TH) -V , SOURCE-DRAIN VOLTAGE (V) Fig. 8 Diode Forward Voltage vs. Current SD 10-I , S OURCE CURRENT (A)S 100 1,000 -V , DRAIN-SOURCE VOLTAGE (V) Fig. 9 Typical Junction Capacitance DS 0 5 10 15 20 25 30 C , JUNCTION CAPACITANCE (pF)T Coss Crss f = 1MHz Ciss 2 6 10 14 18 22 26 30 -V , DRAIN-SOURCE VOLTAGE(V) Fig. 10 Typical Drain-Source Leakage Current vs. Voltage DS -I , LEAKA GE CURRENT (nA)DSS 0.1 100 1,000 10,000 T = 1 5 0 ° CA T = 1 2 5 ° CA T = 8 5 ° CA T = 2 5 ° CA 04 8 1 2 1 6 Q , TOTAL GATE CHARGE (nC) Fig. 11 Gate-Charge Characteristics g 10-V , GATE-SOURCE VOLTAGE (V)GS 0.00001 0.001 0.1 10 1,000 t1, Pulse Duration Time (sec) Fig. 12 Single Pulse Maximum Power Dissipation 100 150 200 250 300 350 400 P , PEAK TRANSIENT POWER (W)(pk) Single Pulse R = 1 6 4 C / WθJA ° R = R * r(t) (t)θθJA JA T - T = P * RJA θJA(t)

Document number: DS35135 Rev. 5 - 2 5 of 6 www.diodes.com April 2012 © Diodes Incorporated DMG3407SSN ADVANCE INFORMATION t1, PULSE DURATION TIMES (sec) Fig. 13 Transient Thermal Resistance 0.001 0.01 0.1 r(t), TRANSIENT THERMAL RESISTANCE R (t) = r(t) * RθθJA JA R = 164°C/W Duty Cycle, D = t1/ t2 θJA D = 0.7 D = 0.9 D = 0.5 D = 0.3 D = 0.1 D = 0.05 D = 0.02 D = 0.01 D = 0.005 Single Pulse Package Outline Dimensions Suggested Pad Layout SC59 Dim Min Max Typ A 0.35 0.50 0.38 B 1.50 1.70 1.60 C 2.70 3.00 2.80 D - - 0.95 G - - 1.90 H 2.90 3.10 3.00 J 0.013 0.10 0.05 K 1.00 1.30 1.10 L 0.35 0.55 0.40 M 0.10 0.20 0.15 N 0.70 0.80 0.75 α 0° 8° - All Dimensions in mm Dimensions Value (in mm) Z 3.4 X 0.8 Y 1.0 C 2.4 E 1.35 A M J LD B C H K G N X E Y CZ

Document number: DS35135 Rev. 5 - 2 6 of 6 www.diodes.com April 2012 © Diodes Incorporated DMG3407SSN ADVANCE INFORMATION IMPORTANT NOTICE DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION). Diodes Incorporated and its subsidiaries rese rve the right to make modifications, enhancements, improvements, corrections or ot her changes without further notice to this document and any product descri bed herein. Diodes Incorporated does not assume any liability arising out of the application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applica tions shall assume all risks of such use and will agree to hold Diodes Incorporated a nd all the companies whose products are represented on Diodes Incorporated website, harmless against all damages. Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthoriz ed sales channel. Should Customers purchase or use Diodes Inco rporated products for any unintended or una uthorized application, Customers shall i ndemnify and hold Diodes Incorporated and its representativ es harmless against all claims, damages, expenses, and attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized application. Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings noted herein may also be covered by one or more United States, international or foreign trademarks. LIFE SUPPORT Diodes Incorporated products are specifically not authorized for use as critical com ponents in life support devices or systems without the express written approval of the Chief Executive Officer of Diodes Incorporated. As used herein: A. Life support devices or systems are devices or systems which: 1. are intended to implant into the body, or 2. support or sustain life and whose failure to perform when proper ly used in accordance with instructions for use provided in the labeling can be reasonably expected to result in significant injury to the user. B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or to affect its safety or effectiveness. Customers represent that they have all necessary expertise in the safety and regulatory ramifi cations of their life support dev ices or systems, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or s ystems-related information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporate d and its representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems. Copyright © 2012, Diodes Incorporated www.diodes.com