DM3D-SF

DM3AT-SF-PEJM5 HIROSE | Alldatasheet

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Technical content

2010.6ww microSD™ Card Connectors DM3 Series NEW ■Features ◆ Common to the entire Series 1. Extremely small size Small external dimensions and the above-the-board height make the connectors the smallest on the market. 2. Reverse card insertion protection Unique card slot design (patented) protects the connector from damage when the card is attempted to be inserted in reverse, allowing it to re-inserted correctly. 3. Effective ground and shield configuration 4-connection points of the metal cover to the printed circuit board assures secure connection of the ground circuit and provides EMI protection. 4. Rigid and strong construction Despite its small size, high-strengths materials used in the connectors produced a strong and rigid structure. 5. Card detection switch The card detection switch is Normally Open ◆ DM3AT and DM3BT (Push - Push, with ejection mechanism)

• Card fall-out prevention Built-in card tray and the unique push insertion-push ejection mechanism (patented) prevent accidental card ejection or fall- out. Despite its small size the connectors will eject the card to a distance of 4.0 mm, allowing easy hold and removal of the card.
• Exposed termination leads Easy inspection and rework of the solder termination joints. ◆ DM3CS (Hinge, Push-Pull, manual, without ejection mechanism)
• Simple and reliable card insertion Hinged metal cover provides location and guides the card during the insertion / removal. Closing of the cover confirms the electrical and mechanical connection with a tactile click sensation.
• Reliable contact with the card contact pads Unique contact design and card slide action will clean the contact areas of the card.
• Accessible termination areas Contact solder terminations may be inspected and reworked. ◆ DM3D (Push -Pull, manual, without ejection mechanism)
• Partial card insertion hold Card will not fall-out even when it is not fully inserted. Full insertion and electrical / mechanical connection is confirmed with a distinct tactile feel.
• Accessible termination areas An inner lead system that can be reworked is used in this design. Contact solder terminations may be inspected and reworked. Card insertion-ejection Push-Push Hinge-manual insertion/ ejection Push-Pull manual insertion/ ejection DM3AT DM3BT DM3CS DM3D 2~4 5~6 7~8 9~10 Series Image Page The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information.

DM3 Series●microSD™ Card Connectors DM3 AT – SF – PEJM5 ■Specifications(DM3 Series) Ratings Current rating: 0.5A Voltage rating: 125V AC Operating temperature range: -25ç to +85ç (Note 1) Storage temperature range : -40ç to +85ç (Note 2) Operating humidity range: RH 95% max. (No condensation) ■Ordering information 1 42 3 Measure at 500 V DC

500 V AC / 1 minute

Frequency: 10 to 55 Hz, single amplitude of 0.75 mm, 3 directions for 2 hours 96 hours at of 40 ± 2ç, and humidity of 90 to 95% -55ç ➝ 5 to 35ç ➝85ç ➝ 5 to 35ç Times: 30 min. ➝ 5 min. ➝ 30 min. ➝ 5 min. 5 cycles 10,000 cycles, 400 to 600 cycles per hour (DM3AT, DM3B) 5,000 cycles, 400 to 600 cycles per hour (DM3C, DM3D) Reflow : At the recommended temperature profile Manual soldering : 350ç for 3 seconds 1000 Mø min. (Initial value) No flashover or insulation breakdown 100mø max. (Initial value) No electrical discontinuity of 100 ns or longer No damage, cracks or parts dislocation. Contact resistance: 40 mø max. (change from initial value) Insulation resistance: 100 Mø min. No damage, cracks or parts dislocation. Contact resistance: 40 mø max. (change from initial value) Insulation resistance: 100 Mø min. No damage, cracks or parts dislocation. Contact resistance: 40 mø max. (change from initial value) No deformation of components affecting performance. 1. Insulation resistance 2. Withstanding voltage 3. Contact resistance 4. Vibration 5. Humidity 6. Temperature cycle 7. Durability 8. Resistance to soldering heat Item Specification Conditions Note 1: Includes temperature rise caused by current flow. Note 2. The term "storage" refers to products stored for long period prior to mounting and use. Series name: DM3 Connector type : AT Push-Push (ejection mechanism), Top board mounting (Standard) BT Push-Push (ejection mechanism), Bottom board mounting (Reverse) CS Hinge, Push-Pull (no ejection mechanism), Top board mounting (Standard) D Push-Pull (no ejection mechanism), Top board mounting (Standard) Number of contacts : 8 Termination type : SF Right-angle SMT(Standard) DSF Right-angle SMT(Reverse) Card ejection code : PEJM5, PEJS (Push insert/push eject) None : Manual card insertion/ejection ■Materials and Finishes Remarks UL94V-0 Part Material Finish Insulator Contacts Guide cover Other components LCP Copper alloy Stainless steel Copper alloy Stainless steel Piano wire (DM3AT) (DM3BT) (DM3AT, DM3BT) (DM3BT) Color: Black Contact area: Gold plated Lead area: Gold plated Lead area: Gold plated Nickel plated DM3AT, DM3BT Remarks UL94V-0 Part Material Finish Insulator Contacts Guide cover LCP Copper alloy Stainless steel Color: Black Contact area: Gold plated Lead area: Gold plated Tin plated DM3CS, DM3D The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information.

DM3 Series●microSD™ Card Connectors

• Example of applications DM3AT-SF-PEJM5 Portable device ■Recommended PCB mounting pattern 8.65 1.3 15.1 C0.15 14.1MAX 2.7 0.8 2.8 1.9(3.2) 3.259.1 9.25MAX 10MIN 7.7 1.55 P=1.1 0.7 1.2 14.5 0.15MIN 1.2 3.7 9.9 14.05 7.9MIN 0.7 13.3MIN 0.58.2MIN 4.4MAX 6MIN 0.15 5.7MAX 8.9MIN ɹ ̡̡̘̘1 CL indicates the center line of the microSD card slot. No conductive traces. Card inserted Card detection switch Without the card Open Closed (A) (B) (A) (B) Note All dimensions: mm ■DM3AT Push-Push (ejection mechanism), Top board mounting (Standard) Part number CL No. DM3AT-SF-PEJM5 609-0031-0 CARD DETECTION SWITCH(B) #5(CLK) #4(VDD) #3(CMD) #2(CD/DAT3) #1(DAT2) CARD DETECTION SWITCH(A) microSD CARD 2.9ʶ0.15 (3.2) (7.35) (15) (0.8) (16.75):CARD OVER STROKE POSITION(17.55):CARD LOCK POSITION (21.55):CARD EJECT POSITION 15.95 13.85 (11) (5.5) 15.95 LC 1.68 #8(DAT1) #7(DAT0) #6(VSS) All dimensions: mm The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information.

DM3 Series●microSD™ Card Connectors ■Packaging Specifications (16.35) 14.2 20Ø1.5 1.75 2 P=4 UNREELING DIRECTION 28.4 (3.2)

• Embossed carrier tape dimensions (1,500 pieces per reel)
• Reel Dimensions 32.4 Ø380 Ø80 START PORTION EQUIPPED WITH COMPONENTS EMBOSSED CARRIER TAPE OVAL CIRCLE TOP COVER TAPE EMPTY(160mm MIN) EMPTY(100mm MIN) END LEADER(400mm MIN)TRAILER All dimensions: mm The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information.

DM3 Series●microSD™ Card Connectors

• Example of applications ■DM3BT, Push-Push (ejection mechanism), Bottom board mounting (Reverse) Part number CL No. DM3BT-DSF-PEJS 609-0029-9 CL (5.5) (11) microSD CARD #8(DAT1) #7(DAT0) #6(VSS) #5(CLK)#4(VDD) #3(CMD) #2(CD/DAT3) #1(DAT2)15.95 (21.55)CARD EJECT POSITION (17.55)CARD LOCK POSITION (16.75)CARD OVER STROKE POSITION (15) (0.55) 16.05 CARD DETECTION SWITCH(A) CARD DETECTION SWITCH(B) 13.85 15.45 2.9±0.15 2.7MAX 6.7MAX 2.38MAX (3.2) 1.83 15.1 (6.5) ■Recommended PCB mounting pattern 13.3 9.7 0.7 1.2 0.7 P=1.1 7.7 10MIN 9.25MAX 8.93.05 1.9 1.2 3.2 0.8 14.75 0.2 1.4 14.3 3.5 7.7MIN 0.35MIN 1ʶ0.05 1.9 1.5 8.65 0.5 ̘0.15 (3.2) ̡̘ 1 CL indicates the center line of the microSD card slot. Oblique-hatched area is projection of contact. Card inserted Card detection switch Without the card Open Closed (A) (B) (A) (B) No conductive traces.4 Note All dimensions: mm All dimensions: mm DM3BT-DSF-PEJS Portable device The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information.

DM3 Series●microSD™ Card Connectors 32.4 CIRCLE TRAILER OVAL START Ø80 Ø380 EMPTY(160mm MIN) EMBOSSED CARRIER TAPE PORTION EQUIPPED WITH COMPONENTS LEADER(400mm MIN) END EMPTY(100mm MIN) TOP COVER TAPE ■Packaging Specifications (3.75) UNREELING DIRECTION 28.4 Pʹ4 1.75 Ø1.5 20 14.2 (16.35)

• Embossed carrier tape dimensions (1,200pieces per reel)
• Reel Dimensions All dimensions: mm The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information.

DM3 Series●microSD™ Card Connectors ■Recommended PCB mounting pattern 5.4MIN 7.8MAX 7.8MAX 0.55MIN8.25MIN 2.9MAX (13.8) (14.1) 12.4 4.1MIN 3.5MAX 10.1MIN 9.5MAX 7.7 Pʹ1.1 0.7 1.4 1.2 1.5 ̍ 9.3 2.8 2.6 12.9 2.6 12.9 14.4 1.22.72.7 1.656.3 1.4 (3.2) ̡̘1 3 3 3 GND(1) GND(2) GND(3) GND(4) GND(1) GND(2) GND(3) GND(4) ClosedOpen CL indicates the center line of the microSD card slot. No conductive traces. Card inserted Card detection switch Without the card Note

• Example of Use applications ■DM3CS, Hinge, Push -Pull (no ejection mechanism), Top board mounting (Standard) Part number CL No. DM3CS-SF 609-0032-3 0.1 13.9 (15.45):LOCK POSITION 14.1 13.8 (6.9) (11) (0.93) (1.78) (5.5) (0.2) 1.83 CARD DETECTION SWITCH microSD CARD ˌ8(DAT1) ˌ7(DAT0) ˌ6(VSS) ˌ5(CLK) ˌ4(VDD) ˌ3(CMD) ˌ2(CD/DAT3) ˌ1(DAT2) All dimensions: mm All dimensions: mm DM3CS-SF (shown open for card insertion) DM3CS-SF (shown closed, with card inserted) Portable device The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information.

DM3 Series●microSD™ Card Connectors Ø80 Ø380 32.4 START CIRCLE OVAL EMPTY(160mm MIN) EMPTY(100mm MIN) TOP COVER TAPE END EMBOSSED CARRIER TAPE PORTION EQUIPPED WITH COMPONENTS LEADER(400mm MIN)TRAILER ■Packaging Specifications (3.4) 14.2 20Ø1.5 1.75 2 Pʹ4 28.4 UNREELING DIRECTION

• Embossed carrier tape dimensions (1,300pieces per reel)
• Reel Dimensions All dimensions: mm The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information.

DM3 Series●microSD™ Card Connectors

• Example of applications ■Recommended PCB mounting pattern 1.51.75 1.5 1.1 7.7 7.5 9.15 10.7 6.85 1.5 8.35 0.55 9.4 10.9 0.80.8 8.1MIN 1.85 0.4MIN 2.55MAX ( 4.5 ) 5.05MIN 4MAX 6MIN 8.2MAX 10.2MIN 1.4 CL 1 CL indicates the center line of the microSD card slot. No conductive traces. Card inserted Card detection switch Without the card Open Closed (A) (B) (A) (B) Note ■DM3D, Push-Pull (no ejection mechanism), Top board mounting (Standard) Part number CL No. DM3D-SF 609-0025-8 microSD CardCard Center ˌ1(DAT2) ˌ2(CD/DAT3) ˌ3(CMD) ˌ4(VDD)ˌ5(CLK) ˌ6(VSS) ˌ7(DAT0) ˌ8(DAT1) Card Detection Switch (B) Card Detection Switch (A) (15.8):CARD FULLY INSERTED 0.9 (4.5) (6) (11) 2.7 1.55 11.45 11.45 11.95 3.35 (5.5) (15) (0.7) 9.65 All dimensions: mm All dimensions: mm DM3D-SF Portable device The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information.

DM3 Series●microSD™ Card Connectors Lead section (400mm min.) Mounting section End section Top cover tape Blank section (100mm min.) Embossed carrier tape Blank section (160mm min.) 24.4 Ø380 Ø80 Unreeling direction ■Packaging Specifications Unreeling direction2 22.25 11.5 1.75 Ø1.5 16 ( 11.85 ) P=4

• Embossed carrier tape dimensions (2,000pieces per reel)
• Reel Dimensions All dimensions: mm The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information.

DM3 Series●microSD™ Card Connectors

• Refer to applicable Operation Manual listed below for additional precautions. Series DM3AT Series DM3BT Series DM3CS Series DM3D Series ETAD-F0345 ETAD-F0324 ETAD-F0335 ETAD-F0353 Operation Manual Number ■Recommended temperature profile ■Precautions 1. Do not immerse or clean the entire connector with cleaning solutions as this may affect proper operation of the ejection mechanism and electrical performance of the connector 2. Do not apply excessive force to the connector when handling or after installation on the PC board. 3. The connectors will reliably connect and operate with the correctly inserted microSDTM cards. Follow the correct insertion / ejection procedure for the specific connector in use. Attempts of incorrect insertion of the card may cause damage to the connector or the card. 4. The connector must be correctly mounted on the PC board before the card can be inserted. Do not insert the card in the un-mounted connector. 5. Mounting on the Flexible Printed Circuit (FPC) To assure correct performance it is recommended that a flat reinforcement plate 0.3 mm min. thick be used under the FPC. 6. Small visible residual manufacturing fluids or tooling marks do not affect connector's performance. 7. Repeated insertions and removal of the cards may leave some marks on the card itself. This will have no affect on the connector performance. HRS test condition Solder method :Reflow, IR/hot air Environment :Room air Solder composition :Paste, 96.5%Sn/3.0%Ag/0.5%Cu (Senju Metal Industry, Co., Ltd.'s Part Number:M705-GRN360-K2-V) Test board :Glass epoxy 60mm∞100mm∞1.0mm thick Metal mask :0.12mm thick Number of reflow cycles : 2cycles max. The temperature profiles shown are based on the above conditions. In individual applications the actual temperature may vary, depending on solder paste type, volume / thickness and board size / thickness. Consult your solder paste and equipment manufacturer for specific recommendations. Temperature 90 to 120 seconds Preheating seconds Soldering Time (Seconds) (ç) 100 150 200 250 150ç 200ç 230ç min. Peak:250ç MAX The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information.