DAN202U BILIN | Alldatasheet
Document overview
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Technical content
Dual surface mount switching diode DAN202U F022 www.gmicroelec.com R e v . A 1
FEATURES
z For types of packaging are available. z High speed switching. z Suitable for high packing density layout. z High reliability.
APPLICATIONS
z For general purpose switching applications. SOT-323
ORDERING INFORMATION
T y p e N o . M a r k i n g P a c k a g e C o d e DAN202U N SOT-323 MAXIMUM RATING @ Ta=25℃ unless otherwise specified Parameter Symbol Limits Unit Non-Repetitive Peak reverse voltage VRM 80 V Diode reverse voltage VR 80 V Forward continuous Current（peak） IF 300 mA Average forward current IO 100 mA Power Dissipation Pd 200 mW Junction temperature Tj 150 ℃ Storage temperature range Tstg -65 to +150 ℃ Pb Lead-free
Dual surface mount switching diode DAN202U F022 www.gmicroelec.com R e v . A 2 ELECTRICAL CHARACTERISTICS @ Ta=25℃ unless otherwise specified Parameter Symbol Test conditions MIN MAX UNIT Reverse breakdown voltage V (BR)R I R= 100μA 80 V Reverse voltage leakage current I R V R=70V 0.1 μA Forward voltage V F IF=100mA 1.2 V Diode capacitance C D V R=6V f=1MHz 3.5 pF Reverse recovery time t rr V R=6V,IF=5mA 4 nS TYPICAL CHARACTERISTICS @ Ta=25℃ unless otherwise specified
Dual surface mount switching diode DAN202U F022 www.gmicroelec.com R e v . A 3 PACKAGE OUTLINE Plastic surface mounted package SOT-323 SOLDERING FOOTPRINT Unit : mm
PACKAGE INFORMATION
DAN202U SOT-323 3000/Tape&Reel SOT-323 Dim Min Max A 2.00 2.20 B 1.15 1.35 C 0.95 Typical D 0.30 Typical E 0.25 0.40 G 1.2 1.4 H 0.02 0.10 J 0.10 Typical K 2.20 2.40 All Dimensions in mm 1.90 0.650.65 0.90 0.70 A B K D E J H G C