DAN202 BILIN | Alldatasheet
Document overview
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Technical content
Dual surface mount switching diode D A N 2 0 2 C 2 0 3 w w w . g m i c r o e l e c . c o m R e v . A 1
FEATURES
z High speed. z High reliability. z Suitable for hig packing density layout.
APPLICATIONS
z Ultra high speed switching. z Silicon epitaxial planar. SOT-23
ORDERING INFORMATION
Type No. Marking Package Code DAN202 N SOT-23 MAXIMUM RATING @ Ta=25℃ unless otherwise specified Parameter Symbol Limits Unit Non-Repetitive Peak reverse voltage V RM 80 V DC Reverse Voltage V R 80 V Forward continuous Current(Single) I FM 300 mA Forward continuous Current(Double) I FM 450 mA Average rectified forward current(Single) I O 100 mA Average rectified forward current(Double) I O 150 mA Non-repetitive forward Surge Current @t=1.0us(Single) @t=1.0us(Double) I surge A Power Dissipation P d 200 mW Thermal resistance,junction to ambient air R θJA 357 ℃/W Junction temperature T j 150 ℃ Storage temperature range T stg -55 to +150 ℃ Pb Lead-free
Dual surface mount switching diode D A N 2 0 2 C 2 0 3 w w w . g m i c r o e l e c . c o m R e v . A 2 ELECTRICAL CHARACTERISTICS @ Ta=25℃ unless otherwise specified Parameter Symbol Test conditions MIN MAX UNIT Reverse voltage leakage current I R V R=70V 0.1 μA Forward voltage V F IF=100mA 1.2 V Total capacitance C T V R=6V,f=1MHz 3.5 pF Reverse recovery time t rr IF=5mA,VR=6V, RL=50Ω 4 ns TYPICAL CHARACTERISTICS @ Ta=25℃ unless otherwise specified
Dual surface mount switching diode D A N 2 0 2 C 2 0 3 w w w . g m i c r o e l e c . c o m R e v . A 3 PACKAGE OUTLINE Plastic surface mounted package SOT-23 SOLDERING FOOTPRINT Unit : mm
PACKAGE INFORMATION
DAN202 SOT-23 3000/Tape&Reel SOT-23 Dim Min Max A 2.70 3.10 B 1.10 1.50 C 1.0 Typical D 0.4 Typical E 0.35 0.48 G 1.80 2.00 H 0.02 0.1 J 0.1 Typical K 2.20 2.60 All Dimensions in mm A B C D E J H K G 0.90 0.80 2.00 0.95 0.95