DGD2136M DIODES | Alldatasheet

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Technical content

Features

 Three Floating High-Side Drivers in Bootstrap Operation to 600V  200mA Source / 350mA Sink Output Current Capability  Outputs Tolerant to Negative Transients, dV/dt Immune  Logic Input 3.3V Capability  Internal Deadtime of 290ns to Protect MOSFETs and IGBTs  Matched Prop Delay for All Channels  Outputs Out of Phase with Inputs  Schmitt Triggered Logic Inputs  Cross Conduction Prevention Logic  Undervoltage Lockout for All Channels  Overcurrent Protection Shuts Down Drivers  Extended Temperature Range: -40° C to +125°C  Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)  Halogen and Antimony Free. “Green” Device (Note 3)  For automotive applications requiring specific change control (i.e. parts qualified to AEC-Q100/101/200, PPAP capable, and manufactured in IATF 16949 certified facilities), please contact us or your local Diodes representative. https://www.diodes.com/quality/product-definitions/ Mechanical Data  Case: SO-28 (Type TH)  Case Material: Molded Plastic. “Green” Molding Compound. UL Flammability Classification Rating 94V-0  Moisture Sensitivity: Level 3 per J-STD-020  Terminals: Finish – Matte Tin Plated Leads, Solderable per MIL-STD-202, Method 208  Weight: 0.250 grams (Approximate) Ordering Information (Note 4) Part Number Marking Reel Size (inches) Tape Width (mm) Quantity per Reel DGD2136MS28-13 DGD2136M 13 24 1,500 Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS), 2011/65/EU (RoHS 2) & 2015/863/EU (RoHS 3) compliant. 2. See https://www.diodes.com/quality/lead-free/ for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green" and Lead-free. 3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds. 4. For packaging details, go to our website at https://www.diodes.com/design/support/packaging/diodes -packaging/. SO-28 Top View Typical Configuration

Document number: DS41225 Rev. 3 - 2 2 of 12 www.diodes.com March 2021 © Diodes Incorporated DGD2136M Marking Information Pin Diagrams VCC HIN1* HIN2* HIN3* NC HO1 VB1 FO* ITRIP 10EN 11RCIN 12VSS 13COM 14LO3

23 HO2

26 VS1

19 HO3

20 VB3

15 LO2

16 LO1

LIN1* LIN2* LIN3* DGD2136M YY WW SO-28 = Manufacturer’s Marking DGD2136M = Product Type Marking Code YY = Year (ex: 21 = 2021) WW = Week (01 to 53) Top View

Document number: DS41225 Rev. 3 - 2 3 of 12 www.diodes.com March 2021 © Diodes Incorporated DGD2136M Pin Descriptions Pin Number Pin Name Function

1 VCC Low-Side and Logic Fixed Supply

2, 3, 4 HIN1*, HIN2*, HIN3* Logic Input for High-Side Gate Driver Output, Out of Phase with HO 5, 6, 7 LIN1*, LIN2*, LIN3* Logic Input for Low-Side Gate Driver Output, Out of Phase with LO

8 FO* Fault Output with Open Drain (Fault with Overcurrent and VCC UVLO)

9 ITRIP Analog Input for Overcurrent Shutdown

10 EN Logic Input for Functionality, I/O Logic Functions when EN is High

11 RCIN An External RC Network Input used to Define FAULT CLEAR Delay

12 VSS Logic Ground

13 COM Low-Side Driver Return

14, 15, 16 LO3, LO2, LO1 Low-Side Gate Driver Output 17, 21, 25 NC No Connection (No Internal Connection) 18, 22, 26 VS3, VS2, VS1 High-Side Floating Supply Return 19, 23, 27 HO3, HO2, HO1 High-Side Gate Driver Output 20, 24, 28 VB3, VB2, VB1 High-Side Floating Supply Functional Block Diagram

Document number: DS41225 Rev. 3 - 2 4 of 12 www.diodes.com March 2021 © Diodes Incorporated DGD2136M Absolute Maximum Ratings (@TA = +25° C, unless otherwise specified.) Characteristic Symbol Value Unit High-Side Floating Supply Voltage VB -0.3 to +624 V High-Side Floating Supply Offset Voltage VS VB-24 to VB+0.3 V High-Side Floating Output Voltage VHO VS-0.3 to VB+0.3 V Low-Side Output Voltage VLO -0.3 to VCC+0.3 V Offset Supply Voltage Transient dVS / dt 50 V/ns Low-Side Fixed Supply Voltage VCC -0.3 to +24 V Logic Input Voltage (HIN*, LIN*, ITRIP, EN and FO*) VIN -0.3 to +5.5 V Thermal Characteristics (@TA = +25° C, unless otherwise specified.) Characteristic Symbol Value Unit Power Dissipation Linear Derating Factor (Note 5) PD 2.3 W Thermal Resistance, Junction to Ambient (Note 5) RθJA 60 °C/W Thermal Resistance, Junction to Case (Note 5) RθJC 45 °C/W Operating Temperature TJ +150 °C Lead Temperature (Soldering, 10s) TL +300 Storage Temperature Range TSTG -55 to +150 Note: 5. When mounted on a standard JEDEC 2-layer FR-4 board. Recommended Operating Conditions Parameter Symbol Min Max Unit High-Side Floating Supply Absolute Voltage VB VS + 10 VS + 20 V High-Side Floating Supply Offset Voltage VS (Note 6) 600 V High-Side Floating Output Voltage VHO VS VB V Low-Side Fixed Supply Voltage VCC 10 20 V Low-Side Output Voltage VLO COM VCC V Logic Input Voltage (HIN*, LIN*, ITRIP & EN) VIN VSS 5 V Fault Output Voltage VFO VSS VCC V Logic Ground VSS -5 5 V Ambient Temperature TA -40 +125 °C Note: 6. Logic operation for VS of -5V to +600V.

Document number: DS41225 Rev. 3 - 2 5 of 12 www.diodes.com March 2021 © Diodes Incorporated DGD2136M Parameter Symbol Min Typ Max Unit Condition Logic “0” Input Voltage VIH 2.4 — — V — Logic “1” Input Voltage VIL — — 0.8 V — High Level Output Voltage, VBIAS - VO VOH — — 0.1 V IO = 0mA Low Level Output Voltage, VO VOL — — 0.1 V IO = 0mA Offset Supply Leakage Current ILK — — 10 µA VB = VS = 600V Quiescent VBS Supply Current IBSQ 10 85 130 µA VIN = 0V or 5V, EN = 0V Quiescent VCC Supply Current ICCQ — 1.1 1.6 mA VIN = 0V or 5V, EN = 0V Logic Input Bias Current (HO = LO = HIGH) IIN+ — 130 200 µA VIN = 0V Logic Input Bias Current (HO = LO = LOW) IIN- — 3.0 20 µA VIN = 5V Logic Enable “1” Input Bias Current IEN+ — 33 80 µA VEN = 5V Logic Enable “0” Input Bias Current IEN- — — 2.0 µA VEN = 0V VBS Supply Undervoltage Positive Going Threshold VBSUV+ 7.6 8.9 9.9 V — VBS Supply Undervoltage Negative Going Threshold VBSUV- 7.1 8.3 9.4 V — VCC Supply Undervoltage Positive Going Threshold VCCUV+ 7.6 8.9 9.9 V — VCC Supply Undervoltage Negative Going Threshold VCCUV- 7.1 8.3 9.4 V — Output High Short Circuit Pulsed Current IO+ 120 200 — mA VO = 0V, PW ≤ 10µs Output Low Short Circuit Pulsed Current IO- 250 350 — mA VO = 15V, PW ≤ 10µs Overcurrent Detect Positive Threshold VITH+ 400 500 600 mV — Overcurrent Detect Negative Threshold VITH- 340 420 500 mV — Short-Circuit Input Current ICSIN 6.0 11 16 µA VCSIN = 1V RCIN Positive Going Threshold Voltage VRCINTH+ 7.0 8.4 9.8 V — RCIN Negative Going Threshold Voltage VRCINTH- — 5.0 — V — Fault Output Low Level Voltage VFOL — 0.2 0.5 V VCS = 1V, IFO = 1.5mA RCIN on Resistance RDSRCIN 40 75 110 Ω IRCIN = 1.5mA Fault Output on Resistance RDSFO 80 130 180 Ω IFO = 1.5mA Note: 7. The VIN, VTH and IIN parameters are referenced to VSS and are applicable to all six channels (HIN1*, 2*, 3* and LIN1*, 2*, 3*). The VO and IO parameters are applicable to the output pins (HO1, 2, 3 and LO1, 2, 3) and are referenced to COM. Parameter Symbol Min Typ Max Unit Condition Turn-On Propagation Delay tON 200 330 460 ns VS = 0V Turn-Off Propagation Delay tOFF 200 330 460 ns VS = 0V Turn-On Rise Time tr — 90 150 ns VS = 0V Turn-Off Fall Time tf — 35 60 ns VS = 0V Delay Matching tDM — — 50 ns — Enable Low to Output Shutdown Delay tEN 225 330 425 ns — ITRIP Pin Leading-Edge Blanking Time tBLT 200 300 400 ns — Time from ITRIP Triggering to FO* tFLT 360 550 760 ns From VITRIP = 1V to FO* turn off Time from ITRIP Triggering to All Gate Outputs Turn Off tITRIP 420 615 820 ns From VITRIP = 1V to starting gate turn off Input Filtering Time (HIN*, LIN*, EN) tFLTIN — 250 — ns — Fault Clear Time tFLTCLR — 1.6 — ms CRCIN = 1nF, RRCIN = 2MΩ Deadtime tDT 200 290 420 ns — Deadtime Matching tDTM — — 50 ns — Output Pulse Width Matching (Note 8) tPM — 50 75 ns PWIN > 1µs Note: 8. tPM is defined as PWIN – PWOUT.

Document number: DS41225 Rev. 3 - 2 6 of 12 www.diodes.com March 2021 © Diodes Incorporated DGD2136M Timing Waveforms

Document number: DS41225 Rev. 3 - 2 7 of 12 www.diodes.com March 2021 © Diodes Incorporated DGD2136M Typical Performance Characteristics (VCC = 15V, @TA = +25° C, unless otherwise specified.)

Document number: DS41225 Rev. 3 - 2 8 of 12 www.diodes.com March 2021 © Diodes Incorporated DGD2136M Typical Performance Characteristics (continued)

Document number: DS41225 Rev. 3 - 2 9 of 12 www.diodes.com March 2021 © Diodes Incorporated DGD2136M Typical Performance Characteristics (continued)

Document number: DS41225 Rev. 3 - 2 10 of 12 www.diodes.com March 2021 © Diodes Incorporated DGD2136M Typical Performance Characteristics (continued)

Document number: DS41225 Rev. 3 - 2 11 of 12 www.diodes.com March 2021 © Diodes Incorporated DGD2136M Package Outline Dimensions Please see http://www.diodes.com/package-outlines.html for the latest version. SO-28 (Type TH) Suggested Pad Layout Please see http://www.diodes.com/package-outlines.html for the latest version. SO-28 (Type TH) Note: For high voltage applications, the appropriate industry sector guidelines should be considered with regards to creepage and clearance distances between device Terminals and PCB tracking. Seating Plane D b e E A c L Pin#1 ID C X Y SO-28 (Type TH) Dim Min Max Typ A -- 2.65 -- A1 0.10 0.30 -- A2 2.25 2.35 2.30 A3 0.97 1.07 1.02 b 0.39 0.48 -- c 0.25 0.31 -- D 17.80 18.20 18.00 E 10.10 10.50 10.30 E1 7.30 7.70 7.50 e 1.27 BSC L 0.70 1.00 -- L1 1.40 BSC θ 0° 8° -- All Dimensions in mm Dimensions Value (in mm) C 1.270 X 0.680 X1 17.190 Y 2.200 Y1 11.300

Document number: DS41225 Rev. 3 - 2 12 of 12 www.diodes.com March 2021 © Diodes Incorporated DGD2136M IMPORTANT NOTICE 1. DIODES INCORPORATED AND ITS SUBSIDIARIES (“DIODES”) MAKE NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO ANY INFORMATION CONTAINED IN THIS DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTIC ULAR PURPOSE OR NON -INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION). 2. The Information contained herein is for informational purpose only and is provided only to illustrate the operati on of Diodes products described herein and application examples. Diodes does not assume any liability arising out of the application or use of this document or any product described herein. This document is intended for skilled and technically trained engi neering customers and users who design with Diodes products. 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