DB3X207K

DB3X207K PANASONICBATTERY | Alldatasheet

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Ver. BEDPublication date: January 2013 1 DB3X207K Silicon epitaxial planar type For high frequency amplification  Features  Low forward voltage VF  Forward current (Average) IF(AV) = 1 A rectification is possible  Halogen-free / RoHS compliant (EU RoHS / UL-94 V-0 / MSL: Level 1 compliant)  Marking Symbol: 3F  Packaging DB3X207K0L Embossed type (Thermo-compression sealing): 3000 pcs / reel (standard)  Absolute Maximum Ratings Ta = 25°C Parameter Symbol Rating Unit Reverse voltage VR 20 V Repetitive peak reverse voltage VRRM 20 V Forward current (Average) *1 IF(AV) 1 A Non-repetitive peak forward surge current *2 IFSM 3 A Junction temperature Tj 125 °C Storage temperature Tstg –55 to +125 °C Note) *1: Mounted on an alumina PC board *2: 50 Hz sine wave 1 cycle (Non-repetitive peak current)  Electrical Characteristics Ta = 25°C±3°C Parameter Symbol Conditions Min Typ Max Unit Forward voltage VF IF = 1.0 A 0.4 V Reverse current IR VR = 6 V 1.5 mA Terminal capacitance Ct VR = 10 V, f = 1 MHz 43 pF Reverse recovery time *1 trr IF = IR = 100 mA, Irr = 10 mA, RL = 100 Ω 12 ns Note) 1. Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7031 measuring methods for diodes. 2. This product is sensitive to electric shock (static electricity, etc.). Due attention must be paid on the charge of a human body and the leakage of current from the operating equipment. 3. Absolute frequency of input and output is 400 MHz *1: trr measurement circuit Bias Application Unit (N-50BU) 90% Pulse Generator (PG-10N) Rs = 50 Ω Wave Form Analyzer (SAS-8130) Ri = 50 Ω tp = 2 µs tr = 0.35 ns δ = 0.05 IF = 100 mA IR = 100 mA RL = 100 Ω 10% Irr = 10 mA tr tp trr VR IF t t A Input Pulse Output Pulse Unit: mm 1: Anode 2: N.C. 3: Cathode Panasonic Mini3-G3-B JEITA SC-59A Code TO-236AA/SOT-23 1 2

Ver. BED DB3X207K IF  VF IR  VR Ct  VR 10−5 10−4 10−2 10−3 10−1 DB3X207_ IF-VF Forward current IF (A) Forward voltage VF (V) 85°C 100°C Ta = 125°C 25°C −30°C 10−8 10−7 0 4 16 208 1 2 10−6 10−5 10−4 10−3 10−2 10−1 DB3X207_ IR-VR Reverse current IR (A) Reverse voltage VR (V) Ta = 100°C 85°C 25°C −30°C 0 205 1 0 1 5 300 250 200 150 100 Terminal capacitance Ct (pF) Reverse voltage VR (V) DB3X207_Ct-VR Ta = 25°C 102 103 10−3 10−1 10 103 DB3X207K_Rth-t Thermal resistance Rth (°C/W) Time t (s) (1) Non-heat sink (2) Mounted on glass epoxy print board. (3) Mounted on alumina print board. ( 50 mm × 50 mm × 0.8 mm) Solder in : 2 mm × 2 mm (1) (2) (3) Rth(j-l) = 70°C/W 0 25 1007550 175125 150 0.50 0.25 1.00 0.75 1.25 DB3X207K_ IF(AV)-Tl Forward current (Average) IF(AV) (A) Lead temperature Tl (°C) tp T IF VR = 10 V Tj = 125°C tp / T DC Sine Wave 0.3 0.1 0.2 0.4 0.5 DB3X207K_ PF(AV)-IF(AV) Forward power dissipation (Average) PF(AV) (A) Forward current (Average) IF(A V) (Α) tp T IF DC 1/2Sine Wave Rth  t IF(AV)  Tl PF(AV)  IF(AV)

Ver. BED DB3X207K Mini3-G3-B Unit: mm  Land Pattern (Reference) (Unit: mm)

Request for your special attention and precautions in using the technical information and semiconductors described in this book (1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and regulations of the exporting country, especially, those with regard to security export control, must be observed. (2) The technical information described in this book is intended only to show the main characteristics and application circuit examples of the products. No license is granted in and to any intellectual property right or other right owned by Panasonic Corporation or any other company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other company which may arise as a result of the use of technical information described in this book. (3) The products described in this book are intended to be used for general applications (such as office equipment, communications equipment, measuring instruments and household appliances), or for specific applications as expressly stated in this book. Consult our sales staff in advance for information on the following applications: – Special applications (such as for airplanes, aerospace, automotive equipment, traffic signaling equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body. It is to be understood that our company shall not be held responsible for any damage incurred as a result of or in connection with your using the products described in this book for any special application, unless our company agrees to your using the products in this book for any special application. (4) The products and product specifications described in this book are subject to change without notice for modification and/or im- provement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product Standards in advance to make sure that the latest specifications satisfy your requirements. (5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions (operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any defect which may arise later in your equipment. Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products. (6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS, thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages. (7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of our company. 20100202