DATASHEET SEARCH SITE | WWW.ALLDATASHEET.COM

Document overview

  • Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
  • PDF pages: 7

Technical content

Formosa MSDF005S THRU DF10S Document ID Issued Date Revised Date Revision Page. DS-241132 2008/02/10 2013/06/10 C 7 http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141

Features

Surge overload ratings to 30 amperes peak. Surface mount type for automated replacement. Ideal for printed board. Low forward drop down voltage. Reliable low cost construction utilizing molded plastic technology results in inexpensive product. Glass passivated chip junctions. Lead-free parts meet RoHS requirments.

  • UL recognized file # E321971
  • Suffix "-H" indicates Halogen free parts, ex. DF005S-H. Mechanical data Epoxy:UL94-V0 rated flame retardant
  • Case : Molded plastic, DFS
  • Terminals : Solder plated, solderable per MIL-STD-750, Method 2026
  • Polarity : marked on body
  • Mounting Position : Any
  • Weight : Approximated 0.34 gram Package outline Page 2 DF005S DF01S DF02S 100 200 140 SYMBOLS VRRM (V) VRMS VR (V) (V) *1 *2 *3 *1 Repetitive peak reverse voltage *2 RMS voltage *3 Continuous reverse voltage *4 Maximum forward voltage@I =1.0AF VF (V) DF04S DF06S 400 600 280 420 -55 to +150 DF08S DF10S 800 1000 560 700 100 200 400 600 800 1000 1.10 Dimensions in inches and (millimeters) DFS .255(6.5) .335(8.5) .102(2.6) .410(10.4) .013(.33) .060(1.5) .205(5.2) .346(8.8) .047(1.2) .245(6.2) .307(7.8) .089(2.2) .360(9.4) .003(.08) .040(1.0) .195(5.0) .307(7.8) .038(1.0) ~ ~ Formosa MS O ( C) Operating temperature T ,J http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 SMD Bridge Rectifier Document ID Issued Date Revised Date Revision Page. DF005S THRU DF10S PARAMETER CONDITIONS Forward rectified current Forward surge current Reverse current Typical thermal resistance See Fig.1 8.3ms single half sine-wave superimposed on rate load (JEDEC methode) Symbol MIN. TYP. MAX. UNIT IO IFSM IR RθJA A A uA O C/W 1.0 O V = V T = 25 CR RRM J O V = V T = 125 CR RRM J 500 Typical Junction Capacitance Per Element CJ pF25 I t Rating for Fusing 2 I t 2 A s3.74 Storage temperature TSTG O C+175-65 Maximum ratings and Electrical Characteristics (AT T =25A o C unless otherwise noted) Junction to ambient mounted on P.C.B with 0.5*0.5"(13*13mm) copper pads. Measured at 1.0MHz and applied reverse voltage of 4.0V DC t<8.3ms 1.0A Miniature Glass Passivated Single-Phase Surface Mount Bridge Rectifiers-50-1000V DS-241132 2008/02/10 2013/06/10 C 7

Rating and characteristic curves (DF005S THRU DF10S) http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Document ID Issued Date Revised Date Revision Page. AMBIENT TEMPERATURE, °C FIG.1-FORWARD CURRENT DERATING CURVE AVERAGE FORWARD CURRENT AMPERES 50 100 150 0.1 0.2 0.4 0.6 0.8 1.0 MOUNTED ON PC BOARD SINGLE PHASE HALF WAVE 60Hz RESISTIVE OR INDUCTIVE LOAD NUMBER OFCYCLES AT 60Hz FIG.2-MXIMUM NON-REPETITIVE SURGE CURRENT PEAK FORWARD SURGE CURRENT, AMPERES 1 2 5 10 20 50 100 SINGLE HALF-SINE-WAVE (JEDEC METHOD) 0.01 0.1 1.0 INSTANTANEOUS FORWARD VOLTAGE,VOLTS INSTANTANEOUS FORWARD CURRENT,(A) FIG.4-TYPICAL FORWARD CHARACTERISTICS TJ=25°C PULSE WIDTH:300us 2% DUTY CYCLE FIG.3-TYPICAL JUNCTION CAPACITANCE REVERSE VOLTAGE,(VOLTS) CAPACITANCE(pF) 10.0 100 0.1 1.0 4.0 1.0 100 TJ=25°C,f=1MHZ FIG.5-TYPICAL REVERSE CHARACTERISTICS TJ=25°C TJ=125°C 0 20 40 60 80 100 120 140 0.01 0.1 1.0 100 INSTANTANEOUS REVERSE CURRENT,(µA) PERCENT OF RATED PEAK REVERSE VOLTAGE,(%) DS-241132 2008/02/10 2013/06/10 C 7

Suggested solder pad layout Dimensions in inches and (millimeters) B 0.047 (1.20) A 0.059 (1.50) C 0.157 (4.00) PACKAGE DFS Page 4 ~ ~ B D C A D 0.291 (7.40) Formosa MS http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 SMD Bridge Rectifier Document ID Issued Date Revised Date Revision Page. ~ ~ DF005S THRU DF10S DS-241132 2008/02/10 2013/06/10 C 7

E d F W P A D Item Tolerance DFS Carrier width Carrier length Carrier depth Sprocket hole 13" Reel outside diameter 7" Reel outside diameter 13" Reel inner diameter 7" Reel inner diameter Feed hole diameter Sprocket hole position Punch hole position Punch hole pitch Sprocket hole pitch Embossment center Reel width Overall tape thickness Tape width E B C d F T W P A D D Symbol 0.1 0.1 0.1 min min 0.5 0.1 0.3 1.0 0.1 0.1 0.1 0.1 0.1 0.1 2.0 2.0 unit:mm 1.50 330.00 50.00 13.00 1.75 7.50 12.00 4.00 2.00 0.30 16.00 22.00 Note:Devices are packed in accor dance with EIA standar RS-481-A and specifications listed above. 8.64 10.41 3.50 Formosa MS http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 SMD Bridge Rectifier Document ID Issued Date Revised Date Revision Page. DF005S THRU DF10S B C T DS-241132 2008/02/10 2013/06/10 C 7 ~ ~

Reel packing and tube packing Page 6 DFS 13" 1,000 12.0 2,000 337*337*37 330 350*330*360 12,000 11.0 PACKAGE REEL SIZE REEL COMPONENT SPACING BOX INNER BOX REEL DIA, CARTON SIZE CARTON APPROX. GROSS WEIGHT (kg)(pcs)(m/m)(m/m)(m/m)(pcs)(m/m)(pcs) DFS 50 423*12.0*4.8 452*164*130 10,000 5.4 PACKAGE TUBE TUBE SIZE CARTON SIZE CARTON APPROX. GROSS WEIGHT (kg)(pcs)(m/m)(m/m)(pcs) Formosa MS http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 SMD Bridge Rectifier Document ID Issued Date Revised Date Revision Page. DF005S THRU DF10S Profile Feature Soldering Condition Average ramp-up rate(TL to TP) <3 /sec Preheat o -Temperature Min(Tsmin) 150 C o -Temperature Max(Tsmax) 200 C -Time(min to max)(ts) 60~120sec Tsmax to TL o -Ramp-upRate <3 C/sec Time maintained above: o -Temperature(TL) 217 C -Time(tL) 60~260sec o o Peak Temperature(TP) 255 C-0/+5 C o Time within 5 C of actual Peak Temperature(tP) o Ramp-down Rate <6 C/sec o Time 25 C to Peak Temperature <6minutes o C 3.Reflow soldering 10~30sec 1.Storage environment: Temperature=5 ~40 Humidity=55%±25% 2.Reflow soldering of surface-mount devices o o C C Suggested thermal profiles for soldering processes Critical Zone TL to TP TL Tsmax Tsmin Ramp-up Tp tS Preheat o t25 C to Peak Time TL TP Ramp-down Temperature DS-241132 2008/02/10 2013/06/10 C 7

  1. Solder Resistance 2. Solderability 3. High Temperature Reverse Bias 4. Forward Operation Life 5. Intermittent Operation Life 6. Pressure Cooker 7. Temperature Cycling 8. Thermal Shock 9. Forward Surge 10. Humidity 11. High Temperature Storage Life at 260 5 for 10 2sec. immerse body into solder 1/16"±1/32" O at 245±5 C for 5 sec. O V =80% rate at T =150 C for 168 hrs.R J O Rated average rectifier current at T =25 C for 500hrs.A O T = 25 C, I = IA F O On state: power on for 5 min. off state: power off for 5 min. on and off for 500 cycles. O 15P at T =121 C for 4 hrs.SIG A O O -55 C to +125 C dwelled for 30 min. and transferred for 5min. total 10 cycles. O O 0 C for 5 min. rise to 100 C for 5 min. total 10 cycles. 8.3ms single half sine-wave superimposed on rated load, one surge. O at T =85 C, RH=85% for 1000hrs.A O at 175 C for 1000 hrs. O ± C ± MIL-STD-750D METHOD-2031 MIL-STD-202F METHOD-208 MIL-STD-750D METHOD-1038 MIL-STD-750D METHOD-1027 MIL-STD-750D METHOD-1036 JESD22-A102 MIL-STD-750D METHOD-1051 MIL-STD-750D METHOD-1056 MIL-STD-750D METHOD-4066-2 MIL-STD-750D METHOD-1021 MIL-STD-750D METHOD-1031 Item Test Conditions Reference High reliability test capabilities http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 SMD Bridge Rectifier Document ID Issued Date Revised Date Revision Page. DF005S THRU DF10S DS-241132 2008/02/10 2013/06/10 C 7