DGD05463_V01 DIODES | Alldatasheet

Document overview

  • Manufacturer or author: Provided By alldatasheet.com(free datasheet download site)
  • PDF pages: 14

Technical content

Features

  • 50V Floating High-Side Driver
  • Drives Two N-Channel MOSFETs in a Half-Bridge Configuration
  • 1.5A Source / 2.5A Sink Output Current Capability
  • Internal Bootstrap Diode Included
  • Undervoltage Lockout for High-Side and Low-Side Drivers
  • Programmable Deadtime to Protect MOSFETs
  • Logic Input (IN and EN) 3.3V Capability
  • Ultra-Low Standby Currents (<1µA)
  • Extended Temperature Range: -40°C to +125°C
  • Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
  • Halogen and Antimony Free. “Green” Device (Note 3)
  • For automotive applications requiring specific change control (i.e. parts qualified to AEC-Q100/101/200, PPAP capable, and manufactured in IATF 16949 certified facilities), please contact us or your local Diodes representative. https://www.diodes.com/quality/product-definitions/ Mechanical Data
  • Case: W-DFN3030-10 (Type TH), MSOP-10
  • Case Material: Molded Plastic. “Green” Molding Compound. UL Flammability Classification Rating 94V-0
  • Moisture Sensitivity: Level 3 per J-STD-020
  • Terminals: Finish – Matte Tin Finish. Solderable per MIL-STD-202, Method 208
  • Weight:  W-DFN3030-10: 0.017 grams (Approximate)  MSOP-10: 0.0286 grams (Approximate) Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS), 2011/65/EU (RoHS 2) & 2015/863/EU (RoHS 3) compliant. 2. See https://www.diodes.com/quality/lead-free/ for more information about Diodes Incorporated’s definitions of Halogen - and Antimony-free, "Green" and Lead-free. 3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds. W-DFN3030-10 Top View Typical Configuration Bottom View Top View MSOP-10

Document number: DS40512 Rev. 6 - 2 2 of 14 www.diodes.com July 2021 © Diodes Incorporated DGD05463 Ordering Information (Note 4) Part Number Package Marking Reel Size (inches) Tape Width (mm) Quantity per Reel DGD05463FN-7 W-DFN3030-10 DGD05463 7 8 3000 DGD05463M10-13 MSOP-10 DGD05463 13 12 2500 Note: 4. For packaging details, go to our website at https://www.diodes.com/design/support/packaging/diodes -packaging/. Marking Information Pin Diagrams Pin Descriptions Pin Number Pin Name Function

1 VCC Low-Side and Logic Supply

2 VB High-Side Floating Supply

3 HO High-Side Gate Drive Output

4 VS High-Side Floating Supply Return

5 NC No Connection (No Internal Connection)

6 DT Deadtime Control

7 EN Logic Input Enable, a Logic Low Turns Off Gate Driver

8 IN Logic Input for High-Side and Low-Side Gate Driver Outputs (HO and LO), in Phase with HO

9 COM Low-Side and Logic Return

10 LO Low-Side Gate Drive Output

PAD Substrate Connect to COM on PCB (For W-DFN3030-10 Only) YYWW DGD05463 Top View: W-DFN3030-10 DGD05463 = Product Type Marking Code YY = Year (ex: 21 = 2021) WW = Week (01 to 53) DGD05463 = Manufacturer’s Code Marking DGD05463 = Product Type Marking Code Y = Year: 0 ~ 9 W = Week: A ~ Z : 1 ~ 26 week a ~ z : 27 ~ 52 week Top View: MSOP-10

Document number: DS40512 Rev. 6 - 2 3 of 14 www.diodes.com July 2021 © Diodes Incorporated DGD05463 Functional Block Diagram

Document number: DS40512 Rev. 6 - 2 4 of 14 www.diodes.com July 2021 © Diodes Incorporated DGD05463 Absolute Maximum Ratings (@ TA = +25°C, unless otherwise specified.) Characteristic Symbol Value Unit High-Side Floating Positive Supply Voltage VB -0.3 to +60 V High-Side Floating Negative Supply Voltage VS VB-14 to VB+0.3 V High-Side Floating Output Voltage VHO VS-0.3 to VB+0.3 V Offset Supply Voltage Transient dVS / dt 50 V/ns Logic and Low-Side Fixed Supply Voltage VCC -0.3 to +14 V Low-Side Output Voltage VLO -0.3 to VCC+0.3 V Logic Input Voltage (IN and EN) VIN -0.3 to VCC+0.3 V Thermal Characteristics – W-DFN3030-10 (@ TA = +25°C, unless otherwise specified.) Characteristic Symbol Value Unit Power Dissipation Linear Derating Factor (Note 5) PD 0.4 W Thermal Resistance, Junction to Ambient (Note 5) RθJA 64 °C/W Thermal Resistance, Junction to Case (Note 5) RθJC 42 °C/W Operating Temperature TJ +150 °C Lead Temperature (Soldering, 10s) TL +300 Storage Temperature Range TSTG -55 to +150 Note: 5. When mounted on a standard JEDEC 2-layer FR-4 board. Thermal Characteristics – MSOP-10 (@ TA = +25°C, unless otherwise specified.) Characteristic Symbol Value Unit Power Dissipation Linear Derating Factor (Note 6) PD 0.75 W Thermal Resistance, Junction to Ambient (Note 6) RθJA 166 °C/W Thermal Resistance, Junction to Case (Note 6) RθJC 32 °C/W Operating Temperature TJ +150 °C Lead Temperature (Soldering, 10s) TL +300 Storage Temperature Range TSTG -55 to +150 Note: 6. When mounted on a standard JEDEC 2-layer FR-4 board with minimum recommended pad layout. Recommended Operating Conditions Parameter Symbol Min Max Unit High-Side Floating Supply VB VS + 4.2 VS + 14 V High-Side Floating Supply Offset Voltage VS (Note 7) 50 (Note 8) V High-Side Floating Output Voltage VHO VS VB V Logic and Low-Side Fixed Supply Voltage VCC 4.5 (Note 9) 14 V Low-Side Output Voltage VLO 0 VCC V Logic Input Voltage (IN and EN) VIN 0 5 V Ambient Temperature TA -40 +125 °C Notes: 7. Logic operation for VS of -5V to +50V. 8. Provided VB doesn’t exceed absolute maximum rating of 60V. the external Schottky diode is not required.

Document number: DS40512 Rev. 6 - 2 5 of 14 www.diodes.com July 2021 © Diodes Incorporated DGD05463 Parameter Symbol Min Typ Max Unit Condition Logic “1” Input Voltage VIH 2.4 — — V — Logic “0” Input Voltage VIL — — 0.8 V — Enable Logic “1” Input Voltage VENIH 1.5 — — V — Enable Logic “0” Input Voltage VENIL — — 0.7 V — Input Voltage Hysteresis VINHYS — 0.6 — V — High Level Output Voltage, VBIAS - VO VOH — 0.45 0.6 V IO+ = 100mA Low Level Output Voltage, VO VOL — 0.15 0.22 V IO- = 100mA Offset Supply Leakage Current ILK — 10 50 µA VB = VS = 60V VCC Shutdown Supply Current ICCSD — 0 1 µA VIN = 0V or 5V, VEN = 0V VCC Quiescent Supply Current ICCQ — 0.28 0.5 mA VIN = 0V or 5V, RDT = 100kΩ VCC Operating Supply Current ICCOP — 7.6 — mA fs = 500kHz, CL = 1000pF VBS Quiescent Supply Current IBSQ — 32 100 µA VIN = 0V or 5V VBS Operating Supply Current IBSOP — 7.6 — mA fs = 500kHz, CL = 1000pF Logic “1” Input Bias Current IIN+ — 25 60 µA VIN = 5V Logic “0” Input Bias Current IIN- — 0 1 µA VIN = 0V VBS Supply Undervoltage Positive Going Threshold VBSUV+ 3.3 3.8 4.2 V — VBS Supply Undervoltage Negative Going Threshold VBSUV- 2.9 3.3 3.9 V — VCC Supply Undervoltage Positive Going Threshold VCCUV+ 3.3 3.8 4.2 V — VCC Supply Undervoltage Negative Going Threshold VCCUV- 2.9 3.3 3.9 V — Output High Short-Circuit Pulsed Current IO+ 1.0 1.5 — A VO = 0V, PW ≤ 10µs Output Low Short-Circuit Pulsed Current IO- 1.9 2.5 — A VO = 15V, PW ≤ 10µs Forward Voltage of Bootstrap Diode VF1 — 0.67 — V IF = 100µA Forward Voltage of Bootstrap Diode VF2 — 1.7 — V IF = 100mA Note: 10. The VIN and IIN parameters are applicable to the two logic pins: IN and EN. The V O and IO parameters are applicable to the respective output pins: HO and LO. Parameter Symbol Min Typ Max Unit Condition Turn-on Propagation Delay, HO & LO tON 65 96 125 ns RDT = 10kΩ 350 463 580 ns RDT = 100kΩ Turn-off Propagation Delay, HO & LO tOFF — 22 56 ns — Turn-on Rise Time tr — 17 35 ns — Turn-off Fall Time tf — 12 25 ns — Delay Matching tDM — — 50 ns — Deadtime: tDT LO-HO & tDT HO-LO tDT 40 70 100 ns RDT = 10kΩ 300 430 560 ns RDT = 100kΩ Deadtime Matching tMDT — — 50 ns RDT = 100kΩ

Document number: DS40512 Rev. 6 - 2 6 of 14 www.diodes.com July 2021 © Diodes Incorporated DGD05463 Timing Waveforms tf tf tr tr

Document number: DS40512 Rev. 6 - 2 7 of 14 www.diodes.com July 2021 © Diodes Incorporated DGD05463 Typical Performance Characteristics (VCC = 12V, @ TA = +25°C, unless otherwise specified.)

Document number: DS40512 Rev. 6 - 2 8 of 14 www.diodes.com July 2021 © Diodes Incorporated DGD05463 Typical Performance Characteristics (continued)

Document number: DS40512 Rev. 6 - 2 9 of 14 www.diodes.com July 2021 © Diodes Incorporated DGD05463 Typical Performance Characteristics (continued)

Document number: DS40512 Rev. 6 - 2 10 of 14 www.diodes.com July 2021 © Diodes Incorporated DGD05463 Typical Performance Characteristics (continued) Offset Supply Leakage Current (μA)

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Document number: DS40512 Rev. 6 - 2 12 of 14 www.diodes.com July 2021 © Diodes Incorporated DGD05463 Package Outline Dimensions Please see http://www.diodes.com/package-outlines.html for the latest version. W-DFN3030-10 (Type TH) Suggested Pad Layout Please see http://www.diodes.com/package-outlines.html for the latest version. W-DFN3030-10 (Type TH) A A1 A3 Seating Plane D E e b L h h W-DFN3030-10 (Type TH) Dim Min Max Typ A 0.70 0.80 0.75 A1 -- 0.05 0.02 A3 0.18 0.25 0.20 b 0.18 0.30 0.25 D 2.90 3.10 3.00 D2 2.40 2.60 2.50 e 0.50BSC e1 2.00BSC E 2.90 3.10 3.00 E2 1.45 1.65 1.55 h 0.20 0.30 0.25 L 0.30 0.50 0.40 All Dimensions in mm Dimensions Value (in mm) C 0.500 X 0.300 X1 2.300 X2 2.600 Y 0.600 Y1 3.300 Y2 1.650 X Y C

Document number: DS40512 Rev. 6 - 2 13 of 14 www.diodes.com July 2021 © Diodes Incorporated DGD05463 Package Outline Dimensions Please see http://www.diodes.com/package-outlines.html for the latest version. MSOP-10 MSOP-10 Dim Min Max Typ A - 1.10 - A1 0.05 0.15 0.10 A2 0.75 0.95 0.86 A3 0.29 0.49 0.39 b 0.17 0.27 0.20 c 0.08 0.23 0.15 D 2.95 3.05 3.00 e - - 0.50 E 4.80 5.00 4.90 E1 2.95 3.05 3.00 E3 2.85 3.05 2.95 L 0.40 0.80 0.60 X -- -- 0.750 Y -- -- 0.750 a 0° 8° 4° All Dimensions in mm Suggested Pad Layout Please see http://www.diodes.com/package-outlines.html for the latest version. MSOP-10 DA E e Y X D b Seating Plane Gauge Plane 0.25 L4x10° 4X10° c a Dimensions Value (in mm) C 0.50 X 0.30 Y 1.35 Y1 5.30 X Y C

Document number: DS40512 Rev. 6 - 2 14 of 14 www.diodes.com July 2021 © Diodes Incorporated DGD05463 IMPORTANT NOTICE 1. DIODES INCORPORATED AND ITS SUBSIDIARIES (“DIODES”) MAKE NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO ANY INFORMATION CONTAINED IN THIS DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTIC ULAR PURPOSE OR NON -INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION). 2. The Information contained herein is for informational purpose only and is provided only to illustrate the operati on of Diodes products described herein and application examples. Diodes does not assume any liability arising out of the application or use of this document or any product described herein. This document is intended for skilled and technically trained engi neering customers and users who design with Diodes products. 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