DB101 THINKISEMI | Alldatasheet

Document overview

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Technical content

Features

  • Glass passivated chip junction
  • Low forward voltage drop
  • High surge overload rating of 50 A peak
  • Ideal for printed circuit board Mechanical Data
  • Case: Molded plastic, DB
  • Epoxy: UL 94V-0 rate flame retardant
  • Terminals: Leads solderable per MIL-STD-202, method 208 guaranteed
  • Mounting position: Any Absolute Maximum Ratings and Characteristics Ratings at 25 O C ambient temperature unless otherwise specified. Single phase, half wave, 60 Hz, resistive or inductive load. For capacitive load, derate current by 20%. Parameter Symbols DB101 DB102 DB103 DB104 DB105 DB106 DB107 Units Maximum Recurrent Peak Reverse Voltage V RRM 50 100 200 400 600 800 1000 V Maximum RMS Voltage V RMS 35 70 140 280 420 560 700 V Maximum DC Blocking Voltage V DC 50 100 200 400 600 800 1000 V Maximum Average Forward Rectified Current at T A = 40 O C I (AV) A Peak Forward Surge Current 8.3 ms Single Half-sine-wave Superimposed on Rated Load (JEDEC Method) I FSM A Maximum Forward Voltage at 1 A V F 1.1 V at T A = 25 O C Maximum Reverse Current at Rated DC Blocking Voltage at T A = 125 O C I R 500 µA Typical Junction Capacitance C J pF Typical Thermal Resistance R θJA O C/W Typical Thermal Resistance R θJL O C/W Operating and Storage Temperature Range T J S -55 to +150 O C Measured at 1 MHz and applied reverse voltage of 4 V Thermal resistance from junction to ambient and from junction to lead mounted on P .C.B with 0.5 X 0.5" (13 X 13 mm) copper pads. DB-1 Unit : inch (mm) .335(8.51) .045(1.14) .022(0.56) .075(1.90) .185(4.69) .089(2.5) .150(3.81) .086(2.2) .205(5.2) .195(5.0) .316(8.05) .035(0.89) .018(0.46) .055(1.39) DB101 thru DB107 Pb DB101 thru DB107 1.0 AMP.DIP GLASS PASSIVATED BRIDGE RECTIFIERS Pb Free Plating Product © 2006 Thinki Semiconductor Co.,Ltd. http://www.thinkisemi.com/ Page 1/2

© 2006 Thinki Semiconductor Co.,Ltd. http://www.thinkisemi.com/ Page 2/2