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Document overview

  • Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
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Technical content

Document ID Issued Date Revised Date Revision Page. DS-242134 2009/02/10 2013/06/10 C 6 http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141

Features

Surge overload ratings to 30 amperes peak. Recommended for non-automatic applications. Ideal for & save space on printed circuit board. Applicable for automatic insertion. Reliable low cost construction utilizing molded plastic technology results in inexpensive product. Glass passivated chip junctions. Lead-free parts meet RoHS requirments.

  • UL recognized file # E321971
  • Suffix "-H" indicates Halogen free parts, ex. DF005-H. Mechanical data Epoxy:UL94-V0 rated flame retardant
  • Case : Molded plastic, DF
  • Terminals : Solder plated, solderable per MIL-STD-750, Method 2026
  • Polarity : marked on body
  • Mounting Position : Any
  • Weight : Approximated 0.38 gram Package outline Page 2 Dimensions in inches and (millimeters) DF Bridge Rectifier Formosa MS http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 DF005 THRU DF10 Document ID Issued Date Revised Date Revision Page. DF005 DF01 DF02 100 200 140 SYMBOLS VRRM (V) VRMS VR (V) (V) *1 *2 *3 VF (V) DF04 DF06 400 600 280 420 -55 to +150 DF08 DF10 800 1000 560 700 100 200 400 600 800 1000 1.10 O ( C) Operating temperature T ,J *1 Repetitive peak reverse voltage *2 RMS voltage *3 Continuous reverse voltage *4 Maximum forward voltage@IF=1.0A 1.0A Glass Passivated Single-PhaseBridge Rectifiers-50-1000V PARAMETER CONDITIONS Forward rectified current Forward surge current Reverse current Typical thermal resistance See Fig.1 8.3ms single half sine-wave superimposed on rate load (JEDEC methode) Symbol MIN. TYP. MAX. UNIT IO IFSM IR RθJA A A uA O C/W 1.0 O V = V T = 25 CR RRM J O V = V T = 125 CR RRM J 500 Typical Junction Capacitance Per Element CJ pF25 I t Rating for Fusing 2 I t 2 A s3.74 Storage temperature TSTG O C+175-65 Maximum ratings and Electrical Characteristics (AT T =25A o C unless otherwise noted) Junction to ambient mounted on P.C.B with 0.5*0.5"(13*13mm) copper pads. Measured at 1.0MHz and applied reverse voltage of 4.0V DC t<8.3ms DS-242134 2009/02/10 2013/06/10 C 6

Rating and characteristic curves (DF005 THRU DF10) http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Document ID Issued Date Revised Date Revision Page. AMBIENT TEMPERATURE, °C FIG.1-FORWARD CURRENT DERATING CURVE AVERAGE FORWARD CURRENT AMPERES 50 100 150 0.1 0.2 0.4 0.6 0.8 1.0 MOUNTED ON PC BOARD SINGLE PHASE HALF WAVE 60Hz RESISTIVE OR INDUCTIVE LOAD INSTANTANEOUS FORWARD VOLTAGE,VOLTS INSTANTANEOUS FORWARD CURRENT,(A) FIG.4-TYPICAL FORWARD CHARACTERISTICS TJ=25°C PULSE WIDTH:300us 2% DUTY CYCLE 0.01 0.1 1.0 FIG.3-TYPICAL JUNCTION CAPACITANCE REVERSE VOLTAGE,(VOLTS) CAPACITANCE(pF) 10.0 100 0.1 1.0 4.0 1.0 100 TJ=25°C,f=1MHZ NUMBER OFCYCLES AT 60Hz FIG.2-MXIMUM NON-REPETITIVE SURGE CURRENT PEAK FORWARD SURGE CURRENT, AMPERES 1 2 5 10 20 50 100 Pulse Wldth 8.3ms SINGLE HALF-SINE-WAVE (JEDEC METHOD) FIG.5-TYPICAL REVERSE CHARACTERISTICS TJ=25°C TJ=125°C 0 20 40 60 80 100 120 140 0.01 0.1 1.0 100 INSTANTANEOUS REVERSE CURRENT,(µA) PERCENT OF RATED PEAK REVERSE VOLTAGE,(%) DS-242134 2009/02/10 2013/06/10 C 6

DF 50 420*12.0*9.9 452*164*130 5,000 3.0 PACKAGE TUBE TUBE SIZE CARTON SIZE CARTON APPROX. GROSS WEIGHT (kg)(pcs)(m/m)(m/m)(pcs) Bridge Rectifier Formosa MS http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 DF005 THRU DF10 Document ID Issued Date Revised Date Revision Page. ~ ~ DS-242134 2009/02/10 2013/06/10 C 6

http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 DF005 THRU DF10 Document ID Issued Date Revised Date Revision Page. Suggested thermal profiles for soldering processes Temperature(°C) 1.Lead free temperature profile wave-soldering 0 20 40 60 80 100 120 140 160 180 200 220 240 Time(Sec) 100 120 140 160 180 200 220 240 260 280 Preheat Max gradient 2ºC/s Peak Max well time 5 Max Cool Down Max gradient-4ºC/s Suggested gradient 2ºC/s or less Peak soldering temperature not to exceed 260ºC DS-242134 2009/02/10 2013/06/10 C 6

http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 DF005 THRU DF10 Document ID Issued Date Revised Date Revision Page. 1. Solder Resistance 2. Solderability 3. High Temperature Reverse Bias 4. Forward Operation Life 5. Intermittent Operation Life 6. Pressure Cooker 7. Temperature Cycling 8. Thermal Shock 9. Forward Surge 10. Humidity 11. High Temperature Storage Life at 260 5 for 10 2sec. immerse body into solder 1/16"±1/32" O at 245±5 C for 5 sec. O V =80% rate at T =150 C for 168 hrs.R J O Rated average rectifier current at T =25 C for 500hrs.A O T = 25 C, I = IA F O On state: power on for 5 min. off state: power off for 5 min. on and off for 500 cycles. O 15P at T =121 C for 4 hrs.SIG A O O -55 C to +125 C dwelled for 30 min. and transferred for 5min. total 10 cycles. O O 0 C for 5 min. rise to 100 C for 5 min. total 10 cycles. 8.3ms single half sine-wave superimposed on rated load, one surge. O at T =85 C, RH=85% for 1000hrs.A O at 175 C for 1000 hrs. O ± C ± MIL-STD-750D METHOD-2031 MIL-STD-202F METHOD-208 MIL-STD-750D METHOD-1038 MIL-STD-750D METHOD-1027 MIL-STD-750D METHOD-1036 JESD22-A102 MIL-STD-750D METHOD-1051 MIL-STD-750D METHOD-1056 MIL-STD-750D METHOD-4066-2 MIL-STD-750D METHOD-1021 MIL-STD-750D METHOD-1031 Item Test Conditions Reference High reliability test capabilities DS-242134 2009/02/10 2013/06/10 C 6