DHE1A JUXING | Alldatasheet
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Technical content
Features
Ideal for automated placement Glass passivated chip junctions Low forward voltage drop Low leakage current High forward surge capability High temperature soldering： 260℃/10 seconds at terminals Component in accordance to RoHS 2002/95/1 and WEEE 2002/96/EC Mechanical Date Case: JEDEC SOD-123FL molded plastic body over glass passivated chip Terminals: Solder plated, solderable per J-STD-002B and JESD22-B102D Polarity: Laser band denotes cathode end Weight: 0.017gram Maximum Ratings & Thermal Characteristics & Electrical Characteristics A = 25 °C unless otherwise noted) Symbol DHE A DHE DHE DHE DHE DHE DHE DHE 1M UNIT V RRM 50 100 200 300 400 600 800 1000 V V RMS 35 70 140 210 280 420 560 700 V V DC 50 100 200 300 400 600 800 1000 V I F(AV) A I FSM A V F V I R μA t rr nS R θJA ℃/ W T J , T STG Note1：Mounted on P.C.Board with 0.9*1.5mm copper pad area. I F(AV) 1.0 A V RRM
50 V to 1000 V
I FSM 25 A I R 5 μA V F 1.0V，1.3V，1.7V T J max. 150 °C Maximum repetitive peak reverse voltage Maximum RMS voltage Maximum DC blocking voltage Maximum average forward rectified current Peak forward surge current 8.3 ms single half sine- wave superimposed on rated load –55 to +150 Maximum instantaneous forward voltage at 1.0A 1.0 1.3 Maximum DC reverse current T A = 25 ℃ at Rated DC blocking voltage T A = 100℃ 1.7 5.0 100 Operating junction and storage temperature range Maximum reverse recovery time at I F = 0.5 A , I R = 1.0 A , I rr = 0.25 A 50 Thermal resistance from junction to ambient(Note1) 150 http://www.trr-jx.com
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