DB201S LEIDITECH | Alldatasheet
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Technical content
Features
Glass passivated die construction Low leakage Ideal for printed circuit board application High temperature soldering guaranteed: 260°C/5 seconds Component in accordance to RoHS 2011/65/EU Mechanical Date Case:DB-S Molding compound meets UL 94 V-0 flammability rating Terminals: Solder plated, solderable per MIL-STD-750, Method 2026 Polarity: Marked on case Mounting Position: Any Marking: type number DB-S Major Ratings and Characteristics I F(AV) 2.0A
50 V to 1000 V
1.1V 150°C V RRM I FSM V F T J max. Surge overload ratings to 50 amperes Rev : 01.06.2014 1/3 www.leiditech.com Rev : 01.06.2014 1/3 www.leiditech.com
1.0 2.0 r age Forward Current(A) Fig.1 Forward Current Derating Curve o rward Surge current(A) Fig.2 Maximum Non-Repetitive Peak Forward Surge Current 0 30 60 90 120 150 Ave r Lead Temperature(℃) 1 10 100 peak F Number of Cycles 60 HZ 0.01 0.1 1.0 Instantaneous Forward Current(A) Instantaneous Forward Voltage(V) Fig.3 Typical Instantaneous Forward Characteristics 0.001 0.01 0.1 100 0 2 04 06 08 0 1 0 0 Instantaneous Reverse Leakage Current(mA) Percent Reted Peak Reverse Voltage(%) Fig.4 Typicl Reverse Leakage Characteristics (T = 25 °C unless otherwise noted) A 0.5 1.5 T J = 100°C T J = 125 °C DB201S~DB207S
Dimensions in inches and (millimeters) 0.205 (5.2) 0.195 (5.0) 0.045(1.15) 0.035(0.88) 0.346 (8.8) 0.106(2.7) 0.083(2.1) 0.255 (6.5) 0.245 (6.2) 0.311 (7.9) 0.291 (7.4) 0.010 (0.25) 0.006 (0.15) 0.059 (1.50) 0.037 (0.95) 0.014 (0.35) 0.370 (9.40) 0.047 MIN. (1.20 MIN.) 0.404 MAX. (10.26 MAX.) 0.205 (5.2) 0.195 (5.0) 0.060 MIN. (1.52 MIN.) DB201S~DB207S Shanghai Leiditech Electronic Co.,Ltd Email: sale1@leiditech.com Tel : +86- 021 50828806 Fax : +86- 021 50477059 Rev : 01.06.2014 3/3 www.leiditech.com