DM2B-DSFW-PEJ-D1S

DM2 HIROSE | Alldatasheet

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Technical content

20.8 23.2 2.2 23.5 4.00.9 21.1 23.3 2.2 23.6 4.00.9 DM2Other suppliers Card retention springs 12008.4 miniSDTM Card Connectors DM2 Series ■Features 1. Extremely small size Board footprint as well as the length, width and height of the connector has been reduced in order to minimize use of valuable space in today’s miniature devices. With the miniSD™ card inserted the overall length is shortest in the industry. 2. Push-in / Push-out card ejection Inserted card is securely held in place with an approximate force of 4 N, assuring reliable connection and retention in the connector, even when subjected to accidental shock. When pushed again, the card will self-eject to distance of 4 mm, allowing safe removal from the connector. 3. Protection against card loss Built-in card retention springs will keep the card inserted when card may be accidentally partially pulled-out. 4. Protection against reverse card insertion The ejection mechanism is designed not to lock when the card is inserted in reverse, alerting the user to insert it correctly. Reverse card insertion will not damage the contacts. 5. Effective grounding and shielding The VSS contacts connect directly to the metal cover, assuring superior ground connection (Patents pending.) In addition, metal cover will connect with the PC board surface at four points, providing highly effective grounding and shielding of the connector. 6. Durable, load-resistant construction While miniature in size and lightweight, the use of metal cover assures it’s reliable and stable performance. 7. Two-point contact Two-point contact offers high contact reliability. 8. Built-in card detection switch The card detection switch is a normally closed, opening when the card is inserted. 9. RoHS Compliant All components and materials comply with the requirements of EU Directive 2002/95/EC. ■Applications Mobile phones, digital cameras, PDA’s and any other portable device requiring use of miniSDTM memory card. *miniSDTM is a trademark of the SD Card Association. Extremely small size (Standard – top board mounting) DM2A Extremely small size (Reverse – bottom board mounting) DM2B Card ejection prevention mechanism Two-point contact PCB PCB The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information. All non-RoHS products have been discontinued, or will be discontinued soon. Please check the products status on the Hirose website RoHS search at www.hirose-connectors.com, or contact your Hirose sales representative.

DM2 Series●miniSDTM Card Connectors Series name :DM2 Connector type A:Standard receptacle B:Reverse receptacle Number of contacts :11 Termination type SFW: Right angle SMT (Standard mounting) DSFW: Right angle SMT (Reverse mounting) Card ejection code PEJ: Push insert/push eject Ground terminal type D1S: SMT - at 4 points D1S: Through hole at 2 points + SMT at 4 points ■Ordering information 1 42 3 5 ■Product Specifications ■Materials / Finish Ratings Current rating: 0.5A DC Voltage rating: 125V AC Operating temperature range: -25çto +85ç(Note 1) Storage temperature range : -40çto +85ç(Note 2) Operating humidity range: Relative humidity 95% max. (No condensation) 500V DC 500V AC / one minute 100mA DC Frequency: 10 to 55 Hz, single amplitude of 0.75mm, 2 hours / 3 axis 96 hours at 40ç±2ç and humidity of 90% to 95%. Temperature: -55ç➝+5ç to +35ç➝+85ç➝+5ç to +35ç Duration: 30➝5➝30➝5 (Minutes) 5 cycles 10000 cycles at 400 to 600 cycles per hour Reflow: At the recommended temperature profile Manual soldering: 350ç for 3 seconds 1000 Mø min. (Initial value) No flashover or insulation breakdown. 100mø max. (Initial value) No electrical discontinuity of 100 ns or more. Contact resistance : 40mø max. from initial value Insulation resistance : 100Mø min. Contact resistance : 40mø max. from initial value Insulation resistance : 100Mø min. Contact resistance : 40mø max. from initial value No deformation of components affecting form, fit or function. 1. Insulation resistance 2. Withstanding voltage 3. Contact resistance 4. Vibration 5. Humidity 6. Temperature cycle 7. Durability (mating/unmating) 8. Resistance to soldering heat Item Specification Conditions Note 1: Includes temperature rise caused by current flow. Note 2: The term "storage" refers to products stored for long period of time prior to mounting and use. Operating temperature r ange and humidity range covers non-conducting condition of installed connectors in storage, shipment or during transportation. Remarks UL94V-0 Component Material Finish Insulator Contacts Cover Other components Heat resistant thermoplastic compound Phosphor bronze Copper alloy Stainless steel Steel wire Color: Black Contact area : Gold plated Termination area : Gold plated Nickel plated The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information. All non-RoHS products have been discontinued, or will be discontinued soon. Please check the products status on the Hirose website RoHS search at www.hirose-connectors.com, or contact your Hirose sales representative.

1.2±0.05 1.2±0.050.7±0.05 P=1.3±0.03 13±0.05 0.7±0.05Card detection switch(A) Card detection switch(B) 4.45±0.05 18.15±0.05 1.1±0.051.1±0.05 3±0.05 1.8±0.05 1.8±0.053±0.05 17.1±0.05 8.9±0.05 4.9±0.05 0.7±0.05 1.8±0.05 4.05±0.05 0.7 13.7 3.3 6.3 No conductive traces Terminal Card detection switch When card is ejected When card is inserted OPEN (A)( B)(A)( B) Indicates the center line of card slot.1 C CLOSED ■PCB mounting pattern DM2 Series●miniSDTM Card Connectors ■Standard (Top board mounting) Part number CL No. Packaging RoHS DM2A-SFW-PEJ-S 609-0010-0 800 pcs. per reel YES C 0.4 0.4 1.2 2.4 1.2 2.4 #9(DAT2) #1(DAT3) #2(CMD) #3(VSS) #10(NC) #11(NC) #4(VDD) #5(CLK)#6(VSS) #7(DAT0) #8(DAT1) P=1.3 0.4 0.4 1.8 miniSD card outline GND GND GND GND ( 0.55 ) 23.2 20.8 20.6 ( 11.6 ) ( 1.1 ) ( 22.6 ):Card pushed-in for ejection ( 23.5 ):Card fully inserted ( 27.5 ):Card ejected 2.2 0.4 5.6 9.6 9.6 17.8 17.8 17.6 17.6 ( 10 ) ( 20 ) The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information. All non-RoHS products have been discontinued, or will be discontinued soon. Please check the products status on the Hirose website RoHS search at www.hirose-connectors.com, or contact your Hirose sales representative.

DM2 Series●miniSDTM Card Connectors P=1.3±0.03 13±0.05 0.7±0.05 1.2±0.05 1.2±0.05 0.1±0.05 2.7±0.05 1±0.05 1±0.05 0.8±0.05 0.8±0.05 1.6±0.05 1.6±0.05 Card detection switch(A) Card detection switch(B) 2±0.05 4±0.05 1.1±0.0519.8±0.05 19.8±0.05 Terminal GND Card detection switch When card is ejected When card is inserted OPENCLOSED (A)( B)(A)( B) Indicates the center line of card slot.1 C ■PCB mounting pattern ■Reverse (Bottom board mounting) Part number CL No. Packaging RoHS DM2B-DSFW-PEJ-S 609-0009-1 800 pcs. per reel YES C ( 22.7 ):Card pushed-in for ejection ( 23.6 ):Card fully inserted ( 27.6 ):Card ejected 0.6 #9(DAT2) #1(DAT3) #2(CMD) #3(VSS) #10(NC) #11(NC) #4(VDD) #5(CLK) #6(VSS) #7(DAT0) #8(DAT1) GND GND GND GND 17.9 (16) (9.6) ( 10 ) (5.6) (5.6) (8.6) 4.85 (11.65 ) (1.05 ) (5.75 ) 0.4 0.7 0.4 P=1.3 0.4 ( 0.25 ) 3.3 0.6 20.9 2.2 4-(R0.4) 0.4 0.4 ( 20 ) 23.3 21.1 miniSD card outline 20.4 20.4 The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information. All non-RoHS products have been discontinued, or will be discontinued soon. Please check the products status on the Hirose website RoHS search at www.hirose-connectors.com, or contact your Hirose sales representative.

DM2 Series●miniSDTM Card Connectors ■Reverse (Bottom board mounting - additional locating tabs) Part number CL No. Packaging RoHS DM2B-DSFW-PEJ-D1S 609-0012-6 800 pcs. per reel YES 4.75+0.1 23.1+0.1 4-R 0.5 4-R0.3 2.7±0.05 1±0.05 0.8±0.05 4.45±0.05 0.1±0.05 1±0.050.8±0.05 18.05±0.05 14.2±0.05 13.9±0.05 2-0.6±0.05 2-1±0.05 2-0.9±0.05 2-1.3±0.05 P=1.3±0.03 13±0.05 0.7±0.05 1.2±0.05 1.2±0.05 1.6±0.05 1.6±0.05 2±0.05 4±0.05 1.1±0.0519.8±0.05 19.8±0.05 2Card detection switch(A) Card detection switch(B) Terminal Card detection switch When card is ejected When card is inserted OPENCLOSED (A)( B)(A)( B) Indicates the center line of card slot.1 C ■PCB mounting pattern C 0.6 17.9 ( 10 ) 4.85 ( 11.65 ) ( 1.05 ) ( 5.75 ) P=1.3 0.4 0.6 20.9 0.4 0.4 ( 20 ) 23.3 21.1 miniSD card outline 20.4 20.4 23.1 0.20.2 3.3 0.4 GND 0.4 GND 0.4 14.5 ( 0.25 ) 2.2 #9(DAT2) #1(DAT3) #2(CMD) #3(VSS) #10(NC) #11(NC) #4(VDD) #5(CLK) #6(VSS) #7(DAT0) #8(DAT1) 0.4 0.4 0.7 0.4

3 GND

14.8 ( 22.7 ):Card pushed-in for ejection ( 23.6 ):Card fully inserted ( 27.6 ):Card ejected The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information. All non-RoHS products have been discontinued, or will be discontinued soon. Please check the products status on the Hirose website RoHS search at www.hirose-connectors.com, or contact your Hirose sales representative.

DM2 Series●miniSDTM Card Connectors Preheating Time (Seconds) 90 sec. to 120 sec. 150ç 200ç 230ç min Peak:250ç MAX Soldering 50 sec. 250 (ç) 200 150 100 Temperature ■Recommended temperature profile ■Precautions and recommendations 1. Washing recommendations Do not wash the entire connector. Intrusion of washing fluids in the connector may affect the operation of the ejection mechanism, card insertion or electrical performance. If required, wash only soldered joints, exercising caution not to allow intrusion of washing solution inside the connector. 2. Use correct card The connector is designed for miniSDTM card. Although it will withstand reverse card insertion attempts without damage, care should be taken NOT to subject it to extreme insertion forces, angle insertion or card twisting. 3. Do not apply excessive external force Application of excessive external force during card insertion or removal may cause malfunction or damage to the connector or card. <Recommended conditions> Reflow system : IR/Hot air Environment : Room air Solder composition : Paste, 96.5%Sn / 3.0%Ag / 0.5%Cu (M705-221CM5-42-10.5 manufactured by Senju Metal Industry Co., Ltd.) Test board : Glass epoxy 60mm x 100mm x 1mm thick Metal mask thickness : 0.12 mm This temperature profile is based on the above conditions. In individual applications the actual temperature may vary, depending on solder paste type, volume/thickness and board size/thickness. Consult your solder paste and equipment manufacturer for specific recommendations. Embossed carrier tape Top tape cover End section Mounting section Lead section (400mm min.) Blank section (160mm min.) Blank section (100mm min.) ■Packaging Specifications

• Embossed carrier tape dimensions (800 pieces per reel) 32.4+2 Ø380±2 Ø80±2 ( 3.75 ) ( 2.65 ) Unreeling direction 2±0.1 32±0.1Ø1.5 +0.10 14.2±0.1 32±0.3 1.75±0.1 28.4±0.1 P=4±0.1
• Reel dimensions The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information. All non-RoHS products have been discontinued, or will be discontinued soon. Please check the products status on the Hirose website RoHS search at www.hirose-connectors.com, or contact your Hirose sales representative.