DFCT45G67NDWAA-RB2 MURATA | Alldatasheet
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Technical content
All Rights Reserved, Copyright© Murata Manufacturing Co., Ltd *Note: All the technical data and information contained herein are subject to change without advanced notice. Product Data Sheets Part Number/Tape & Reel information Part Number Packaging MOQ DFCT45G67NDWAA-RB2 330 mm dia. reel 2000 pcs/reel Specifications -35 to +85°C Parameter IN to OUT Center Frequency F0 : 5670 MHz Band Width (BW) F0 +/- 180 MHz Insertion Loss at BW 3.0 dB max. Ripple at BW 2.2 dB max. Input Power 1.0 W max. Attenuation 30 ~ 2700 MHz 38dB min. 3453 ~ 3547 MHz 38dB min. 3667 ~ 3883 MHz 33dB min. 5150 ~ 5330 MHz 50dB min. 7200 ~ 7500 MHz 20dB min. Characteristic Impedance 50 Ohms Frequency Response
All Rights Reserved, Copyright© Murata Manufacturing Co., Ltd *Note: All the technical data and information contained herein are subject to change without advanced notice. Product Data Sheets Dimensions and Marking TOP VIEW SIDE VIEW BOTTOM VIEW Recommend Land Pattern (reference) Unit : mm Electrode Solder Resist Note : Impedance of signal lines should be 50 ohms including land pattern. This standard condition is applying to the BT resin board (t = 0.4, dielectric constant = 3.6, copper plating on both surfaces).
All Rights Reserved, Copyright© Murata Manufacturing Co., Ltd *Note: All the technical data and information contained herein are subject to change without advanced notice. Product Data Sheets Dimensions of Carrier Tape 1 Cumulative tolerance of max. ± 0.3 every 10 pitches DIMENSIONS : mm Dimensions of Reel B C D W 1 W 2 N A DFCT45G67NDWAA-RB2 330 dia 13 dia 21 2.4 50 12.5 23 Chip
All Rights Reserved, Copyright© Murata Manufacturing Co., Ltd *Note: All the technical data and information contained herein are subject to change without advanced notice. Product Data Sheets Taping Condition No Components 150mm Min. Components Trailer Tape Components No Components 150mm Min. Empty Cavities Leader Cover Tape Only 250mm Min. Feeding direction
All Rights Reserved, Copyright© Murata Manufacturing Co., Ltd *Note: All the technical data and information contained herein are subject to change without advanced notice. Product Data Sheets Reflow Soldering Standard Conditions TP1 TP2 100 TP3 Temperature (degreeC) Pre-heating Time [s] Peak temperature TP0 Measuring point of temperature : IN-OUT Terminals of The Device Reflow Soldering : Both Convection and Infrared Rays, Hot Air and Hot Plate TP0 (C ) TP1 (C ) T1 (s) TP2 (C ) T2 (s) TP3 (C ) T3 (s) Reflow standard condition Sn-3Ag-0.5Cu solder 255+/-5 250 10 max. 220 20 to 40 150 to 190 60 to 120 Test condition of reflow heat resistance 255+/-5 250 10 max. 220 20 to 40 150 to 190 60 to 120 Reflow soldering is available 2 times for above test condition of reflow heat resistance. Soldering Mask Pattern Unit : mm Note : The thickness of soldering mask is 0.1mm. 4C/min. 4C/min.