DBL0.3J LUGUANG | Alldatasheet
Document overview
- Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
- PDF pages: 2
Technical content
Features
- Low profile space
- Ideal for automated placement
- Glass passivated chip junctions
- Low leakage current
- High forward surge capability
- High temperature soldering： 260℃/10 seconds at terminals
- Component in accordance to RoHS 2002/95/1 and WEEE 2002/96/EC Mechanical Date
- Case: JEDEC SOD-123FL molded plastic body over glass passivated chip
- Terminals: Solder plated, solderable per J-STD-002B and JESD22-B102D
- Polarity: Laser band denotes cathode end
- Weight: 0.017gram g g Maximum Ratings & Thermal Characteristics (TA = 25 °C unless otherwise noted) Electrical Characteristics (TA = 25 °C unless otherwise noted) Note2: Pulse test:300μs pulse width,1% duty cycle. μA TA=100℃ 50 Reverse current VR=VDC TA=25℃ IR -- UNIT Instantaneous forward voltage IF=0.3A(2) VF - 0.95 1.10 V Items Test conditions Symbol Min Type Max Thermal resistance from junction to ambient (1) TJ, TSTG –55 to +150 Maximum repetitive peak reverse voltage Maximum RMS voltage Maximum DC blocking voltage Maximum average forward rectified current Operating junction and storage temperature range Peak forward surge current 8.3 ms single half sine-wave superimposed on rated load 600 420 600 DBL0.3K 800 V RMS VDC VRRM 560 800 DBL0.3M 1000 700 1000 V V ℃/ WR θJA A15 V A0.3 220 IF(AV) IFSM UNITSymbolItems DBL0.3J http://www.luguang.cn Email:lge@luguang.cn 1.00.2 2.80.1 1.9± 0.1 Cathode Band Top View 3.70.2 0.60.25 1.4± 0.15 0.10-0.30 SOD-123FL Dimensions in millimeters
DBL0.3J~DBL0.3M Surface Mount Diode Characteristic Curves (TA=25 ℃ unless otherwise noted) http://www.luguang.cn Email:lge@luguang.cn