DEMO-HMPP-389T

DEMO-HMPP-389T BOARDCOM | Alldatasheet

Document overview

• Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
• PDF pages: 12

Technical content

Features

• Surface mount MiniPak package
• Better thermal conductivity for higher power dissipa- tion
• Single and dual versions
• Matched diodes for consistent performance
• Low capacitance
• Low resistance at low current
• Low FIT (Failure in Time) rate*
• Six-sigma quality level * For more information, see the Surface Mount Schottky Reliability Data Sheet. Pin Connections and Package Marking Notes: 1. Package marking provides orientation and identification. 2. See “Electrical Specifications” for appropri- ate package marking. Product code Date code AA Single Anti-parallel Parallel (Minipak 1412) (Minipak 1412) (Minipak 1412) Shunt Switch TAnode Cathode Cathode Anode

HMPP-389x Series Absolute Maximum Ratings[1], TC = 25°C MiniPak 1412 / Symbol Parameter Units MiniPak QFN If Forward Current (1 µs pulse) Amp 1 PIV Peak Inverse Voltage V 100 Tj Junction Temperature °C 150 Tstg Storage Temperature °C -65 to +150 qjc Thermal Resistance[2] °C/W 150 Notes: 1. Operation in excess of any one of these conditions may result in permanent damage to the device. 2. TC = +25°C, where TC is defined to be the temperature at the package pins where contact is made to the circuit board. MiniPak1412 Electrical Specifications, TC = +25°C, each diode Part Number Package Minimum Breakdown Maximum Series Maximum Total HMPP- Marking Code Lead Code Configuration Voltage (V) Resistance (Ω) Capacitance (pF) 3890 D 0 Single 100 2.5 0.30

3892 C 2 Anti-parallel

3895 B 5 Parallel

Test Conditions VR = VBR IF = 5 mA VR = 5V Measure IR ≤ 10 µA f = 100 MHz f = 1 MHz ESD WARNING: Handling Precautions Should Be Taken To Avoid Static Discharge. MiniPak1412 Typical Parameters, TC = +25°C Part Number Series Resistance Carrier Lifetime Total Capacitance HMPP- RS (Ω) τ (ns) CT (pF) 389x 3.8 200 0.20 @ 5 V Test Conditions IF = 1 mA IF = 10 mA f = 100 MHz IR = 6 mA

Figure 3. 2nd Harmonic Input Intercept Point

50 Ohm Microstrip and

1 GHz

Figure 2. Capacitance vs. Reverse Voltage. Figure 4. Typical Reverse Recovery Time vs. Figure 5. Forward Current vs. Forward Voltage.

125 C 25 C –50 C

Figure 1. Total RF Resistance at 25 C vs.

In order to predict the performance of the HMPP-3890 as a switch, it is necessary to construct a model which can then be used in one of the several linear analysis programs presently on the market. Such a model is given in Figure 16, where R S + R j is given in Figure 1 and C j is provided in Figure 2. Careful examination of Figure 16 will reveal the fact that the package parasitics (inductance and ca - pacitance) are much lower for the MiniPak than they are for leaded plastic packages such as the SOT-23, SOT-323 or others. This will permit the HMPP-389x family to be used at higher frequencies than its conventional leaded counterparts. APLAC parameter can be obtained at http://www. hp.woodshot.com/hpr fhelp/design/SPICE/pins. htm#HSMP389x website Figure 11a. Linear Equivalent Circuit of the MiniPak 1412 PIN Diode. 30 fF 30 fF 20 fF 20 fF 1.1 nH Single diode package (HMPP-3890) 30 fF 30 fF 20 fF 20 fF 12 fF 12 fF 0.5 nH Anti-parallel diode package (HMPP-3892) 0.5 nH0.05 nH 0.5 nH 0.05 nH 0.05 nH0.5 nH0.05 nH 30 fF 30 fF 20 fF 20 fF 0.5 nH 0.05 nH Parallel diode package (HMPP-3895) 0.5 nH0.05 nH 0.5 nH 0.05 nH0.5 nH0.05 nH 30fF30fF 0.5nH 0.5nH 0.1nH 0.1nH0.05nH 0.05nH 0.05nH 0.05nH 20fF Diode package (HMPP-389T) 20fF

MiniPak 1412 Outline Drawing for HMPP-3890, -3892, and -3895 1.44 (0.057) 1.40 (0.055) Top view Side view Dimensions are in millimeters (inches) Bottom view 1.20 (0.047) 1.16 (0.046) 0.70 (0.028) 0.58 (0.023) 1.12 (0.044) 1.08 (0.043) 0.82 (0.032) 0.78 (0.031) 0.32 (0.013) 0.28 (0.011) -0.07 (-0.003) -0.03 (-0.001) 0.00 -0.07 (-0.003) -0.03 (-0.001) 0.42 (0.017) 0.38 (0.015) 0.92 (0.036) 0.88 (0.035) 1.32 (0.052) 1.28 (0.050) 0.00 MiniPak 1412 Outline Drawing for HMPP-389T Dimensions are in millimeters (inches) Bottom view 1.12 (0.044) 1.08 (0.043) 0.82 (0.032) 0.78 (0.031) 0.32 (0.013) 0.28 (0.011) -0.07 (-0.003) -0.03 (-0.001) 0.00 -0.07 (-0.003) -0.03 (-0.001) 0.42 (0.017) 0.38 (0.015) 0.92 (0.036) 0.88 (0.035) 1.32 (0.052) 1.28 (0.050) 0.00

Ordering Information

Part Number No. of Devices Container HMPP-389x-TR2 10000 13” Reel HMPP-389x-TR1 3000 7”Reel HMPP-389x-BLK 100 antistatic bag Device Orientation USER FEED DIRECTION COVER TAPE CARRIER TAPE REEL END VIEW 8 mm 4 mm TOP VIEW AA AA AA AA Note: “AA” represents package marking code. Package marking is right side up with carrier tape perforations at top. Conforms to Electronic Industries RS-481, “Taping of Surface Mounted Components for Automated Placement.” Standard quantity is 3,000 devices per reel.

For product information and a complete list of distributors, please go to our web site: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries. Data subject to change. Copyright © 2005-2009 Avago Technologies . All rights reserved. Obsoletes 5989-3630EN AV02-0653EN - August 5, 2009 Tape Dimensions and Product Orientation For Outline 4T (MiniPak 1412) P F W C D 1 D E A 0 5°MAX. t1 (CARRIER TAPE THICKNESS) T t (COVER TAPE THICKNESS) 5°MAX. B 0 K 0 DESCRIPTION SYMBOL SIZE (mm) SIZE (INCHES) LENGTH WIDTH DEPTH PITCH BOTTOM HOLE DIAMETER A 0 B 0 K 0 P D 1 1.40 ±0.05 1.63 ±0.05 0.80 ±0.05 4.00 ±0.10 0.80 ±0.05 0.055 ±0.002 0.064 ±0.002 0.031 ±0.002 0.157 ±0.004 0.031 ±0.002 CAVITY DIAMETER PITCH POSITION D E 1.50 ±0.10 4.00 ±0.10 1.75 ±0.10 0.060 ±0.004 0.157 ±0.004 0.069 ±0.004 PERFORATION WIDTH THICKNESS W 8.00 + 0.30 - 0.10 0.254 ±0.02 0.315 + 0.012 - 0.004 0.010 ±0.001 CARRIER TAPE CAVITY TO PERFORATION (WIDTH DIRECTION) CAVITY TO PERFORATION (LENGTH DIRECTION) F 3.50 ±0.05 2.00 ±0.05 0.138 ±0.002 0.079 ±0.002 DISTANCE WIDTH TAPE THICKNESS C T t 5.40 ±0.10 0.062 ±0.001 0.213 ±0.004 0.002 ±0.00004 COVER TAPE