DFR05A LUGUANG | Alldatasheet

Document overview

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  • PDF pages: 2

Technical content

Features

  • Low profile space
  • Ideal for automated placement
  • Glass passivated chip junctions
  • Low forward voltage drop
  • Low leakage current
  • High forward surge capability
  • High temperature soldering: 260℃/10 seconds at terminals
  • Component in accordance to RoHS 2002/95/1 and WEEE 2002/96/EC Mechanical Date
  • Case: JEDEC SOD-123FL molded plastic body over glass passivated chip
  • Terminals: Solder plated, solderable per J-STD-002B and JESD22-B102D
  • Polarity: Laser band denotes cathode end
  • Weight: 0.017gram Maximum Ratings & Thermal Characteristics & Electrical Characteristics (TA = 25 °C unless otherwise noted) VRRM 50 100 200 400 600 800 1000 V VRMS 35 70 140 280 420 560 700 V VDC 50 100 200 400 600 800 1000 V IF(AV) A IFSM A VF V IR μA trr 250 nS CJ p F TJ, TSTG ℃Operating junction and storage temperature range –55 to +150 Maximum instantaneous forward voltage at 0.5A 1.3 Maximum DC reverse current TA = 25 ℃ at Rated DC blocking voltage TA = 100℃ 5.0 Maximum reverse recovery time at IF = 0.5 A , IR = 1.0 A , Irr = 0.25 A 150 500 Typical junction capacitance at 4.0 V ,1MHz 15 DFR- Maximum repetitive peak reverse voltage Maximum RMS voltage Maximum DC blocking voltage Maximum average forward rectified current 0.5 Peak forward surge current 8.3 ms single half sine- wave superimposed on rated load 15 VF 1.3V Tj max. 150 °C IFSM 15 A IR 5 μA IF(AV) 0.5 A VRRM 50 V to 1000 V DFR0.5A-DFR0.5M Surface Mount Fast Recovery Rectifiers http://www.luguang.cn mail:lge@luguang.cn

Characteristic Curves (TA=25 ℃ unless otherwise noted) DFR0.5A-DFR0.5M Surface Mount Fast Recovery Rectifiers http://www.luguang.cn mail:lge@luguang.cn