DB5000P DEC | Alldatasheet
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R VOLTS Maximum Reverse Current at Rated V @ T = 25 C @T = 125 C I Minimum Insulation Breakdown Voltage (Circuit to Case) V Typical Thermal Resistance, Junction to Case 50 mA 2500 C/W1.10 ! " # $ T% , T&'( °C-55 to +175 Average Forward Rectified Current @ T = 55 C * + Peak Forward Surge Current. Single 60Hz Half-Sine Wave Superimposed on Rated Load (JEDEC Method). T = 175 C , - Junction Operating and Storage Temperature Range AMPS Rating for Fusing (Non-repetitive; 1mS < t < 8.3mS I t A SEC I0213 1000 600
FEATURES
Data Sheet No. BRDB-5000P-1B MECHANICAL SPECIFICATION Tel.: (310) 767-1052 Fax: (310) 767-7958 DIOTEC ELECTRONICS CORP. Gardena, CA 90248 U.S.A 18020 Hobart Blvd., Unit B
50 AMP SILICON BRIDGE RECTIFIERS
MAXIMUM RATINGS & ELECTRICAL CHARACTERISTICS 45 6 7 8:9<;5 6= >@? AB5<CED7 F8 6<6 F:CEG:F<H 5 6 IH F@I8<J F ;:;@K:6 L:F<H M7 ; F;<G:F:N:7 O 7 F:PQSR7 8<9J FGL:5 ; FT L 5J O<M5 U:F<T V W:XY T H F:;<7 ; 6 7 U F@KH27 8:PI:N 6 7 U F@J K<5:PQ[Z<KHN 5G 5:N:7 6 7 U FJ K:5<P:;T P<F<H 5:6 FN<IH H F8 6D \\= W:]EQ PARAMETER (TEST CONDITIONS) Maximum DC Blocking Voltage Maximum Peak Recurrent Reverse Voltage Working Peak Reverse Voltage Series Number V^_a\` Vbbc Vdfe dgBhi Vjk SYMBOL lnmoqpBrsutBvwyxz UNITS VOLTS 1000400 600 800 50 100 200 400 600 800 RMS Reverse Voltage 280 420 560 35 70 140 280 420 700560 CONTROLLED AVALANCHE NON-CONTROLLED AVALANCHE RATINGS SERIES: DB5000P - DB5010P and ADB5004P - ADB5008P Suffix "T" indicates FAST-ON TERMINALS Suffix "W" indicates WIRE LEADS E51 INCHESMILLIMETERS MIN 9.6 17.5 15.7 28.4 SYM BL BH MAX MAX 10.2 16.7 18.5 28.7 0.69 MIN 1.12 0.38 0.62 1.13 0.40 0.66 0.73 D3 0.5313.5 14.5 0.57 LT 0.615.2n/a n/a INCHESMILLIMETERS MIN 9.6 10.9 17.5 28.4 SYM BL BH LL MAX MAX 10.2 18.5 11.9 28.7 0.43 MIN 1.12 0.38 0.69 1.13 0.40 0.73 0.47 LD 1.0 1.1 0.039 0.042 0.8120.6 n/a n/a D1 BL HOLE FOR #8 SCREW BL BH LT HOLE FOR #8 SCREW LD LL BH BL BL ½ º ¾ ¿ À:¹ Á  Ã@ÄÅ2ƨÇEÈ ÉÊ ËÌ ÍÎ UL RECOGNIZED - FILE #E141956 ÏÐÑ Ò:Ó<Ò ÔÐÒ:Õ Ö×Ø Ù:Ú<Ù Û×Ù:Ü _ Ý¨Þ ß¨à á¨â ã¨ä ADBD-5000P-1B BUILT-IN STRESS RELIEF MECHANISM FOR SUPERIOR RELIABILITY AND PERFORMANCE INTEGRALLY MOLDED HEAT SINK PROVIDES VERY LOW THERMAL RESISTANCE FOR MAXIMUM HEAT DISSIPATION VOID FREE VACUUM DIE SOLDERING FOR MAXIMUM MECHANICAL STRENGTH AND HEAT DISSIPATION (Solder Voids: Typical < 2%, Max. < 10% of Die Area) Våæ Forward Voltage Drop (Per Diode) at 25 Amps DC VOLTS n/a n/a Mimimum Avalanche Voltage Maximum Avalanche Voltage Vç èé@êëíì î Vï ðñ@òóBôõ 1.10 1.02 Max. Typ. See Note 1 See Note 1 ö ÷øù¨úûüûSý@þ ÿ ¨ûüúÿ ÿ ù¨úû úûú ûþ ÿ ü ÿ ý@þ û þ ! ÿ ÿ #"û$¨ÿ þ ûü% ûÿ ÿ ý@þ û ¨û()* û üû+ *,ü MECHANICAL DATA Max. mounting torque = 20 in-lb. Case: Terminals: Round silver plated copper pins or fast-on terminals Soldering: Per MIL-STD 202 Method 208 guaranteed Polarity: Marked on side of case Mounting Position: Any. Through hole for #8 screw. Weight: Fast-on Terminals - 0.7 Ounces (20.0 Grams) Case: Molded epoxy with integral heat sink Epoxy carries a U/L Flammability rating of 94V-0 Wire Leads - 0.55 Ounces (16.0 Grams) RoHS COMPLIANT
FIGURE 2. MAXIMUM NON-REPETITIVE SURGE CURRENT FIGURE 1. FORWARD CURRENT DERATING CURVE FIGURE 4. TYPICAL REVERSE CHARACTERISTICS FIGURE 3. TYPICAL FORWARD CHARACTERISTIC PER DIODE