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Technical content

Formosa MSDF15005S THRU DF1510S Document ID Issued Date Revised Date Revision Page. DS-241104 2008/02/10 2013/06/10 D 7 http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141

1.5A Miniature Glass Passivated Single-Phase Surface Mount Bridge Rectifiers-50-1000V

Features

Surge overload ratings to 50 amperes peak. Surface mount type for automated replacement. Ideal for printed board. Low forward drop down voltage. Reliable low cost construction utilizing molded plastic technology results in inexpensive product. Glass passivated chip junctions.

  • UL recognized file # E321971 Lead-free parts meet RoHS requirments.
  • Suffix "-H" indicates Halogen free parts, ex. DF15005S-H. Mechanical data Epoxy:UL94-V0 rated flame retardant
  • Case : Molded plastic, DFS
  • Terminals : Solder plated, solderable per MIL-STD-750, Method 2026
  • Polarity : marked on body
  • Mounting Position : Any
  • Weight : Approximated 0.34 gram Package outline Page 2 DF15005S DF1501S DF1502S 100 200 140 SYMBOLS VRRM (V) VRMS VR (V) (V) *1 *2 *3 *1 Repetitive peak reverse voltage *2 RMS voltage *3 Continuous reverse voltage *4 Maximum forward voltage @IF=1.5A VF (V) DF1504S DF1506S 400 600 280 420 -55 to +150 DF1508S DF1510S 800 1000 560 700 100 200 400 600 800 1000 1.10 Dimensions in inches and (millimeters) DFS .255(6.5) .335(8.5) .102(2.6) .410(10.4) .013(.33) .060(1.5) .205(5.2) .346(8.8) .047(1.2) .245(6.2) .307(7.8) .089(2.2) .360(9.4) .003(.08) .040(1.0) .195(5.0) .307(7.8) .038(1.0) ~ ~ Document ID Issued Date Revised Date Revision Page. Formosa MS O ( C) Operating temperature T ,J http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 SMD Bridge Rectifier DF15005S THRU DF1510S PARAMETER CONDITIONS Forward rectified current Forward surge current Reverse current Typical thermal resistance See Fig.1 8.3ms single half sine-wave superimposed on rate load (JEDEC methode) Symbol MIN. TYP. MAX. UNIT IO IFSM IR RθJA A A uA O C/W 1.5 O V = V T = 25 CR RRM J O V = V T = 125 CR RRM J 500 Typical Junction Capacitance Per Element CJ pF25 I t Rating for Fusing 2 I t 2 A s10.4 Storage temperature TSTG O C+175-65 Maximum ratings and Electrical Characteristics (AT T =25A o C unless otherwise noted) Junction to ambient mounted on P.C.B with 0.5*0.5"(13*13mm) copper pads. Measured at 1.0MHz and applied reverse voltage of 4.0V DC t<8.3ms DS-241104 2008/02/10 2013/06/10 D 7

Rating and characteristic curves (DF15005S THRU DF1510S) Document ID Issued Date Revised Date Revision Page. http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 NUMBER OF CYCLES AT 60Hz FIG.2-MXIMUM NON-REPETITIVE SURGE CURRENT PEAK FORWARD SURGE CURRENT, AMPERES 1 2 5 10 20 50 100 SINGE HALF-SINE-WAVE (JEDEC METHOD) FIG.1-FORWARD CURRENT DERATING CURVE AMBIENT TEMPERATURE, °C AVERAGE FORWARD CURRENT AMPERES 50 100 150 0.00 0.25 0.50 0.75 1.00 1.25 1.50 SINGLE PHASE HALF WAVE 60Hz RESISTIVE OR INDUCTIVE LOAD INSTANTANEOUS FORWARD CURRENT,(A) INSTANTANEOUS FORWARD VOLTAGE,VOLTS FIG.4-TYPICAL FORWARD CHARACTERISTICS 0.01 0.1 1.0 TJ=25°C PULSE WIDTH:300us 2% DUTY CYCLE FIG.3-TYPICAL JUNCTION CAPACITANCE REVERSE VOLTAGE,(VOLTS) CAPACITANCE(pF) 10.0 100 0.1 1.0 4.0 1.0 100 TJ=25°C,f=1MHZ FIG.5-TYPICAL REVERSE CHARACTERISTICS TJ=25°C TJ=125°C 0 20 40 60 80 100 120 140 0.01 0.1 1.0 100 INSTANTANEOUS REVERSE CURRENT,(µA) PERCENT OF RATED PEAK REVERSE VOLTAGE,(%) DS-241104 2008/02/10 2013/06/10 D 7

Suggested solder pad layout Dimensions in inches and (millimeters) B 0.047 (1.20) A 0.059 (1.50) C 0.157 (4.00) PACKAGE DFS Page 4 ~ ~ B D C A D 0.291 (7.40) Document ID Issued Date Revised Date Revision Page. Formosa MS http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 SMD Bridge Rectifier ~ ~ DF15005S THRU DF1510S DS-241104 2008/02/10 2013/06/10 D 7

Document ID Issued Date Revised Date Revision Page. Formosa MS http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 SMD Bridge Rectifier DF15005S THRU DF1510S Packing information E d F W P A D Item Tolerance DFS Carrier width Carrier length Carrier depth Sprocket hole 13" Reel outside diameter 7" Reel outside diameter 13" Reel inner diameter 7" Reel inner diameter Feed hole diameter Sprocket hole position Punch hole position Punch hole pitch Sprocket hole pitch Embossment center Reel width Overall tape thickness Tape width E B C d F T W P A D D Symbol 0.1 0.1 0.1 min min 0.5 0.1 0.3 1.0 0.1 0.1 0.1 0.1 0.1 0.1 2.0 2.0 unit:mm 1.50 330.00 50.00 13.00 1.75 7.50 12.00 4.00 2.00 0.30 16.00 22.00 Note:Devices are packed in accor dance with EIA standar RS-481-A and specifications listed above. 8.64 10.41 3.50 B C T DS-241104 2008/02/10 2013/06/10 D 7 ~ ~

Document ID Issued Date Revised Date Revision Page. Formosa MS http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 SMD Bridge Rectifier DF15005S THRU DF1510S Profile Feature Soldering Condition Average ramp-up rate(TL to TP) <3 /sec Preheat o -Temperature Min(Tsmin) 150 C o -Temperature Max(Tsmax) 200 C -Time(min to max)(ts) 60~120sec Tsmax to TL o -Ramp-upRate <3 C/sec Time maintained above: o -Temperature(TL) 217 C -Time(tL) 60~260sec o o Peak Temperature(TP) 255 C-0/+5 C o Time within 5 C of actual Peak Temperature(tP) o Ramp-down Rate <6 C/sec o Time 25 C to Peak Temperature <6minutes o C 3.Reflow soldering 10~30sec 1.Storage environment: Temperature=5 ~40 Humidity=55%±25% 2.Reflow soldering of surface-mount devices o o C C Suggested thermal profiles for soldering processes Critical Zone TL to TP TL Tsmax Tsmin Ramp-up Tp tS Preheat o t25 C to Peak Time TL TP Ramp-down Temperature Reel packing and tube packing DFS 13" 1,000 12.0 2,000 337*337*37 330 350*330*360 12,000 11.0 PACKAGE REEL SIZE REEL COMPONENT SPACING BOX INNER BOX REEL DIA, CARTON SIZE CARTON APPROX. GROSS WEIGHT (kg)(pcs)(m/m)(m/m)(m/m)(pcs)(m/m)(pcs) DFS 50 423*12.0*4.8 452*164*130 10,000 5.4 PACKAGE TUBE TUBE SIZE CARTON SIZE CARTON APPROX. GROSS WEIGHT (kg)(pcs)(m/m)(m/m)(pcs) DS-241104 2008/02/10 2013/06/10 D 7

Document ID Issued Date Revised Date Revision Page. Formosa MS http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 SMD Bridge Rectifier DF15005S THRU DF1510S 1. Solder Resistance 2. Solderability 3. High Temperature Reverse Bias 4. Forward Operation Life 5. Intermittent Operation Life 6. Pressure Cooker 7. Temperature Cycling 8. Thermal Shock 9. Forward Surge 10. Humidity 11. High Temperature Storage Life at 260 5 for 10 2sec. immerse body into solder 1/16"±1/32" O at 245±5 C for 5 sec. O V =80% rate at T =150 C for 168 hrs.R J O Rated average rectifier current at T =25 C for 500hrs.A O T = 25 C, I = IA F O On state: power on for 5 min. off state: power off for 5 min. on and off for 500 cycles. O 15P at T =121 C for 4 hrs.SIG A O O -55 C to +125 C dwelled for 30 min. and transferred for 5min. total 10 cycles. O O 0 C for 5 min. rise to 100 C for 5 min. total 10 cycles. 8.3ms single half sine-wave superimposed on rated load, one surge. O at T =85 C, RH=85% for 1000hrs.A O at 175 C for 1000 hrs. O ± C ± MIL-STD-750D METHOD-2031 MIL-STD-202F METHOD-208 MIL-STD-750D METHOD-1038 MIL-STD-750D METHOD-1027 MIL-STD-750D METHOD-1036 JESD22-A102 MIL-STD-750D METHOD-1051 MIL-STD-750D METHOD-1056 MIL-STD-750D METHOD-4066-2 MIL-STD-750D METHOD-1021 MIL-STD-750D METHOD-1031 Item Test Conditions Reference High reliability test capabilities DS-241104 2008/02/10 2013/06/10 D 7