DF57H-4P-1.2V(21)

DF57_17 HIROSE | Alldatasheet

Document overview

• Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
• PDF pages: 8

Technical content

12014.8w Low Profile “Swing-Lock” Board to Wire Connector for Power DF57 Series (Compliant with UL-CSA standards) Contact Structure Incorrect Positioning ■Features 1.Reinforced lock structure with swing lock A swing-lock structure, featuring our own unique connection method, reinforces the lock structure of the electric cable side, with a structure resistant to tough electric cable routing and disengagement of cables under load. In addition, the connection surface has a guide insertion to facilitate insertability (patented) 2. Header lock improves plug retention When connecting, the header connector secures the molded-lance. Play of molded lance is prevented for added strength. (patented) 3. Highly reliable contact structure Despite the low-profile design, with a stacking height of 1.4mm, an effective mating length of 0.42mm is achieved. The structure features two-point contact terminal geometry with high contact reliability. 4. Insert guide key prevents misalignment Insert guide key guides the crimp socket to the correct mating position and prevents misalignment, which improves mating operation and prevents possible connector breakage with incorrect mating. 5. Solder wicking prevention The integral molding eliminates any gap between the terminals and case to prevent solder wicking. 6. Case disengagement prevention Reinforcing hardware (metal fittings) are integrated in the molding, which help prevent the case from disengaging with the terminals due to tough electric cable routing and load. 7. Cost effective Terminals and metal fittings are collectively integrated into the molding to reduce assembly cost. Before mating After mating Lock portion Mating HeightA : DF57H 1.4mm DF57AH 1.6mm A 4.65mm 8gdhh"hZXi^dcVak^Zld[i]ZXdciVXihjg[VXZ Ilded^ciXdciVXiiZgb^cVah :[[ZXi^kZbVi^c\\aZc\\i] %#)'bb Insert Guide Key Structure 1PTJUJWF-PDL*OTFSU(VJEF,FZ *OTFSUHVJEFLFZUPVDIFTUP UIFIFBEFSQSJPSUPUIF QPTJUJWFMPDL XIJDIHVJEFT UIFTPDLFUUPUIFDPSSFDU NBUJOHQPTJUJPO Swing-Lock Structure explanatory drawing Starts mating after the socket is aligned to the correct position Fig.1 Fig.2 Fig.3

DF57 Series●Low Profile “Swing-Lock” Board to Wire Connector for Power ■Specifications Rating Current rating 2pos. 3pos. 4pos. 5,6pos. Operating temperature range -35ç to 85ç (Note 1) Operating humidity range 20% to 80% AWG#26 _ _ _ 1.5A AWG#28 2.5A 2.0A 1.5A AWG#30 1.5A 1.0A AWG#32 1.0A 0.8A AWG#34 0.8A 0.5A Voltage rating 2 to 6 pos. :50V AC/DC 2 pos. (Middle pin of 3 pos. is removed): 100V AC/DC Storage temperature range -10ç to 60ç (Note 2) Storage humidity range 40% to 70% (Note 2) UL-CSA certified specifications Rating Current rating 2pos. 3pos. 4pos. 5,6pos. AWG#26 _ _ _ 1.5A AWG#28 2.5A 2.0A 1.5A AWG#30 1.5A 1.0A AWG#32 1.0A 0.8A AWG#34 0.8A 0.5A Voltage rating 2 - 6 pos. :29V AC/DC Item Specifi cation Conditions 1. Insulation resistance 100 Mø min. 100 V DC 2. Withstanding voltage No fl ashover or insulation breakdown 500 V AC / 1 minute 3. Contact resistance 10 mø max. 20 mV max., at 1 mA. 4.Vibration No electrical discontinuity of 1 µs or longer No damage, cracks or parts dislocation. Frequency: 10 to 55 Hz, single amplitude of 0.75 mm, 10 cycles, 3 direction 5.Shock No electrical discontinuity of 1 µs or longer No damage, cracks or parts dislocation. Acceleration of 490 m/s2, 11 ms duration, sine half- wave, 3 cycles in each of the 3 axis 6.Humidity Contact resistance: 20 mø max., Insulation resistance: 500 Mø min. No damage, cracks or parts dislocation. 96 hours at 40 ±2ç, and humidity of 90 to 95% 7. Temperature cycle Contact resistance: 20 mø max., Insulation resistance: 500 Mø min. No damage, cracks or parts dislocation. -55°C → 5 to 35°C → 85°C → 5 to 35°C to 3 min. 5 cycles 8.Durability Contact resistance: 20 mø max., No damage, cracks or parts dislocation. 30 cycles 9. Resistance to soldering heat No deformation of components affecting performance Refl ow: At the recommended temperature profi le Manual soldering: 350°C for 3 seconds Note 1. Includes temperature rise caused by current fl ow. Note 2. The term "storage" refers to products stored for a long period prior to mounting and use. The operating temperature and humidity range covers the non-conducting condition of installed connectors in storage, shipment or during transportation. ■Material Product Part Material Finish Remarks Header Insulator LCP Color:Black UL94V-0 Crimp socket Insulator DF57H PBT White UL94V-0LCP Black DF57AH PBT White

DF57 Series●Low Profile “Swing-Lock” Board to Wire Connector for Power ■Ordering information Refer to the below information to identify the specifications of the product by its part No.

• Header
• Socket
• Crimp contact ⁞ Series name ɿDF Series No. ɿ57 ⁠ Insert guide key ɹɹɹɹH : Yes ⁡ Number of contactsɿ2, 3, 4, 5, 6 ⁢ Connector type ɹɹ PɿPlug ⁣ Contact pitch ɿ1.2mm ⁤ Termination section ɹɹɹ ɹɹɹV :Straight SMT ⁞ Series name ɿDF Series No. ɿ57 ⁠ Applicable wire size: ɹɹɹɹBlank : AWG#28 to AWG#34 ⁡ Insert guide key ɹɹɹɹH : Yes ⁢ Number of contactsɿ2, 3, 4, 5, 6 ⁣ Connector type ɹɹɹɹɹɹ S ɿCrimp socket ⁤ Contact pitch ɿ1.2mm ⁥ Termination section ɹɹɹ ɹɹɹC ɿCrimp socket ⁞ Applicable wire size: 2628 ɿAWG#26 to AWG#28 2830 ɿAWG#28 to AWG#30 3234 ɿAWG#32 to AWG#34 Packaging ɹɹSCF ɿSCF: Female crimp contact / reel ⁡ Number of contacts ɿ2 ⁣ Contact pitch ɿ 2.4mm (Middle pin of 3 pos. is removed, and rated voltage is 100 Vʣ ⁠ Applicable wire size: ɹɹɹɹA ɿAWG#26 to AWG#34 ⁢ Number of contacts ɿ5, 6 DF 57 H − * P − 1.2 V DF 57 H − * S − 1.2 C DF 57 − 2830 SCF DF 57 A H − * S − 1.2 C DF 57 H − 2 P − 2.4 V

DF57 Series●Low Profile “Swing-Lock” Board to Wire Connector for Power [Specifi cation number] (21): Tin plated, Embossed tape packaging (5,000 pcs/reel) [Specifi cation number] (21): Tin plated, Embossed tape packaging (5,000 pcs/reel) ■Header(SMT) 2.225 1.55 0.25 4.35 4.1 P=1.2 1.4 Contact No.1 B C Vacuum area A Contact No.1 1.4 4.1 4.35 0.25 1.55 2.225 Vacuum area B A C 7¤%#%* %#-¤%#%* %#-* %#%* %#, %#%* %#-¤%#%* 8b^c &#'b^c &#'b^c %#-¤%#%* %#-¤%#%* 7¤%#%* 8b^c %#, %#%* %#+ %#%*% %#-* %#%* Recommended PCB layout (Thickness: 1.0mm) Recommended PCB layout (Thickness: 1.0mm) Above image is 3 pos. Unit : mm Part No. HRS No. No. of contacts A B C DF57H-2P-2.4V(21) 666-0109-0 21 2 5.3 2.4 3.7 Unit : mm Part No. HRS No. No. of contacts A B C DF57H-2P-1.2V(21) 666-0104-7 21 2 4.1 1.2 2.5 DF57H-3P-1.2V(21) 666-0105-0 21 3 5.3 2.4 3.7 DF57H-4P-1.2V(21) 666-0106-2 21 4 6.5 3.6 4.9 DF57H-5P-1.2V(21) 666-0107-5 21 5 7.7 4.8 6.1 DF57H-6P-1.2V(21) 666-0108-8 21 6 8.9 6.0 7.3 Note 1 : Embossed tape reel packaging (5,000 pcs/reel). Note 2 : The crossed-shaded area is a no conductive trace area.

DF57 Series●Low Profile “Swing-Lock” Board to Wire Connector for Power [Specifi cation number]() , Blank: Color: White, 1,000 pcs/pack (15): Color: Black, 1,000 pcs/pack ■Crimp socket Cd#& E2&#' )#+ Above image is 3 pos. Unit : mm Part No. No. of contacts H J DF57H-4P-1.2V(21) 4 16 7.5 DF57H-5P-1.2V(21) 5 16 7.5 DF57H-6P-1.2V(21) 6 24 11.5 Unit : mm Part No. HRS No. No. of contacts A B C D ̛̚ Note 1.The quantity is delivered per pack (1,000 pcs.). Order by number of pack. ■Socket for AWG#26 Unit : mm Part No. HRS No. No. of contacts ̛̖̗̘̙̚ Color Note 1.The quantity is delivered per pack (1,000 pcs.). Order by number of pack. 8:CI:GD; K68JJB6G:6 8:CI:GD; K68JJB6G:6 9;*,="'E"'#)K &+¤%#( =¤%#( ?¤%#& )¤%#& 9 : < <"< :": 9"99 ;"; %#&% ¢&#* %#&% ¢&#* '¤%#& )¤%#& '¤%#& -¤%#& -¤%#& 9>G:8I>DCD;JCG::A>C< 9>G:8I>DCD;JCG::A>C<

• Packaging Specification

DF57 Series●Low Profile “Swing-Lock” Board to Wire Connector for Power ■Crimp contact %#, &#+ %#)* %#+. %#-+ '#* (#& %#.(* E2) (#.* i2%#&' [Packaging Specifi cation] Blank: Embossed tape packaging (40,000 pcs/reel) (41) : Embossed tape packaging (35,000 pcs/reel)

• Applicable wire (Tin plated annealed copper wire)
• Strip length 1.0 to 1.4mm BTools Type Part No. HRS No. Applicable contact Applicator AP105-DF57-2628S 901-4622-2 00 DF57-2628SCF AP105-DF57-2830S 901-4618-5 00 DF57-2830SCF AP105-DF57-3234S 901-4629-1 00 DF57-3234SCF Hand crimping tool HT305/DF57-2830HC 902-4635-0 00 DF57-2830SCF Contact extraction tool DF-C-PO(B) 550-0179-2 00 DF57-****SCF Note: If any trouble has occurred due to tools other than the designated tool, Hirose bears no respoisibility for any trouble. Part No. HRS No. Packaging Quantity Finish Applicable wire Applicable socket connector DF57-2628SCF(41) 666-0013-3 41 Reel 35,000 Tin plated AWG#26 rAWG#28 DF57AH-*S-1.2C DF57-2830SCF 666-0001-4 00 40,000 AWG#28 rAWG#30 DF57H-*S-1.2C DF57AH-*S-1.2CDF57-3234SCF 666-0016-1 00 AWG#32 rAWG#34 Note: Embossed tape reel packaging (40,000 pcs/reel). Order by number of reels. Part No. Wire size (Stranded wire conductor) Jacket outer diameter Recommended cable DF57-2628SCF(41) AWG#26ʢ7/Ø0.16mm ʣ Ø0.88mm max. UL3302ɼUL3610 DF57-2830SCF AWG#28ʢ7/Ø0.127mm ʣ Ø0.5mm rØ0.63mm UL1571(Thin wire)ɼ UL10584(ETFE wire)AWG#30ʢ7/Ø0.102mm ʣ DF57-3234SCF AWG#32ʢ7/Ø0.08mm ʣ Ø0.32mm AWG#34ʢ7/Ø0.08mm ʣ Note: When using other than the recommended wire, contact your nearest Hirose sales representative.

DF57 Series●Low Profile “Swing-Lock” Board to Wire Connector for Power 1. Recommended temperature profi le The temperature profi les are based on the above conditions. In individual applications the actual temperature may vary,depending on solder paste type, volume/thickness and board size/thickness. Consult your solder paste and equipment manufacturer for specifi c recommendations. 2.Recommended manual soldering Manual soldering: 350ç ± 10ç for 3 seconds 3. Recommended screen thickness and open area ratio (Pattern area ratio) Thickness: 0.1 mm Open area ratio: 100% 4.Board warpage Maximum of 0.02mm at the connector center, with both ends of the connector as reference points. 5.Cleaning conditions Cl eaning is not recommended. When cleaning, please evaluate as if can deteriorate the performance including mechanical operation and environmental resistance. 6.Precautions ■ When inserting crimp-type (solderless) terminals to crimping (solderless) sockets, to maintain reliable performance, please do not insert obliquely. ■ DO NOT mate/un-mate non-terminated plugs with non-mounted receptacles. This may lead to damage or deformation of the contacts. ■Removal of the holding electric cable may cause damage so please be careful. ■ DO NOT apply fl ux to the contact terminals when hand soldering the receptacle to the board. Wicking of the fl ux into the electrical contact areas may lead to connection failures. ■ Slight discoloration on the insulating materials will not affect form, fit or function of the connectors. ■ Please refer to the documents "Cable assembly Procedure", "Crimp condition" and "Crimp quality standards" for the cable assembly procedures. ■ Please refer to the "Mating/Unmating Operation Instruction Manual" for the connector operation. BUsage Recommendations I>B: hZX &-% &%% &*% '%% '*% ''%î B6M'*% .%s&'%hZX +%hZXB6M &%hZXB6M I:BE:G6IJG:

DF57 Series●Low Profile “Swing-Lock” Board to Wire Connector for Power 7. Insertion and removal operation method 8. Mating compatibility Mating ᶃ Determine position, fitting the external form ᶄ Insert the cable side Un-mating ᶃ Engage lever ᶄ Pull up and release the simple lock ᶅ The reinforced lock is also released and the un-mating is complete ᶅ Push the contact portion side Header DF57H DF57 Socket DF57H DF57 DF57H DF57 Mating compatibility Y Y N Y Additional guiding keys Y N - N DF5 57H 57H F5F57 The characteristics and the specifications contained herein are for reference purpose. Please refer to the latest customer drawings prior to use. The contents of this catalog are current as of date of 08/2014. Contents are subject to change without notice for the purpose of improvements. 2-6-3,Nakagawa Chuoh,Tsuzuki-Ku,Yokohama-Shi 224-8540,JAPAN TEL: +81-45-620-3526 Fax: +81-45-591-3726 http://www.hirose.com http://www.hirose-connectors.com Powered by TCPDF (www.tcpdf.org)