DF30CJ-22DS HIROSE | Alldatasheet
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0.4 mm Pitch, 0.9 mm Height, Board-to-Board / Board-to-FPC Connectors DF30 Series 2004.10 I Overview Continuous miniaturization and increased component density on PCB created demand for extremely low profile connectors. This series is addition of a new extremely low profile connectors to Hirose's wide range of high reliability board-to-board/board-to-FPC connection solutions. I Features 1. Contact reliability Concentration of the contact's normal forces at the single point assures good contact wipe and electrical reliability, while confirming the fully mated condition with a definite tactile click. 2. Self alignment Recognizing the difficulties of mating extremely small connectors in limited spaces the connectors will self align in horizontal axis within 0.3 mm. 3. Automatic board placement Packaged on tape-and-reel the plug and headers have sufficiently large flat areas to allow pick-up with vacuum nozzles of automatic placement equipment. 4. Variety of contact positions and styles Available in standard contact positions of: 20, 22, 24, 30, 34, 40, 50, 60, 70 and 80 with and without metal fittings. Addition of metal fittings does not affect external dimensionsof the connectors. Smaller contact positions are also available. 5. Support for continuity test connector Connectors which have increased insertion and removal durability are available for continuity tests. Contact your Hirose sales representative for details. I Applications Cellular phones, PDA's, mobile computers, digital cameras, digital video cameras, and other devices demanding high reliability connections in extremely limited spaces. Extremely small size 40 positions shown (3.76)(4.56) (0.90) Header Receptacle (0.40) (10.22) I Low profile I Increased mated retention I High contact reliability DF30*-*DS-0.4V Receptacle 0.9mm DF30*-*DP-0.4V Header Protrusion improves mated retention Self alignment 0.3mm
Contact pitch: 0.4 mm Termination section V: Straight SMT Packaging (81): Embossed tape packaging (5,000 pieces per reel) (82): Embossed tape packaging (1,000 pieces per reel) 1. Insulation resistance 50 Mø min. 100V DC 2. Withstanding voltage No flashover or insulation breakdown. 100V AC / one minute 3. Contact resistance 100 mø max. 100 mA 4. Vibration No electrical discontinuity of 1 µs or more Frequency: 10 to 55 Hz, single amplitude of 0.75mm, 2 hours, 3 axis 5. Humidity Contact resistance: 100 mø max. Insulation resistance: 25 Mø min. 6. Temperature cycle 7. Durability Contact resistance: 100 mø max. 50 cycles(Connector for conductivity tests: 500 cycles)(insertions/withdrawals) 8. Resistance to No deformation of components Reflow: At the recommended temperature profile soldering heat affecting performance. Manual soldering: 300 ç for 3 seconds I Materials and Finishes Item Specification Conditions Temperature: -55ç/+5ç to +35ç/+85ç/+5ç to +35ç Duration: 30/10/30/10(Minutes) 5 cycles Contact resistance: 100 mø max. Insulation resistance: 50 Mø min. 96 hours at temperature of 40ç±2ç and RH of 90% to 95% I Product Specifications Note 1: Includes temperature rise caused by current flow. Note 2: The term "storage" refers to products stored for long period of time prior to mounting and use. Operating temperature range and humidity range covers non-conducting condition of installed connectors in storage, shipment or during transportation. Rating Rated current 0.3A Rated voltage 30V AC Storage temperature range -10ç to 60ç (Note 2) Storage humidity range Relative humidity 40% to 70% (Note 2) Operating temperature range : -35ç to 85ç (Note 1) Operating humidity range : Relative humidity 20% to 80% I Ordering information G Receptacles and Headers Connectors Receptacles and Headers Insulator Contacts Metal fittings LCP Phosphor bronze Phosphor bronze Color : Black Gold plated Tin-cupper plated UL94V-0 Component Material Finish Remarks 1 3 42 5 67 Series name: DF30 Configuration FB: With metal fittings, without bosses FC: Without metal fittings, without bosses CJ: Connector for conductivity tests Number of positions: 20, 22, 24, 30, 34, 40, 50, 60, 70, 80 Connector type DS: Double row receptacle DP: Double row header
Unit: mm* Tolerances non- accumulative. Note 1: Order by number of reels. Note 2: Receptacles with 24 or fewer contacts positions will not have recessed areas. [Specification number] -, () (81): Embossed tape packaging (5,000 pieces per reel) Part Number DF30FB-20DS-0.4V() DF30FB-22DS-0.4V() DF30FB-24DS-0.4V() DF30FB-30DS-0.4V() DF30FB-34DS-0.4V() DF30FB-40DS-0.4V() DF30FB-50DS-0.4V() DF30FB-60DS-0.4V() DF30FB-70DS-0.4V() DF30FB-80DS-0.4V() CL684-1098-3- CL684-1099-6- CL684-1100-3- CL684-1101-6- CL684-1102-9- CL684-1103-1- CL684-1104-4- CL684-1105-7- CL684-1106-0- CL684-1107-2- 06.22 06.62 07.02 08.22 09.02 10.22 12.22 14.22 16.22 18.22 03.6 04.0 04.4 05.6 06.4 07.6 09.6 11.6 13.6 15.6 1.20 1.20 1.20 1.20 1.36 1.60 2.00 2.40 2.80 3.20 05.72 06.12 06.52 07.72 08.52 09.72 11.72 13.72 15.72 17.72 06.52 06.92 07.32 08.52 09.32 10.52 12.52 14.52 16.52 18.52 CL No. Number of contacts A B C D E Recommended solder paste thickness: 120 µm P=0.4±0.02 B±0.02 3.46 4.86 0.23±0.02 D E +0.05 -0.05 -0.05 +0.05 2.74 +0.05 HRS logo 0.08 B Note 2 A P=0.4 3.76 4.56 0.9
0.15 Flat surfaceC
2.54 Metal fittings I Receptacles (with metal fittings) BRecommended PCB mounting pattern
Unit: mm* Tolerances non- accumulative. Note 1: Order by number of reels. Note 2: Receptacles with 24 or fewer contacts positions will not have recessed areas. [Specification number] -, () (81): Embossed tape packaging (5,000 pieces per reel) Part Number DF30FC-20DS-0.4V() DF30FC-22DS-0.4V() DF30FC-24DS-0.4V() DF30FC-30DS-0.4V() DF30FC-34DS-0.4V() DF30FC-40DS-0.4V() DF30FC-50DS-0.4V() DF30FC-60DS-0.4V() DF30FC-70DS-0.4V() DF30FC-80DS-0.4V() CL684-1109-8- CL684-1110-7- CL684-1111-0- CL684-1112-2- CL684-1113-5- CL684-1078-6- CL684-1114-8- CL684-1082-3- CL684-1115-0- CL684-1116-3- 06.22 06.62 07.02 08.22 09.02 10.22 12.22 14.22 16.22 18.22 03.6 04.0 04.4 05.6 06.4 07.6 09.6 11.6 13.6 15.6 1.20 1.20 1.20 1.20 1.36 1.60 2.00 2.40 2.80 3.20 CL No. Number of contacts A B C P=0.4 ±0.02 B ±0.02 3.46 4.86 0.23 ±0.02 Recommended solder paste thickness: 120 µm +0.05 -0.05 HRS logo 0.08 B A 3.76 4.56 0.9 P=0.4 Note 2 I Receptacles (without metal fittings) BRecommended PCB mounting pattern
Unit: mm* Tolerances non- accumulative. Note 1: Order by number of reels. Note 2: Headers with 24 or fewer contacts positions will not have protruding areas. [Specification number] -, () (81): Embossed tape packaging (5,000 pieces per reel) Part Number DF30FB-20DP-0.4V() DF30FB-22DP-0.4V() DF30FB-24DP-0.4V() DF30FB-30DP-0.4V() DF30FB-34DP-0.4V() DF30FB-40DP-0.4V() DF30FB-50DP-0.4V() DF30FB-60DP-0.4V() DF30FB-70DP-0.4V() DF30FB-80DP-0.4V() CL684-1129-5- CL684-1130-4- CL684-1131-7- CL684-1132-0- CL684-1133-2- CL684-1134-5- CL684-1135-8- CL684-1074-5- CL684-1075-8- CL684-1136-0- 05.14 05.54 05.94 07.14 07.94 09.14 11.14 13.14 15.14 17.14 03.6 04.0 04.4 05.6 06.4 07.6 09.6 11.6 13.6 15.6 1.20 1.20 1.20 1.20 1.36 1.60 2.00 2.40 2.80 3.20 04.64 05.04 05.44 06.64 07.44 08.64 10.64 12.64 14.64 16.64 05.44 05.84 06.24 07.44 08.24 09.44 11.44 13.44 15.44 17.44 CL No. Number of contacts A B C D E 3.42 0.23 ±0.02 P=0.4 ±0.02 B ±0.02 D E Recommended solder paste thickness: 120 µm +0.05 1.3 +0.05 -0.05 +0.05 -0.05 Note 2 Note 2
0.15 HRS logoFlat surfaceC
P=0.4 B A A 2.32 3.12 0.8 1.1 0.08 Metal fittings I Header (with metal fittings) BRecommended PCB mounting pattern
Unit: mm* Tolerances non- accumulative. Note 1: Order by number of reels. Note 2: Headers with 24 or fewer contacts positions will not have protruding areas. [Specification number] -, () (81): Embossed tape packaging (5,000 pieces per reel) Part Number DF30FC-20DP-0.4V() DF30FC-22DP-0.4V() DF30FC-24DP-0.4V() DF30FC-30DP-0.4V() DF30FC-34DP-0.4V() DF30FC-40DP-0.4V() DF30FC-50DP-0.4V() DF30FC-60DP-0.4V() DF30FC-70DP-0.4V() DF30FC-80DP-0.4V() CL684-1138-6- CL684-1139-9- CL684-1140-8- CL684-1141-0- CL684-1142-3- CL684-1079-9- CL684-1143-6- CL684-1083-6- CL684-1077-3- CL684-1144-9- 05.14 05.54 05.94 07.14 07.94 09.14 11.14 13.14 15.14 17.14 03.6 04.0 04.4 05.6 06.4 07.6 09.6 11.6 13.6 15.6 1.20 1.20 1.20 1.20 1.36 1.60 2.00 2.40 2.80 3.20 CL No. Number of contacts A B C 3.42 0.23±0.02 P=0.4±0.02 B ±0.02 Recommended solder paste thickness: 120 µm +0.05 -0.05 Note 2 Note 2 0.08 P=0.4 B A 2.32 3.12 0.8 A I Header (without metal fittings) BRecommended PCB mounting pattern
Unit: mm Embossed tape 32mm or wider will have perforated feed holes on two sides. Part Number DF30 #-20DS-0.4V() DF30 #-22DS-0.4V() DF30 #-24DS-0.4V() DF30 #-30DS-0.4V() DF30 #-34DS-0.4V() DF30 #-40DS-0.4V() DF30 #-50DS-0.4V() DF30 #-60DS-0.4V() DF30 #-70DS-0.4V() DF30 #-80DS-0.4V() 16.0 16.0 16.0 16.0 16.0 24.0 24.0 24.0 24.0 32.0 28.4 07.5 07.5 07.5 07.5 07.5 11.5 11.5 11.5 11.5 14.2 16.4 16.4 16.4 16.4 16.4 24.4 24.4 24.4 24.4 32.4 22.4 22.4 22.4 22.4 22.4 30.4 30.4 30.4 30.4 38.4 A B C D E 1.75±0.18±0.1 1.4±0.15 0.3±0.1 (2.3) F-F GG F H G-G F4±0.1 2±0.1 C±0.1 B±0.1 A±0.3 0.2±0.05 Unreeling direction Ø1.5 +0.10 AA A 1.7+0.25 -0.05 Detail H 1.5+0.2 R0.75 +0.10 R0.75 +0.1 E MAX (Ø80) Ø380±2 Ø13±0.2 Ø21±0.8 2±0.5 Part number label D+2 Unreeling direction BPackaging Specification G Embossed Carrier Tape Dimensions - Receptacle G Reel Dimensions
G Embossed Carrier Tape Dimensions - Header G Reel Dimensions 1.3±0.15 0.3±0.1 (2.2) E-E FF E AAA F-F E 2±0.1 B±0.1 A±0.3 Unreeling direction Ø1.5 +0.10 Unit: mm Part Number DF30 #-20DP-0.4V() DF30 #-22DP-0.4V() DF30 #-24DP-0.4V() DF30 #-30DP-0.4V() DF30 #-34DP-0.4V() DF30 #-40DP-0.4V() DF30 #-50DP-0.4V() DF30 #-60DP-0.4V() DF30 #-70DP-0.4V() DF30 #-80DP-0.4V() 16.0 16.0 16.0 16.0 16.0 16.0 24.0 24.0 24.0 24.0 07.5 07.5 07.5 07.5 07.5 07.5 11.5 11.5 11.5 11.5 16.4 16.4 16.4 16.4 16.4 16.4 24.4 24.4 24.4 24.4 22.4 22.4 22.4 22.4 22.4 22.4 30.4 30.4 30.4 30.4 A B C D D MAX (Ø80) Ø380±2 Ø13±0.2 Ø21±0.8 2±0.5 Part number label C+2 Unreeling direction
- Recommended manual soldering 3. Recommended screen thickness and open area ratio (Pattern area ratio) 4.Board warpage 5.Cleaning conditions 6. Precautions 1. Recommended temperature profile I Due to the extremely small size of the connectors, handling it with bare hands should be avoided. Follow the recommendations given on the proceeding pages. I Use of fluxes is NOT recommended. I Different production lots may exhibit some discoloration of the insulator material. This will not affect form, fit or function of the connectors. I The connectors should not be used a sole PCB support. It is recommended to use additional means of board support. Refer to "Nylon Connector Use Handbook". Maximum of 0.02 mm at the connector center, with both ends of the connector as reference points. Manual soldering: 290±10ç for 3 seconds Note 1: Up to 2 cycles of Reflow soldering are possible under the same conditions, provided that there is a return to normal temperature between the first and second cycle. Note 2: The temperature profile indicates the board surface temperature at the point of contacts with the connector terminals. Thickness: 0.12 mm Opening are ratio: DS side 100%, DP side 84% (Temperature) Reflow Conditions Preheating: 150ç to 170ç 60 to 120 sec. Soldering: 245±5ç 10 sec. max. 220ç 60 sec. max. 250ç max. 220ç 200ç 250ç 150ç 100ç 60 to 120 sec. 60 sec. max. 50ç 0 sec. 50 sec. 100 sec. 150 sec. (Time) 10 sec. max
BHandling Precautions when mating the connectors 0.3mm Receptacle Header 0.3mm Keep the connectors parallel to each other when positioning. Do not attempt to mate the connectors starting at one end or side. Press-down evenly until slight resistance is felt. Overcoming this slight resistance will complete the mating of receptacle with the header. A definite "click" sensation will confirm the fully mated condition.
BHandling Precautions when un-mating the connectors DF30*-*DS-0.4V(81) DF30*-*DP-0.4V(81) Receptacle Header Lift even one side, keeping both boards parallel to each other. Fully mated When handling circumstances prevent the connector from being kept level during un-mating, one end may be lifted separate as shown on Fig. A. However, to utilize this procedure the connector must be mounted on a sufficiently rigid circuit board. Any deflection of the board during this operation may result in damage to the connector or solder joints. Do not attempt the start of the un-mating of the connectors from one side (Fig. B). When removal is from the width orientation as illustrated in the diagram to the left, damage could be caused to the connector. Do not perform removal from the width orientation. Fig. A Fig. B