DB201SG FOSTER | Alldatasheet
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@ 2018 Copyright By American First Semiconductor REV:1.0 Page 1/3 Features: Glass passivated chip junction Ideal for surface mounted applications □ High forward surge current capability □ High temperature soldering guaranteed: 260℃/10 seconds at terminals □ Low leakage DB-S Absolute Maximum Ratings (Ta=25 ℃ unless otherwise noted) Parameter Symbol DB 201SG DB 202SG DB 203SG DB 204SG DB 205SG DB 206SG DB 207SG Unit Maximum Reverse Peak Repetitive Voltage V RRM 50 100 200 400 600 800 1000 V Maximum RMS Voltage V RMS 35 70 140 280 420 560 700 V Maximum DC Blocking Voltage V DC 50 100 200 400 600 800 1000 V Maximum Average Forward Rectified Output Current, 0.06”(1.5mm) lead length at Ta=40℃ (Note 1) I (AV) 2.0 A Peak Forward Surge Current 8.3ms single half sine wave superimposed on rated load (JEDEC Method) I FSM A Maximum Reverse Current @ rated V R Ta = 2 5 ° C Ta = 100°C I R 5.0 1.0 μA mA Maximum Forward Voltage @ 2.0 A V F 1.1 V Typical Thermal Resistance (NOTE 1) R θJA 40 ℃/W Operating and Storage Temperature Range Tj, Tstg -55 to +150 ℃
2 Amps Surface Moutn Bridbe
www.First-semi.com Page 2/3 Typical Characteristics pF Reverse Voltage FIG. 3-TYPICAL FORWARD VOLTAGECHARACTERISTICS Number of cycles FIG. 2-MAXIMUM NON-REPETITIVE PEAK FORWARD SURGE CURRENT PERLEG FIG. 1- DERATING CURVE OUTPUT RECTIFIEDCURRENT Average Forward Rectified Current Amperes Instantneous Forward Current Junction Capacitance Peak Forward Surage Current Instantaneou Foward Voltage 1 100 0.1 0.01 Percent Of Rated Peak Reverse Voltage(%) FIG. 4-TYPICAL REVERSE LEAKAGE CHARACTERISTICS Instantaneous Reverse Leakage Current Micro Amperes Ambient Temperature FIG. 5-TYPICAL JUNCTION CAPACTITANE 1Cycle TJ=25 Pulse Width=300us 1% Duty Cycle 3.2 2.8 2.4 2.0 1.6 1.2 0.8 0.4 0.0 0 20 40 60 80 100 120 140 160 Amperes Amperes Volts Volts 0.01 0.1 1.0 100 0 20 40 60 80 100 120 140 T = 25 C j T = 125 C j 100 1 10 100 f=1.0MHz Vsig=50mVp-p
www.First-semi.com Page 3/3 Package Dimension DB-S Dimensions in inches and (millimeters) Declaration z Any semiconductor product under certain conditions has the possibility of failure or failure,The buyer has the responsibility to comply with safety standards and take safety measures when using FIRST products for system design and manufacturing,To avoid To avoid potential failure risks, which may cause personal injury or property damage! z Product promotion endless, our company will wholeheartedly provide customers with better products! z ATTACHMENT
Revision History
2018.01.01 1.0 Initial release FIRST reserves the right to change the specifications, the same specifications of products due to different packaging line mold, the size of the appearance will be slightly different, shipped in kind, without notice! Customers should obtain the latest version information before ordering, and verify whether the relevant information is complete and up-to-date.