DDTC114ELP

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  • Manufacturer or author: Diodes Incorporated
  • PDF pages: 6

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 Epitaxial Planar Die Construction  Ultra-Small Leadless Surface Mount Package  Ideally Suited for Automated Assembly Processes  Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)  Halogen and Antimony Free. "Green" Device (Note 3)  Qualified to AEC-Q101 Standards for High Reliability Mechanical Data  Case: X1-DFN1006-3  Case Material: Molded Plastic, "Green" Molding Compound. UL Flammability Classification Rating 94V-0  Moisture Sensitivity: Level 1 per J-STD-020  Terminals: Finish - NiPdAu Solderable per MIL-STD-202, Method 208  Weight: 0.0009 grams (Approximate) Ordering Information (Note 4) Product Marking Reel size (inches) Tape width (mm) Quantity per reel DDTC114ELP-7 N5 7 8 3,000 DDTC114ELP-7B N5 7 8 10,000 Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. 2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen - and Antimony-free, "Green" and Lead-free. 3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlor ine (<1500ppm total Br + Cl) and <1000ppm antimony compounds. 4. For packaging details, go to our website at http://www.diodes.com. Marking Information IN C 3 E B GND OUT Bottom View Device Symbol Top View Pin-Out IN B C E GND OUT Equivalent Inverter Circuit X1-DFN1006-3 C E B N5 = Product Type Marking Code DDTC114ELP-7 DDTC114ELP-7B Top View Bar Denotes Base and Emitter Side Top View Dot Denotes Collector Side Top View Bar Denotes Base and Emitter Side From date code 1527 (YYWW), this changes to:

Document number: DS30945 Rev. 8 - 2 2 of 6 www.diodes.com May 2015 © Diodes Incorporated DDTC114ELP Absolute Maximum Ratings (@TA = +25°C, unless otherwise specified.) Characteristic Symbol Value Unit Supply Voltage VCC 50 V Input Voltage VIN -10 to +40 V Output Current IO 50 mA Collector Current IC(MAX) 100 mA Thermal Characteristics (@TA = +25°C, unless otherwise specified.) Characteristic Symbol Value Unit Power Dissipation (Note 5) PD 250 mW Power Derating above +25°C Pder 2 mW/°C Thermal Resistance, Junction to Ambient Air (Note 5) (Equivalent to one heated junction of NPN) RJA 500 °C/W Operating and Storage Temperature Range TJ, TSTG -55 to +150 °C Electrical Characteristics (@TA = +25°C, unless otherwise specified.) Characteristic Symbol Min Typ Max Unit Test Condition Off Characteristics (Note 6) Collector-Base Breakdown Voltage BVCBO 50   V IC = 50µA, IE = 0 Collector-Emitter Breakdown Voltage BVCEO 50   V IC = 1.0mA, IB = 0 Collector Cutoff Current ICEX   0.5 µA VCE = 50V, VEB(OFF) = 3.0V Collector-Base Cut Off Current ICBO   0.1 µA VCB = 50V, IE = 0 Collector-Emitter Cut Off Current, IO(OFF) ICES   0.1 µA VCB = 50V, IB = 0 Emitter-Base Cut Off Current IEBO   800 µA VEB = 10V, IC = 0 Input Off Voltage VI(off) 0.5 1.16  V VCC = 5V, IO = 100µA Input On Voltage VI(on)  2.5 V VCC = 0.3V, IO = 10mA On Characteristics (Notes 6 & 7) DC Current Gain hFE 10    VCE = 5V, IC = 1mA 15    VCE = 5V, IC = 2mA 60    VCE = 5V, IC = 10mA 100    VCE = 5V, IC = 50mA 90    VCE = 5V, IC = 70mA Collector-Emitter Saturation Voltage VCE(sat)   0.15 V IC = 10mA, IB = 1mA   0.2 V IC = 50mA, IB = 5mA     0.25 V IC = 50mA, IB = 10mA   0.3 V IC = 70mA, IB = 10mA Base-Emitter Turn-On Voltage VBE(on)   0.85 V VCE = 5V, IC = 2mA   0.95 V VCE = 5V, IC = 10mA Base-Emitter Saturation Voltage VBE(sat)   0.98 V IC = 10mA, IB = 1mA   1.2 V IC = 50mA, IB = 5mA Input Current II   0.88 mA VI = 5V Output On Voltage (Same as VCE(sat)) VO(on)   0.25 V II = 2.5mA, IO = 50mA Input Resistance R1 7 10 13 kΩ  Resistance Ratio (R2/R1) 0.8 1 1.2   Small Signal Characteristics Current Gain-Bandwidth Product fT  250  MHz VCE = 10V, IE = 5mA, f = 1MHz Notes: 5. For the device mounted on minimum recommended pad layout 1oz copper that is on a single -sided 1.6mm FR4 PCB; device is measured under still air conditions whilst operating in steady state condition. The entire exposed collector pad is attached to the heatsink. 6. Measured under pulsed conditions. Pulse width ≤ 300µs. Duty cycle ≤ 2%. 7. Guaranteed by design.

Document number: DS30945 Rev. 8 - 2 3 of 6 www.diodes.com May 2015 © Diodes Incorporated DDTC114ELP 100 150 200 250 300 0 25 50 75 100 125 150 175 T , AMBIENT TEMPERATURE ( C) Fig. 1 Power Dissipation vs. Ambient Temperature A ° P , POWER DISSIPATION (mW)D R = 500 C/WJA  100 150 200 250 0.1 1 10 100 1,000 V = 5VCE h , DC CURRENT GAINFE I , COLLECTOR CURRENT (mA) Fig. 2 Typical DC Current Gain vs. Collector Current C T = 150 CA  T = 85 CA  T = -55 CA  T = 25 CA  0.01 0.1 0.1 1 10 100 I /I = 10CB V , COLLECTOR-EMITTER SATURATION VOLTAGE (V) CE(SAT) I , COLLECTOR CURRENT (mA) Fig. 3 Typical Collector Emitter Saturation Voltage vs. Collector Current C T = 150 CA  T = 85 CA  T = -55 CA  T = 25 CA  0.01 0.02 0.03 0.04 0.05 0.06 0.07 0.08 0.09 0.1 0 1 2 3 4 5 6 7 8 9 10 V , COLLECTOR EMITTER VOLTAGE (V) Fig. 4 CE Typical Collector Current vs. Collector Emitter Voltage I , COLLECTOR CURRENT (A)C I = 1.0mAB I = 0.8mAB I = 0.7mAB I = 0.6mAB I = 0.9mAB I = 0.5mAB I = 0.4mAB I = 0.3mAB I = 0.2mAB I = 0.1mAB 0.2 0.4 0.6 0.8 1.2 1.4 1.6 1.8 -60 -30 0 30 60 90 120 150 V = 0.3VO I = 5mAO T , AMBIENT TEMPERATURE ( C) Fig. 5 Typical Input Voltage vs. Ambient Temperature A ° V , INPUT VOLTAGE (V)I(ON) 1.5 4.5 7.5 10.5 13.5 0.1 1 10 100 V , BASE-EMITTER VOLTAGE (V)BE I , COLLECTOR CURRENT (mA) Fig. 6 Typical Base-Emitter Voltage vs. Collector Current C V = 5VCE T = 150 CA  T = 85 CA  T = -55 CA  T = 25 CA 

Document number: DS30945 Rev. 8 - 2 4 of 6 www.diodes.com May 2015 © Diodes Incorporated DDTC114ELP 0.1 1 10 100 I /I = 10CB V , BASE-EMITTER SATURATION VOLTAGE (V) BE(SAT) I , COLLECTOR CURRENT (mA) Fig. 7 Typical Base Emitter Saturation Voltage vs. Collector Current C

Document number: DS30945 Rev. 8 - 2 5 of 6 www.diodes.com May 2015 © Diodes Incorporated DDTC114ELP Package Outline Dimensions Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for the latest version. Suggested Pad Layout Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for the latest version. L3 L1L2 e b D E A z Seating Plane Pin #1 ID C X Y X1-DFN1006-3 Dim Min Max Typ A 0.47 0.53 0.50 A1 0.00 0.05 0.03 b 0.10 0.20 0.15 b2 0.45 0.55 0.50 D 0.95 1.075 1.00 E 0.55 0.675 0.60 e - - 0.35 L1 0.20 0.30 0.25 L2 0.20 0.30 0.25 L3 - - 0.40 z 0.02 0.08 0.05 All Dimensions in mm Dimensions Value (in mm) C 0.70 G1 0.30 G2 0.20 X 0.40 X1 1.10 Y 0.25 Y1 0.70

Document number: DS30945 Rev. 8 - 2 6 of 6 www.diodes.com May 2015 © Diodes Incorporated DDTC114ELP IMPORTANT NOTICE DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION). Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes without further notice to this document and any product described herein. Diodes Incorporated does not a ssume any liability arising out of the application or use of this document or any product described herein; neither does Diodes Incorporated convey any license unde r its patent or trademark rights, nor the rights of others. Any Customer or user of this do cument or products described herein in such applications shall assume all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diod es Incorporated website, harmless against all damages. Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel. Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising ou t of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized application. Products described herein may be covered by one or more United States, international or foreign patents pending. Product nam es and markings noted herein may also be covered by one or more United States, international or foreign trademarks. This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the final and determinative format released by Diodes Incorporated. LIFE SUPPORT Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the e xpress written approval of the Chief Executive Officer of Diodes Incorporated. As used herein: A. Life support devices or systems are devices or systems which: 1. are intended to implant into the body, or 2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided i n the labeling can be reasonably expected to result in significant injury to the user. B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expe cted to cause the failure of the life support device or to affect its safety or effectiveness. Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support d evices or systems, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of Diodes Incorporated products in such safety -critical, life support devices or systems, notwithstanding any devices - or systems -related information or support that may be provided by Diodes Incorp orated. Further, Customers must fully indemnify Diodes Incorporated and its representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems. Copyright © 2015, Diodes Incorporated www.diodes.com