DIR-1A HUAXINAN | Alldatasheet

Document overview

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Technical content

  1. Epoxy molded Dual-In-Line package. 2. Low profile, mounting space compatible with DIP IC. 3. Completely washable. 4. Provide high speed, miniature and cost effective switching solution. Contact Rating Load Type DIR/DID Rated Load (Resistive) 0.5A 100VDC 0.2A 30VDC Rated Carrying Current 0.5A 0.2A Max. Allowable Voltage 100 VDC 30 VDC Max. Allowable Current 0.5A 0.2A Max. Allowable Power Force 10 VA 3 VA Min. Switching Load DC 1V, 1mA DC 1V, 1mA Contact Material Ru Alloy Ru Alloy Contact Form SPST/DPST SPDT Application Security System, Modem and Telecommunication Products. Performance (at Initial Value) 100mA, 6VDC Dielectric Strength: 4,000 VDC (4 Lead) Temperature Range: Life Expectancy:

8 Operations at

ref. 10VDC, 10mA Safety Standard & File Number

Coil Specification (at 20 °° °°C) Coil Sensitivity Nominal Voltage (VDC) Nominal Current (mA) Coil Resistance (Ω ±10%) Power Consumption (mW) Pull-In Voltage (VDC) Drop-Out Voltage (VDC) Maximum Allowable Voltage (VDC) 5 10 500 50 3.75 0.8 16 12 12 1,000 144 9.00 1.0 20 1A 24 11 2,150 268 18.00 2.0 32 5 36 140 179 3.75 0.8 11 12 24 500 288 9.00 1.0 20 2A 24 11 2,150 268 18.00 2.0 32 5 10 500 50 4.20 0.6 6 12 12 1,000 144 9.00 1.0 14.5 1B 24 11 2,150 268 18.00 2.0 29 5 25 200 125 3.75 0.8 11 12 24 500 288 9.00 1.0 20 1C 24 11 2,150 268 18.00 2.0 32

Ordering Information

Contact Form: A: One Form A B: One Form B C: One Form C Coil Voltage: 05: 5V, 12: 12V, 24: 24V Number of Pole: 1: One Pole 2: Two Poles (Make Contact Only) Lead Number: 4: 4 Leads 8: 8 Leads Terminal shape: S: Standard (DIP) C: Lead 2 &13 are connected (DIP) M: Standard (SMD) N: Lead 2 & 13 are connected (SMD) Type: DIR: Without Diode DID: With Diode Classification Model DIR/DID Terminal shape DIP SMD Lead 2 &13 Connected Disconnected Connected Disconn ected Lead Type 4 Leads 8 Leads 4 Leads 8 Leads 4 Leads 8 Leads 4 Leads 8 Leads Contact Form - 1A/1B/1C/2A 1A 1A/1B/1C/2A - 1A/1B/1C/2A 1A/1B/1C/2A 1A/1B/1C/2A Ordering Type - DIR-C8-1□□ A DIR-C8-1□□ B DIR-C8-1□□ C DIR-C8-2□□ A DID-C8-1□□ A DIR-C8-1□□ C DID-C8-2□□ A DID-C8-1□□ B DIR-S4-1□□ A DID-S4-1□□ A DIR-S8-1□□ A DIR-S8-1□□ B DIR-S8-1□□ C DIR-S8-2□□ A DID-S8-1□□ A DID-S8-1□□ C DID-S8-2□□ A DID-S8-1□□ B DIR-N8-1□□ A DIR-N8-1□□ B DIR-N8-1□□ C DIR-N8-2□□ A DID-N8-1□□ A DID-N8-1□□ C DID-N8-2□□ A DID-N8-1□□ B DIR-M4-1□□ A DID-M4-1□□ A DIR-M8-1□□ A DIR-M8-1□□ B DIR-M8-1□□ C DIR-M8-2□□ A DID-M8-1□□ A DID-M8-1□□ C DID-M8-2□□ A DID-M8-1□□ B

Dimension ( ≤ 5mm+ 0.2mm, > 5mm + 0.3mm, the tolerance of PCB thru hole: +0.1mm) DIP SMD P.C.B. Layout P.C.B. Layout P.C.B. Layout P.C.B. Layout

(1 form A) (1 form B) (1 form C) (2 form A)