DFR0.3A JUXING | Alldatasheet
Document overview
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Technical content
Features
Ideal for automated placement Glass passivated chip junctions Low forward voltage drop Low leakage current High forward surge capability High temperature soldering： 260℃/10 seconds at terminals Component in accordance to RoHS 2002/95/1 and WEEE 2002/96/EC Mechanical Date Case: JEDEC SOD-123FL molded plastic body over glass passivated chip Terminals: Solder plated, solderable per J-STD-002B and JESD22-B102D Polarity: Laser band denotes cathode end Weight: 0.017gram Maximum Ratings & Thermal Characteristics & Electrical Characteristics A = 25 °C unless otherwise noted) Symbol DFR 0.3A DFR 0.3B DFR 0.3D DFR 0.3G DFR 0.3J DFR 0.3K DFR 0.3M UNIT V RRM 50 100 200 400 600 800 1000 V V RMS 35 70 140 280 420 560 700 V V DC 50 100 200 400 600 800 1000 V I F(AV) A I FSM A V F V I R μA t rr 250 nS T J , T STG ℃Operating junction and storage temperature range –55 to +150 Maximum instantaneous forward voltage at 0.3A 1.3 Maximum DC reverse current T A = 25 ℃ at Rated DC blocking voltage T A = 100℃ 5.0 Maximum reverse recovery time at I F = 0.3 A , I R = 1.0 A , I rr = 0.25 A 150 500 Maximum repetitive peak reverse voltage Maximum RMS voltage Maximum DC blocking voltage Maximum average forward rectified current 0.3 Peak forward surge current 8.3 ms single half sine- wave superimposed on rated load 10 V F 1.3V T j max. 150 °C I FSM 10A I R 5 μA I F(AV) 0.3 A V RRM
50 V to 1000 V
http://www.trr-jx.com
DFR0.3A~DFR0.3M Surface Mount Fast Recovery Rectifiers Characteristic Curves A =25 ℃ unless otherwise noted) http://www.trr-jx.com