DGD21844M DIODES | Alldatasheet
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Floating High-side Driver in Bootstrap Operation to 600V Drives Two N-Channel MOSFETs or IGBTs in Half Bridge Configuration 1.4A Source / 1.8A Sink O utput Current Capability Outputs Tolerant to Negative Transients Programmable D ead Time to Protect MOSFETs Wide L ow-side Gate Driver and Logic Supply: 10V to 20V Wide Logic Supply Voltage Offset Voltage: -5V to 5V Logic Input (IN and SD*) 3.3V Capability Schmitt Triggered Logic Inputs with Internal Pull Down Undervoltage Lockout for High and Low Side Drivers Extended Temperature Range: -40°C to +125°C Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2) Halogen and Antimony free. “Green” Device (Note 3) Mechanical Data Case: SO- 14 (Type TH) Case Material: Molded Plastic . “Green” Molding Compound. UL Flammability Classification Rating 94V-0 Moisture Sensitivity: Level 3 per J-STD- 020 Terminals: Finish – Matte Tin Plated Leads, Solderable per MIL-STD-202, Method 208 Weight : 0.142 grams (Approximate) Ordering Information (Note 4) Part Number Marking Reel Size (inches) Tape Width (mm) Quantity Per Reel DGD21844MS14-13 DGD21844M 13 16 2,500 Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS ), 2011/65/EU (RoHS 2) & 2015/863/EU (RoHS 3) compliant. 2. See https://www.diodes.com/quality/lead- free/ for more information about Diodes Incorporated’s definitions of H alogen- and Antimony-free, "Green" and Lead-free. 3. Halogen- and Antimony- free "Green” products are defined as those which contain <900ppm bro mine, <900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds. 4. For packaging details, go to our website at https://www.diod es.com/design/support/packaging/diodes-packaging/. Marking Information SO-14 (Type TH) Top View Typical Configuration DGD21844M YY WW = Manufacturer’s Marking DGD21844M = Product Type Marking Code YY = Year (ex: 18 = 2018) WW = Week (01 to 53)
Document number: DS41250 Rev. 1 - 2 2 of 12 www.diodes.com August 2018 © Diodes Incorporated DGD21844M Pin Diagrams Pin Descriptions Pin Number Pin Name Function 1 IN Logic input for high-side and low-side gate driver outputs (HO and LO), in phase with HO (referenced to VSS)
2 SD* Logic input for shutdown (referenced to VSS), enabled low
3 VSS Logic ground
4 DT Programmable deadtime lead, referenced to VSS
5 COM Low-side return
6 LO Low-side gate drive output
7 VCC Low-side and logic fixed supply
8, 9, 10, 14 NC No Connection (No Internal Connection)
11 VS High-side floating supply return
12 HO High-side gate drive output
13 VB High-side floating supply
Top View SO-14 (Type TH)
Document number: DS41250 Rev. 1 - 2 3 of 12 www.diodes.com August 2018 © Diodes Incorporated DGD21844M Absolute Maximum Ratings (@TA = +25°C, unless otherwise specified.) Characteristic Symbol Value Unit High-side Floating Supply Voltage VB -0.3 to +624 V High-side Floating Supply Offset Voltage VS VB-24 to VB+0.3 V High-side Floating Output Voltage VHO VS-0.3 to VB+0.3 V Offset Supply Voltage Transient dVS / dt 50 V/ns Programmable Dead Time Pin Voltage VDT VSS-0.3 to VCC+0.3 V Logic and Low-side Fixed Supply Voltage VCC -0.3 to +24 V Low-side Output Voltage VLO -0.3 to VCC+0.3 V Logic Supply Offset Voltage VSS VCC-24 to VCC+0.3 V Logic Input Voltage (IN and SD*) VIN VSS-0.3 to VCC+0.3 V Thermal Characteristics (@TA = +25°C, unless otherwise specified.) Characteristic Symbol Value Unit Power Dissipation Linear Derating Factor (Note 5) PD 1.0 W Thermal Resistance, Junction to Ambient (Note 5) RθJA 120 °C/W Operating Temperature TJ +150 °C Lead Temperature (Soldering, 10s) TL +300 Storage Temperature Range TSTG -55 to +150 Note: 5. When mounted on a standard JEDEC 2-layer FR-4 board. Recommended Operating Conditions Parameter Symbol Min Max Unit High Side Floating Supply Absolute Voltage VB VS + 10 VS + 20 V High Side Floating Supply Offset Voltage VS (Note 6) 600 V High Side Floating Output Voltage VHO VS VB V Logic and Low Side Fixed Supply Voltage VCC 10 20 V Low Side Output Voltage VLO 0 VCC V Logic Input Voltage (IN and SD*) VIN VSS 5 V Programmable Dead Time Pin Voltage VDT VSS VCC V Logic Ground VSS -5 5 V Ambient Temperature TA -40 +125 ° C Note: 6. Logic operation for V S = -5V to +600V.
Document number: DS41250 Rev. 1 - 2 4 of 12 www.diodes.com August 2018 © Diodes Incorporated DGD21844M Parameter Symbol Min Typ Max Unit Conditions Logic “1” Input Voltage for HO & Logic “0” for LO VIH 2.5 — — V VCC = 10V to 20V Logic “0” Input Voltage for HO & Logic “1” for LO VIL — — 0.8 V VCC = 10V to 20V SD* Input Positive Going Threshold VSDTH+ 2.5 — — V VCC = 10V to 20V SD* Input Negative Going Threshold VSDTH- — — 0.8 V VCC = 10V to 20V High Level Output Voltage, VBIAS - VO VOH — — 1.4 V IO = 0mA Low Level Output Voltage, VO VOL — — 0.2 V IO = 20mA Offset Supply Leakage Current ILK — — 50 µ A VB = VS = 600V Quiescent VBS Supply Current IBSQ 20 60 150 µ A VIN = 0V or 5V Quiescent VCC Supply Current ICCQ 0.4 1.0 1.8 mA VIN = 0V or 5V Logic “1” Input Bias Current IIN+ — 25 60 µ A IN = 5V, SD* = 0V Logic “0” Input Bias Current IIN- — — 1.0 µ A IN = 0V, SD* = 5V VBS Supply Under-voltage Positive Going Threshold VBSUV+ 8.0 8.9 9.8 V — VBS Supply Under-voltage Negative Going Threshold VBSUV- 7.4 8.2 9.0 V — VCC Supply Under-voltage Positive Going Threshold VCCUV+ 8.0 8.9 9.8 V — VCC Supply Under-voltage Negative Going Threshold VCCUV- 7.4 8.2 9.0 V — Output High Short Circuit Pulsed Current IO+ 1.4 1.9 — A VO = 0V, PW ≤ 10µ s Output Low Short Circuit Pulsed Current IO- 1.7 2.3 — A VO = 15V, PW ≤ 10µ s Note: 7 . The VIN and IIN parameters are referenced to VSS and are applicable to the two logic input pins: IN and SD*. The V O and IO parameters are referenced to COM and are applicable to the respective output pins: HO and LO. Parameter Symbol Min Typ Max Unit Conditions Turn-on Propagation Delay tON — 680 900 ns VS = 0V Turn-off Propagation Delay tOFF — 270 400 ns VS = 0V or 600V Shut-down Propagation Delay tSD — 180 270 ns — Delay Matching, HO & LO Turn-on tDMON — — 90 ns — Delay Matching, HO & LO Turn-off tDMOFF — — 40 ns — Turn-on Rise Time tR — 40 60 ns VS = 0V Turn-off Fall Time tF — 20 35 ns VS = 0V Deadtime: tDT LO-HO & tDT HO-LO tDT 280 400 520 ns RDT = 0 4 5 6 µs RDT = 200k Deatime Matching = tDT LO-HO - tDT HO-LO tMDT — 0 50 ns RDT = 0 — 0 600 ns RDT = 200k
Document number: DS41250 Rev. 1 - 2 5 of 12 www.diodes.com August 2018 © Diodes Incorporated DGD21844M Timing Waveforms Deadtime tDT LO-HO = tON HO - tOFF LO tDT HO-LO = tON LO - tOFF HO Deadtime matching tMDT = tDT LO-HO - tDT HO-LO Delay matching tDM OFF = tOFF LO - tOFFT HO tON HO tOFF LO tDT LO-HO tOFF HO tON HO tDT HO-LO
Document number: DS41250 Rev. 1 - 2 6 of 12 www.diodes.com August 2018 © Diodes Incorporated DGD21844M Typical Performance Characteristics (@TA = +25°C, unless otherwise specified.)
Document number: DS41250 Rev. 1 - 2 7 of 12 www.diodes.com August 2018 © Diodes Incorporated DGD21844M Typical Performance Characteristics (Cont.)
Document number: DS41250 Rev. 1 - 2 8 of 12 www.diodes.com August 2018 © Diodes Incorporated DGD21844M Typical Performance Characteristics (Cont.)
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Document number: DS41250 Rev. 1 - 2 11 of 12 www.diodes.com August 2018 © Diodes Incorporated DGD21844M Package Outline Dimensions Please see http://www.diodes.com/package-outlines.html for the latest version. SO-14 (Type TH) Suggested Pad Layout Please see http://www.diodes.com/package-outlines.html for the latest version. SO-14 (Type TH) Note: For high voltage applications, the appropriate industry sector gu idelines should be considered with regards to creepage and clearance d istances between device Terminals and PCB tracking. b e Ø h 45° L Seating Plane Gauge Plane D E A 0.25 c C X Y SO-14 (Type TH) Dim Min Max Typ A 1.55 1.73 -- A1 0.10 0.25 -- b 0.35 0.51 -- c 0.190 0.248 -- D 8.56 8.74 8.61 E 5.84 6.20 6.00 E1 3.81 3.99 3.94 e -- -- 1.27 h -- -- 0.33 L 0.41 0.89 -- Ø 0 8 -- All Dimensions in mm Dimensions Value (in mm) C 1.27 C1 5.20 X 0.60 Y 2.20
Document number: DS41250 Rev. 1 - 2 12 of 12 www.diodes.com August 2018 © Diodes Incorporated DGD21844M IMPORTANT NOTICE DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRES S OR IMPLIED, WITH REGARDS TO THIS DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF ME RCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION). Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, correct ions or other changes without further notice to this document and any produ ct described herein. Diodes Incorporated does not assume any liability arising out of the application or use of this document or any product des cribed herein; neither does Diodes Incorporated convey a ny license under its patent or trademark rights, nor the rights of others. Any Custom er or user of this document or products described her ein in such applications shall assume all risks of such use and will agree to hold Diodes Incorpo rated and all the companies whose products are repres ented on Diodes Incorporated website, harmless against all damages. Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel. Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized application. Products described herein may be covered by one or more United States, international or foreign patents pending. Pro duct names and markings noted herein may also be covered by one or more United States, international or foreign trademarks. This document is written in English but may be translated in to multiple languages for reference. Only the English vers ion of this document is the final and determinative format released by Diodes Incorporated. LIFE SUPPORT Diodes Incorporated products are specifically not authorized for use as critical components in life support dev ices or systems without the express written approval of the Chief Executive Officer of Diodes Incorporated. As used herein: A. Life support devices or systems are devices or systems which: 1. are intended to implant into the body, or 2. support or sustain life and whose failure to perfor m when properly used in accordance with instructions for u se provided in the labeling can be reasonably expected to result in signi ficant injury to the user. B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or to affect its safety or effectiveness. Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their lif e support devices or systems, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of Diodes Incorporated products in such safety-criti cal, life support devices or systems, notwithstanding any devices- or systems-related information or support that may be provided by Diodes Incor porated. Further, Customers must fully indemnify Diodes Incorp orated and its representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems. Copyright © 2018, Diodes Incorporated www.diodes.com