DGD2003_V01 DIODES | Alldatasheet
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Floating High-Side Driver in Bootstrap Operation to 200V Drives Two N-Channel MOSFETs in a Half-Bridge Configuration 290mA Source/600mA Sink Output Current Capability Outputs Tolerant to Negative Transients Internal Dead Time of 420ns to Protect MOSFETs Wide Low Side Gate Driver Supply Voltage: 10V to 20V Logic Input (HIN and LIN*) 3.3V Capability Schmitt Triggered Logic Inputs Undervoltage Lockout for High-Side and Low-Side Drivers Extended Temperature Range: -40° C to +125° C Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2) Halogen and Antimony free. “Green” Device (Note 3) For automotive applications requiring specific change control (i.e. parts qualified to AEC-Q100/101/200, PPAP capable, and manufactured in IATF 16949 certified facilities), please contact us or your local Diodes representative. https://www.diodes.com/quality/product-definitions/ Mechanical Data Case: SO-8 (Type TH) Case Material: Molded Plastic. “Green” Molding Compound. UL Flammability Classification Rating 94V-0 Moisture Sensitivity: Level 3 per J-STD-020 Terminals: Finish – Matte Tin Plated Leads. Solderable per MIL-STD-202, Method 208 Weight: 0.075 grams (Approximate) Ordering Information (Note 4) Part Number Marking Reel Size (inches) Tape Width (mm) Quantity per Reel DGD2003S8-13 DGD2003 13 12 2,500 Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS), 2011/65/EU (RoHS 2) & 2015/863/EU (RoHS 3) compliant. 2. See https://www.diodes.com/quality/lead-free/ for more information about Diodes Incorporated’s definitions of Halogen - and Antimony-free, "Green" and Lead-free. 3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds. 4. For packaging details, go to our website at https://www.diodes.com/design/support/packaging/diodes -packaging/. Marking Information SO-8 Top View Typical Configuration DGD2003 YY WW = Manufacturer’s Marking DGD2003 = Product Type Marking Code YY = Year (ex: 19 = 2019) WW = Week (01 to 53) Typical Configuration
Document Number DS38690 Rev. 3 - 2 2 of 11 www.diodes.com November 2019 © Diodes Incorporated DGD2003 Pin Diagrams Pin Descriptions Pin Number Pin Name Function
1 VCC Logic and Low Side Supply
2 HIN Logic Input for High-Side Gate Driver Output in Phase with HO
3 LIN* Logic Input for Low-Side Gate Driver Output out of Phase with LO
4 COM Low-Side and Logic Return
5 LO Low-Side Gate Drive Output
6 VS High-Side Floating Supply Return
7 HO High-Side Gate Drive Output
8 VB High-Side Floating Supply
Top View: SO-8
Document Number DS38690 Rev. 3 - 2 3 of 11 www.diodes.com November 2019 © Diodes Incorporated DGD2003 Absolute Maximum Ratings (@TA = +25° C, unless otherwise specified.) Characteristic Symbol Value Unit High-Side Floating Supply Voltage VB -0.3 to +224 V High-Side Floating Supply Offset Voltage VS VB-24 to VB+0.3 V High-Side Floating Output Voltage VHO VS-0.3 to VB+0.3 V Offset Supply Voltage Transient dVS / dt 50 V/ns Low-Side Fixed Supply Voltage VCC -0.3 to +24 V Low-Side Output Voltage VLO -0.3 to VCC+0.3 V Logic Input Voltage (HIN and LIN*) VIN -0.3 to VCC+0.3 V Thermal Characteristics (@TA = +25° C, unless otherwise specified.) Characteristic Symbol Value Unit Power Dissipation Linear Derating Factor (Note 5) PD 0.625 W Thermal Resistance, Junction to Ambient (Note 5) RθJA 200 °C/W Operating Temperature TJ +150 °C Lead Temperature (Soldering, 10s) TL +300 Storage Temperature Range TSTG -55 to +150 Recommended Operating Conditions Parameter Symbol Min Max Unit High Side Floating Supply Absolute Voltage VB VS + 10 VS + 20 V High Side Floating Supply Offset Voltage VS (Note 6) 200 V High Side Floating Output Voltage VHO VS VB V Low Side Supply Voltage VCC 10 20 V Low Side Output Voltage VLO 0 VCC V Logic Input Voltage (HIN and LIN*) VIN 0 5 V Ambient Temperature TA -40 +125 °C Notes: 5. When mounted on a standard JEDEC 2-layer FR-4 board. 6. Logic operation for VS of -5V to +200V.
Document Number DS38690 Rev. 3 - 2 4 of 11 www.diodes.com November 2019 © Diodes Incorporated DGD2003 Parameter Symbol Min Typ Max Unit Conditions Logic “1” (HIN) and Logic “0” (LIN*) Input Voltage (Note 8) VIH 2.5 — — V VCC = 10V to 20V Logic “0” (HIN) and Logic “1” (LIN*) Input Voltage (Note 8) VIL — — 0.8 V VCC = 10V to 20V High Level Output Voltage, VBIAS - VO VOH — 0.05 0.2 V IO = 2mA Low Level Output Voltage, VO VOL — 0.02 0.1 V IO = 2mA Offset Supply Leakage Current ILK — — 50 µA VB = VS = 200V Quiescent VBS Supply Current IBSQ — 60 100 µA VIN = 0V or 5V Quiescent VCC Supply Current ICCQ — 350 500 µA VIN = 0V or 5V Logic “1” Input Bias Current IIN+ — 3 10 µA HIN = 5V, LIN* = 0V Logic “0” Input Bias Current IIN- — — 5 µA HIN = 0V, LIN* = 5V VCC Supply Undervoltage Positive Going Threshold VCCUV+ 8.0 8.9 9.8 V — VCC Supply Undervoltage Negative Going Threshold VCCUV- 7.4 8.2 9.0 V — VBS Supply Undervoltage Positive Going Threshold VBSUV+ 4.5 5.5 6.5 V — VBS Supply Undervoltage Negative Going Threshold VBSUV- 4.2 5.2 6.2 V — Output High Short Circuit Pulsed Current IO+ 130 290 — mA VO = 0V, PW ≤ 10µs Output Low Short Circuit Pulsed Current IO- 270 600 — mA VO = 15V, PW ≤ 10µs Notes: 7. The VIN and IIN parameters are applicable to the two logic pins: HIN and LIN *. The VO and IO parameters are applicable to the respective output pins: HO and LO. 8. For optimal operation, it is recommended that the input pulses (HIN and LIN*) should have a minimum amplitude of 2.5V with a minimum pulse width of 840ns. Parameter Symbol Min Typ Max Unit Conditions Turn-On Propagation Delay tON — 680 820 ns VS = 0V Turn-Off Propagation Delay tOFF — 150 220 ns VS = 200V Delay Matching, HO and LO Turn-On/Turn-Off tDM — — 60 ns — Turn-On Rise Time tR — 70 170 ns VS = 0V Turn-Off Fall Time tF — 35 90 ns VS = 0V Deadtime: tDT LO-HO and tDT HO-LO tDT 300 420 650 ns —
Document Number DS38690 Rev. 3 - 2 5 of 11 www.diodes.com November 2019 © Diodes Incorporated DGD2003 Timing Waveforms
Document Number DS38690 Rev. 3 - 2 6 of 11 www.diodes.com November 2019 © Diodes Incorporated DGD2003 Typical Performance Characteristics (VCC=15V, @TA = +25° C, unless otherwise specified.) tON High Side tON Low Side tON High Side tON Low Side tOFF High Side tOFF Low Side tOFF High Side tOFF Low Side tR High Side tR Low Side tR High Side tR Low Side
Document Number DS38690 Rev. 3 - 2 7 of 11 www.diodes.com November 2019 © Diodes Incorporated DGD2003 Typical Performance Characteristics (continued) tF High Side tF Low Side tF High Side tF Low Side IBSQ ICCQ IBSQ ICCQ tDM(ON) tDM(OFF) tDM(ON) tDM(OFF)
Document Number DS38690 Rev. 3 - 2 8 of 11 www.diodes.com November 2019 © Diodes Incorporated DGD2003 Typical Performance Characteristics (continued) IO+ High Side IO+ Low Side IO- High Side IO- Low Side IO- High Side IO- Low Side IO+ High Side IO+ Low Side VIH High Side VIH Low Side VIH High Side VIH Low Side
Document Number DS38690 Rev. 3 - 2 9 of 11 www.diodes.com November 2019 © Diodes Incorporated DGD2003 Typical Performance Characteristics (continued) VIL High Side VIL Low Side VIL High Side VIL Low Side VCCUV+ VCCUV- dton dtoff dton dtoff
Document Number DS38690 Rev. 3 - 2 10 of 11 www.diodes.com November 2019 © Diodes Incorporated DGD2003 Package Outline Dimensions Please see http://www.diodes.com/package-outlines.html for the latest version. SO-8 (Type TH) Suggested Pad Layout Please see http://www.diodes.com/package-outlines.html for the latest version. SO-8 (Type TH) Note : For high voltage applications, the appropriate industry sector guidelines should be considered with regards to creepage and clearance distances between device Terminals and PCB tracking. b e Ø h 45° R 0.16+/-0.02 L Seating Plane Gauge Plane D E A R 0.23+/-0.02 0.25 c SO-8 (Type TH) Dim Min Max Typ A 1.35 1.75 -- A1 0.10 0.25 -- A2 -- -- 1.45 b 0.35 0.51 -- c 0.190 0.248 -- D 4.80 5.00 4.90 E 5.80 6.20 6.00 E1 3.80 4.00 3.90 e -- -- 1.27 h 0.25 0.50 -- L 0.41 1.27 -- L1 -- -- 1.04 Ø 0 8 -- All Dimensions in mm Dimensions Value (in mm) C 1.27 C1 5.20 X 0.60 Y 2.20 C X Y
Document Number DS38690 Rev. 3 - 2 11 of 11 www.diodes.com November 2019 © Diodes Incorporated DGD2003 IMPORTANT NOTICE DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION). Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the application or use of this document or any product described herein; neither does Diodes Incorporated convey any license unde r its patent or trademark rights, nor the rights of others. Any Customer or user of th is document or products described herein in such applications shall assume all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diod es Incorporated website, harmless against all damages. Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel. Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising ou t of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized application. Products described herein may be covered by one or more United States, international or foreign patents pending. Product name s and markings noted herein may also be covered by one or more United States, international or foreign trademarks. This document is written in English but may be translated into mu ltiple languages for reference. Only the English version of this document is the final and determinative format released by Diodes Incorporated. LIFE SUPPORT Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems witho ut the express written approval of the Chief Executive Officer of Diodes Incorporated. As used herein: A. Life support devices or systems are devices or systems which: 1. are intended to implant into the body, or 2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided i n the labeling can be reasonably expected to result in significant injury to the user. B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or to affect its safety or effectiveness. Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support d evices or systems, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of Diodes Incorporated products in such safety -critical, life support devices or systems, notwithstanding any devices - or systems -related information or support that may be pr ovided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems. Copyright © 2019, Diodes Incorporated www.diodes.com