DM1B-DSF-PEJ

DM1AA-SF-PEJ HIROSE | Alldatasheet

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Technical content

2003.4 I Features 1. Withstands higher force of card insertion Metal cover extends over the back of the connector allowing it to withstand force of up to 400 N (static load) when dropped or accidentally hit. 2. No damage to the card when accidentally pulled-out The connectors will release the card when a moderate pull-out force of about 4 N is applied. There will be no damage to the lock components and all connector functions will not be affected. 3. Accidental card fall-out prevention Built-in lock feature holds the card securely in place. 4. Reliable Card Insertion and Withdrawal Built-in Push-in / Push-out ejection mechanism assures simple and reliable card insertion and withdrawal. 5. Designed to accept Secure Digital I/O card (Built-in Ground Contact) The connector allows use of various expansion modules, including the Bluetooth communication modules. I Applications Notebook PC's, digital cameras, PDA's, audio/video equipment and other devices utilizing SD I/O cards. Card Standard type Withstands higher force of card insertion. Metal cover extends over the back of the connector. Card Reverse type Metal cover extends over the back of the connector. No damage to the card when accidentally pulled-out. Accidental card fall-out prevention

500 V DC1000 M ohms min. (Initial value)1. Insulation resistance Rating Current rating 0.5A DC Voltage rating 125 V AC Operating temperature range:-25ç to +85ç(Note 1) Storage temperature range:-40çto +85ç(Note 2) Operating humidity range : Relative humidity 95% max. (No condensation) I Product Specifications Item Specification Conditions 500 V AC / one minuteNo flashover or insulation breakdown 2. Withstanding voltage 100mA DC 100 m ohms max. (Initial value)3. Contact resistance Frequency: 10 to 55 Hz, single amplitude of 0.75 mm, 2 hours / 3 axis No electrical discontinuity of 100 ns or more4. Vibration 96 hours at temperature of 40ç±2çand humidity of 90% to 95% Contact resistance: 40 m ohms max. from initial value Insulation resistance: 100 M ohms min.5. Humidity Temperature: -55ç/ +5ç to +35ç/ +85ç/ +5ç to +35ç Duration: 30 / 5 / 30 / 5 (Minutes) 5 cycles Contact resistance: 40 m ohms max. from initial value Insulation resistance: 100 M ohms min.6. Temperature cycle 10000 cycles at 400 to 600 cycles per hourContact resistance: 40m ohms max. from initial value7. Durability (mating/un-mating) Reflow: At the recommended temperature profile Manual soldering: 300ç for 3 seconds No deformation of components affecting performance.8. Resistance to soldering heat Note1: Includes temperature rise caused by current flow. Note2: The term "storage" refers to products stored for long period of time prior to mounting and use. Operating Temperature Range and Humidity range covers non- conducting condition of installed connectors in storage, shipment or during transportation. I Materials I Ordering information 1 2 3 4 Component Material Finish Remarks Insulator Heat resistant thermoplastic compound Color: Black UL94V-0 Contacts Phosphor bronze Contact area: Gold plating Others Stainless steel Piano wire Series name :DM1 Connector type :AA : Standard receptacle :B : Reverse receptacle Terminal type SF : Right angle surface mount DSF : Reverse right angle surface mount Eject mechanism codes PEJ : Card Push insert/Push withdraw

1.6±0.05 1.2±0.05 25.4±0.05 15±0.054.125±0.05 P=2.5±0.05 9-1.1±0.05 1.35±0.05 1.7±0.05 22.4±0.05 2±0.05 1.2±0.05 23.2±0.05 4.55±0.05 2+0.1 04-2+0.1 2-Ø1.3 +0.10 2+0.1 2+0.1 3-1+0.1 20.75±0.05 18.15±0.05 9.2±0.05 Card detection switch Write protection switch 9.2 18.15 3-0.5 20.75 No.8 No.7 No.6No.5 No.4 No.3No.2 No.1 No.9 1 CL 1 28 13.2 9.75 8.05 t=0.2,W=0.6 15 5.625 P2.5 2.9 22.4 2-Ø1.2 0.55 30.5 2.523.2 4.554-1.5 1 CL 1 CL 1 CL 24.15(Card slot dimension) Weight:2.2g When card is ejected When card is ejected When card is inserted When card is inserted WRITE PROTECT WRITE ENABLE Card detection switch Write protection switch OPEN CLOSE OPEN OPEN CLOSE 1 CLindicates the center line of card slot. SD Card Card pushed-in for insertion Card fully inserted Card ejected (Card ejected dimension) SD Card SD Card I Standard type Part number DM1AA-SF-PEJ(21) 609-0004-8-21 HRS No. BPCB mounting pattern BCard insertion/withdrawal dimensions

(R0.6) (R0.4) (R0.6) (R0.4) (R0.6) (R0.4) 1.7+0.1 0 (Land) 1.2+0.1 (Land) 1.3+0.1 (Through hole) 0.8+0.1 (Through hole) 1.9+0.1 -0.1 (Land) 1.2+0.1 (Land) 1.5+0.1 0 (Through hole) 0.8+0.1 0 (Through hole) 2.4+0.1 -0.1 (Land) 1.2+0.1 (Land) 2+0.1 0 (Through hole) 0.8+0.1 0 (Through hole) CARD DETECT COMMON FOR CD & WP WP A A C B 5.62 11.2±0.05 9.75±0.05 0.8±0.05 1.4±0.05 8.05±0.05 12.5±0.05 1.25±0.05 8-1.1±0.05 14.13±0.05 11.93±0.05 2.03±0.05 1.4±0.05 23.48±0.05 26.98±0.05 28.5±0.05 14.25±0.05 0.8±0.05 28.25±0.05 Center of Card dimension I Reverse type BPCB mounting pattern (0.25) (1.77) No.8 No.2 No.1 No.9 (14.35) 18.68 2 16.85 6-0.651.5 1.85 1.050.35 27.22 27.45 8.63 1 CL 1 CL 6.95 7.65 5.62 2.9 1 CL 1 CL 29.9 SD Card (5):Card pushed for insertion (6):Card fully inserted 10:Card ejected(Card ejected dimension) Weight:2.1g When card is ejected OPEN OPEN CLOSE WRITE PROTECT WRITE ENABLE Card detection switch When card is ejected When card is ejected When card is ejected Write protection switch OPEN CLOSE indicates the dimension of DIP terminals. CLindicates the center line of the card slot. Part number DM1B-DSF-PEJ 609-0003-5 HRS No.

2±0.15 4±0.1 1.75±0.1 Ø1.5 +0.10 36±0.1 3.4±0.3 4.35±0.3 44±0.3 40.4±0.1 20.2±0.1 Unreeling direction BPackaging specifications G Embossed Carrier Tape Dimensions (Standard type) 450 pieces per reel 2±0.15 3.4±0.3 1.75±0.1 44±0.3 40.4±0.1 20.2±0.1 Ø1.5 +0.10 Unreeling direction G Embossed Carrier Tape Dimensions(Reverse type) 450 pieces per reel End section Blank section(160mm min.) Mounting section(450) Lead section (400mm min.) Blank section (100mm min.)Embossed carrier tape Top cover tape (Ø380) (Ø150) D Unreeling direction 44.4+2 G Reel dimensions

100ç 150ç 200ç 300ç 50S0S 100S 150S 200S MAX240ç 220ç Preheating Soldering Preheating: 150ç 30 to 90 sec. IR Reflow Conditions Soldering : 235±5ç 10 sec. Max. Soldering : 220ç 10 to 20 sec. I Recommended Temperature Profile Recommended Conditions Reflow system : IR reflow Solder : Paste type 63 Sn/37 Pb(Flux content 9 wt%) Test board : Glass epoxy 60mm x 100mm x 1.6 mm thick Metal mask thickness: 0.15 mm Recommended temperature profile. The temperature may be slightly changed according to the solder paste type and thickness.