DFLS2100 DIODES | Alldatasheet

Document overview

  • Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
  • PDF pages: 3

Technical content

Features

  • Guard Ring Die Construction for Transient Protection
  • Low Power Loss, High Efficiency
  • Patented Interlocking Clip Design for High Surge Current Capacity
  • Lead Free Finish, RoHS Compliant (Note 4)
  • "Green" Molding Compound (No Br, Sb)
  • Qualified to AEC-Q101 Standards for High Reliability Mechanical Data
  • Case: PowerDI 123
  • Case Material: Molded Plastic, “Green” Molding Compound. UL Flammability Classification Rating 94V-0
  • Moisture Sensitivity: Level 1 per J-STD-020D
  • Terminal Connections: Cathode Band
  • Terminals: Finish – Matte Tin annealed over Copper leadframe. Solderable per MIL-STD-202, Method 208
  • Marking Information: See Page 3
  • Ordering Information: See Page 3
  • Weight: 0.01 grams (approximate) NEW PRODUCT Top View Maximum Ratings @TA = 25°C unless otherwise specified Single phase, half wave, 60Hz, resistive or inductive load. For capacitance load, derate current by 20%. Characteristic Symbol Value Unit Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage V RRM VRWM VR 100 V RMS Reverse Voltage VR(RMS) 71 V Average Forward Current IF(AV) 2.0 A Non-Repetitive Peak Forward Surge Current 8.3ms Single Half Sine-Wave Superimposed on Rated Load IFSM 40 A Thermal Characteristics Characteristic Symbol Typ Max Unit Thermal Resistance Junction to Soldering (Note 2) RθJS — 7 °C/W Thermal Resistance Junction to Ambient (Note 1) RθJA 125 — °C/W Operating and Storage Temperature Range TJ, TSTG -55 to +175 °C Electrical Characteristics @TA = 25°C unless otherwise specified Characteristic Symbol Min Typ Max Unit Test Condition Reverse Breakdown Voltage (Note 3) V(BR)R 100 ⎯ ⎯ V IR = 1μA Forward Voltage VF ⎯ ⎯ 0.77 0.86 V IF = 1.0A IF = 2.0A Leakage Current (Note 3) IR ⎯ ⎯ 1 μA VR = 100V, TA = 25°C Total Capacitance CT ⎯ 36 ⎯ pF VR = 5VDC, f = 1MHz Notes: 1. Part mounted on FR-4 board with 2 oz., minimum recommended copper pad layout, which can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf. TA = 25°C 2. Theoretical RθJS calculated from the top center of the die straight down to the PCB/cathode tab solder junction. 3. Short duration pulse test us ed to minimize self-heating effect. 4. EU Directive 2002/95/EC (RoHS). All applicable RoHS exemptions applied, see EU Directive 2002/95/EC Annex Notes.

Document number: DS31475 Rev. 1 - 2 2 of 3 www.diodes.com June 2008 © Diodes Incorporated DFLS2100 owerDI is a registered trademark of Diodes Incorporated. P 0.2 0.4 0.6 1.8 1.6 1.4 1.2 0.8 0 0.5 31 1.5 2.52 3.5 P , POWER DISSIPATION (W)D I , AVERAGE FORWARD CURRENT (A) Fig. 1 Forward Power Dissipation F(AV) 0.00001 0.0001 0.01 0.001 0.1 I, I N STANTANEOUS FORWARD CURRENT (A)F V , INSTANTANEOUS FORWARD VOLTAGE (V) Fig. 2 Typical Forward Characteristics F T = 125 CA ° T = 150 CA ° T = 175 CA ° T = 2 5CA ° T = - 5 5CA ° T = 7 5CA ° V , INSTANTANEOUS REVERSE VOLTAGE (V) Fig. 3 Typical Reverse Characteristics R C , TOTAL CAPACITANCE (pF)T V , DC REVERSE VOLTAGE (V) Fig. 4 Total Capacitance vs. Reverse Voltage R 0 51 0 1 5 2 0 T , AMBIENT TEMPERATURE ( C) Fig. 5 Forward Current Derating Curve A ° I, A V E RAGE FORWARD CURRENT (A)F(AV) 0.5 1.0 1.5 2.0 2.5 0 25 50 75 100 125 150 175 Note 1 NEW PRODUCT

Document number: DS31475 Rev. 1 - 2 3 of 3 www.diodes.com June 2008 © Diodes Incorporated DFLS2100 PowerDI is a registered trademark of Diodes Incorporated. Ordering Information (Note 5) Part Number Case Packaging DFLS2100-7 PowerDI 123 3000/Tape & Reel Marking Information NEW PRODUCT F09A = Product Type Marking Code YM = Date Code Marking Y = Year (ex: V = 2008) M = Month (ex: 9 = September) F09A YM Date Code Key Year 2008 2009 2010 2011 2012 2013 2014 2015 Code V W X Y Z A B C Month Jan Feb Mar Apr May Jun Jul Aug Sep Oct Nov Dec Code 1 2 3 4 5 6 7 8 9 O N D Package Outline Dimensions A E L L1 B C E H D PowerDI 123 Dim Min Max Typ A 3.50 3.90 3.70 B 2.60 3.00 2.80 C 1.63 1.93 1.78 D 0.93 1.00 0.98 E 0.85 1.25 1.00 H 0.15 0.25 0.20 L 0.55 0.75 0.65 L1 1.80 2.20 2.00 L2 0.95 1.25 1.10 All Dimensions in mm Suggested Pad Layout X1 G X2 Y2 Y1 Dimensions Value (in mm) G 1.0 X1 2.2 X2 0.9 Y1 1.4 Y2 1.4 IMPORTANT NOTICE Diodes Incorporated and its subsidiaries rese rve the right to make modifications, enhancements, improvements, corrections or other changes without further notice to any product herein. Diodes Incorporat ed does not assume any liability arising out of the application or use of any product described herein; neither does it convey any license under its patent rights, nor the ri ghts of others. The user of products in such applications shall assume all risks of such use and will agree to hold Diodes Inco rporated and all the companies whose products are represented on our website, harmless against all damages. LIFE SUPPORT Diodes Incorporated products are not authoriz ed for use as critical components in life support devices or systems without the e xpressed written approval of the President of Diodes Incorporated.