DB604 DEC | Alldatasheet
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! " # $% & ' ( ) *+ ' & "& , ' " & . ) /# Average Forward Rectified Current, T = 60 C (Note 2) 0 1 Peak Forward Surge Current. Tc = 60 C Single 60Hz Half-Sine Wave Superimposed on Rated Load (JEDEC Method). Continuous Power Dissipation in V Region @ T =80 C (Heat Sink Temp) 4 567 9 : PARAMETER (TEST CONDITIONS) Maximum DC Blocking Voltage Maximum Peak Recurrent Reverse Voltage Working Peak Reverse Voltage Series Number V;=<?> V@@A VBDC BEGF H VIJ SYMBOL KMLONQPMRSUTMVOWYXOZ\\[O]_^O\`\\aObdcOegfOhjiOk AMPS UNITS VOLTS Plm Pn %== RMS Reverse Voltage °± ² ³=´=µ{¶
- =¸w¹º=»j¼=½¿¾=ÀÂÁà ÄÅÆ=ÇtÈÉÊ ËÌ=Ì Í=Î=Ï Power Dissipation in V Region for 100 S Square Wave Ð ÑÒÓ m ÔOÕ×ÖGØÙGÕÛÚÚÜÝ Þß ÞMàÞMáâOãOä å æ åç èOæ åGéëê æ×ììíî ïð ïMñïMòóOôOõ ö WATTS Thermal Energy (Rating for Fusing) t < 8.3mSec I t ÷ ø%ù=ú AMPS û SEC Iüýþ ÿ RATINGS
FEATURES
Data Sheet No. BRDB-600-1D ABDB-600-1D MECHANICAL SPECIFICATION Tel.: (310) 767-1052 Fax: (310) 767-7958 DIOTEC ELECTRONICS CORP. Gardena, CA 90248 U.S.A 18020 Hobart Blvd., Unit B MAXIMUM RATINGS & ELECTRICAL CHARACTERISTICS ACTUAL SIZE BL 14.7 15.7 0.58 0.62 BH 5.8 6.9 0.23 0.27 D1 10.3 11.3 0.405 0.445 LL 19.0 n/a n/a0.75 LD 1.0 1.1 0.039 0.042 SYM MILLIMETERS INCHES MINMIN MAXMAX
6 AMP SILICON BRIDGE RECTIFIERS
Case: Terminals: Round silver plated copper pins Soldering: Per MIL-STD 202 Method 208 guaranteed Polarity: Marked on side of case; positive lead at beveled corner Mounting Position: Any. Through hole provided for #6 screw Weight: 0.13 Ounces (3.6 Grams) Molded Epoxy (UL Flammability Rating 94V-0) MECHANICAL DATA BH LL LD D1 BL BL DT DB602 SERIES DB600 - DB610 and ADB604 - ADB608 UL RECOGNIZED - FILE #E124962 Junction Operating and Storage Temperature Range T , T VOLTS pF Minimum Avalanche Voltage Maximum Avalanche Voltage V, -$.&/$0132 V4(5 See Note 5 See Note 5 C Maximum Forward Voltage (Per Diode) at 6 Amps DC Typical Junction Capacitance (Note 4) C(DE7 8 9F G&H Typical Thermal Resistance, Junction to Case (Note 2) RIKJL VOLTS Maximum Reverse Current at Rated VM$N @ T = 25 C O P @T = 125 C Q R IS$T Minimum Insulation Breakdown Voltage (Circuit to Case) VU VW X YZ mA [\\]] C/W _ \` a b3a c d e f z|zxr3 Kv z { m pKq(v w xzyz{&r3 zw |K m pKq(v w xzyz{&r3 Kv {zx Kw v { ~z ¤ ¥ ¦ E25 BUILT-IN STRESS RELIEF MECHANISM FOR SUPERIOR RELIABILITY AND PERFORMANCE SURGE OVERLOAD RATING TO 250 AMPS PEAK VOID FREE VACUUM DIE SOLDERING FOR MAXIMUM MECHANICAL STRENGTH AND HEAT DISSIPATION (Solder Voids: Typical < 2%, Max. < 10% of Die Area) RoHS COMPLIANT
FIGURE 1. FORWARD CURRENT DERATING CURVE FIGURE 3. TYPICAL FORWARD CHARACTERISTIC PER DIODE FIGURE 4. TYPICAL REVERSE CHARACTERISTICS PER DIODE FIGURE 5. TYPICAL JUNCTION CAPACITANCE PER DIODE FIGURE 2. MAXIMUM NON-REPETITIVE SURGE CURRENT