DAC900U/1KG4

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Technical content

10-Bit, 165MSPS DIGITAL-TO-ANALOG CONVERTER

FEATURES

G SINGLE +5V OR +3V OPERATION G HIGH SFDR: 5MHz Output at 100MSPS: 68dBc G LOW GLITCH: 3pV-s G LOW POWER: 170mW at +5V G INTERNAL REFERENCE: Optional Ext. Reference Adjustable Full-Scale Range Multiplying Option

APPLICATIONS

G COMMUNICATION TRANSMIT CHANNELS WLL, Cellular Base Station Digital Microwave Links Cable Modems G WAVEFORM GENERATION Direct Digital Synthesis (DDS) Arbitrary Waveform Generation (ARB) G MEDICAL/ULTRASOUND G HIGH-SPEED INSTRUMENTATION AND CON- TROL G VIDEO, DIGITAL TV

DESCRIPTION

The DAC900 is a high-speed, Digital-to-Analog Converter (DAC) offering a 10-bit resolution option within the SpeedPlus family of high-performance converters. Featuring pin compatibility among family members, the DAC908, DAC902, and DAC904 provide a component selection option to an 8-, 12-, and 14-bit resolution, respectively. All models within this family of DACs support update rates in excess of 165MSPS with excellent dynamic performance, and are especially suited to fulfill the demands of a variety of applications. The advanced segmentation architecture of the DAC900 is opti- mized to provide a high Spurious-Free Dynamic Range (SFDR) for single-tone, as well as for multi-tone signals—essential when used for the transmit signal path of communication systems. The DAC900 has a high impedance (200kΩ ) current output with a nominal range of 20mA and an output compliance of up to 1.25V. The differential outputs allow for both a differential or single- ended analog signal interface. The close matching of the current outputs ensures superior dynamic performance in the differential configuration, which can be implemented with a transformer. Utilizing a small geometry CMOS process, the monolithic DAC900 can be operated on a wide, single-supply range of +2.7V to +5.5V. Its low power consumption allows for use in portable and battery- operated systems. Further optimization can be realized by lowering the output current with the adjustable full-scale option. For noncontinuous operation of the DAC900, a power-down mode results in only 45mW of standby power. The DAC900 comes with an integrated 1.24V bandgap reference and edge-triggered input latches, offering a complete converter solution. Both +3V and +5V CMOS logic families can be inter- faced to the DAC900. The reference structure of the DAC900 allows for additional flexibility by utilizing the on-chip reference, or applying an exter- nal reference. The full-scale output current can be adjusted over a span of 2mA to 20mA, with one external resistor, while maintain- ing the specified dynamic performance. The DAC900 is available in SO-28 and TSSOP-28 packages. Current Sources LSB Switches Segmented Switches +1.24V Ref. Latches 10-Bit Data Input D9...D0 DAC900 FSA BW +V D+V A AGND CLK DGND REF IN INT/EXT IOUT IOUT BYP PD DAC900 SBAS093B – MAY 2002 www.ti.com Copyright © 2002, Texas Instruments Incorporated Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. TM PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.

ELECTRICAL CHARACTERISTICS

At TA = full specified temperature range, +VA = +5V, +VD = +5V, differential transformer coupled output, 50Ω doubly terminated, unless otherwise specified. DAC900U/E PARAMETER CONDITIONS MIN TYP MAX UNITS RESOLUTION 10 Bits OUTPUT UPDATE RATE 2.7V to 3.3V 125 165 MSPS Output Update Rate (f CLOCK ) 4.5V to 5.5V 165 200 MSPS Full Specified Temperature Range, Operating Ambient, T A –40 +85 °C STATIC ACCURACY (1) TA = +25°C Differential Nonlinearity (DNL) f CLOCK = 25MSPS, fOUT = 1.0MHz –0.5 ±0.3 +0.5 LSB Integral Nonlinearity (INL) –1.0 ±0.5 +1.0 LSB DYNAMIC PERFORMANCE TA = +25°C Spurious-Free Dynamic Range (SFDR) To Nyquist fOUT = 1.0MHz, fCLOCK = 25MSPS 70 76 dBc fOUT = 2.1MHz, fCLOCK = 50MSPS 75 dBc fOUT = 5.04MHz, fCLOCK = 50MSPS 68 dBc fOUT = 5.04MHz, fCLOCK = 100MSPS 68 dBc fOUT = 20.2MHz, fCLOCK = 100MSPS 62 dBc fOUT = 25.3MHz, fCLOCK = 125MSPS 62 dBc fOUT = 41.5MHz, fCLOCK = 125MSPS 53 dBc fOUT = 27.4MHz, fCLOCK = 165MSPS 59 dBc fOUT = 54.8MHz, fCLOCK = 165MSPS 53 dBc Spurious-Free Dynamic Range within a Window fOUT = 5.04MHz, fCLOCK = 50MSPS 2MHz Span 78 dBc fOUT = 5.04MHz, fCLOCK = 100MSPS 4MHz Span 78 dBc Total Harmonic Distortion (THD) fOUT = 2.1MHz, fCLOCK = 50MSPS –74 dBc fOUT = 2.1MHz, fCLOCK = 125MSPS –73 dBc Two Tone fOUT1 = 13.5MHz, fOUT2 = 14.5MHz, fCLOCK = 100MSPS 60 dBc Output Settling Time(2) to 0.1% 30 ns ELECTROSTATIC DISCHARGE SENSITIVITY This integrated circuit can be damaged by ESD. Texas Instru- ments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. PACKAGE SPECIFIED DRAWING TEMPERATURE PACKAGE ORDERING TRANSPORT PRODUCT PACKAGE NUMBER RANGE MARKING NUMBER (1) MEDIA DAC900U SO-28 217 –40°C to +85°C DAC900U DAC900U Rails "" " " " DAC900U/1K Tape and Reel DAC900E TSSOP-28 360 –40°C to +85°C DAC900E DAC900E Rails "" " " " DAC900E/2K5 Tape and Reel NOTE: (1) Models with a slash (/) are available only in Tape and Reel in the quantities indicated (e.g., /2K5 indicates 2500 devices per reel). Ordering 2500 pieces of “DAC900E/2K5 ” will get a single 2500-piece Tape and Reel. PACKAGE/ORDERING INFORMATION DEMO BOARD PRODUCT ORDERING NUMBER COMMENT DAC900U DEM-DAC90xU Populated evaluation board without DAC. Order sample of desired DAC90x model separately. DAC900E DEM-DAC900E Populated evaluation board including the DAC900E. DEMO BOARD ORDERING INFORMATION ABSOLUTE MAXIMUM RATINGS

ELECTRICAL CHARACTERISTICS (Cont.) At TA = +25°C, +VA = +5V, +VD = +5V, differential transformer coupled output, 50Ω doubly terminated, unless otherwise specified. DAC900U/E PARAMETER CONDITIONS MIN TYP MAX UNITS DYNAMIC PERFORMANCE (Cont.) Output Rise Time(2) 10% to 90% 2 ns Output Fall Time(2) 10% to 90% 2 ns Glitch Impulse 3p V - s DC-ACCURACY Full-Scale Output Range(3)(FSR) All Bits High, I OUT 2.0 20.0 mA Output Compliance Range –1.0 +1.25 V Gain Error With Internal Reference –10 ±1 +10 %FSR Gain Error With External Reference –10 ±2 +10 %FSR Gain Drift With Internal Reference ±120 ppmFSR/ °C Offset Error With Internal Reference –0.025 +0.025 %FSR Offset Drift With Internal Reference ±0.1 ppmFSR/ °C Power-Supply Rejection, +VA –0.2 +0.2 %FSR/V Power-Supply Rejection, +VD –0.025 +0.025 %FSR/V Output Noise I OUT = 20mA, RLOAD = 50Ω 50 pA/ √Hz Output Resistance 200 k Ω Output Capacitance I OUT , IOUT to Ground 12 pF REFERENCE Reference Voltage +1.24 V Reference Tolerance ±10 % Reference Voltage Drift ±50 ppmFSR/ °C Reference Output Current 10 µA Reference Input Resistance 1M Ω Reference Input Compliance Range 0.1 1.25 V Reference Small-Signal Bandwidth (4) 1.3 MHz DIGITAL INPUTS Logic Coding Straight Binary Latch Command Rising Edge of Clock Logic High Voltage, VIH +V D = +5V 3.5 5 V Logic Low Voltage, VIL +V D = +5V 0 1.2 V Logic High Voltage, VIH +V D = +3V 2 3 V Logic Low Voltage, VIL +V D = +3V 0 0.8 V Logic High Current, IIH(5) +V D = +5V ±20 µA Logic Low Current, IIL +V D = +5V ±20 µA Input Capacitance 5p F POWER SUPPLY Supply Voltages Supply Current(6) IVA 24 30 mA IVA , Power-Down Mode 1.1 2 mA IVD 81 5 m A Power Dissipation +5V, I OUT = 20mA 170 230 mW +3V, IOUT = 2mA 50 mW Power Dissipation, Power-Down Mode 45 mW Thermal Resistance, θJA SO-28 75 °C/W TSSOP-28 50 °C/W NOTES: (1) At output IOUT , while driving a virtual ground. (2) Measured single-ended into 50Ω Load. (3) Nominal full-scale output current is 32x IREF ; see Application Section for details. (4) Reference bandwidth depends on size of external capacitor at the BW pin and signal level. (5) Typically 45µA for the PD pin, which has an internal pull-down resistor. (6) Measured at fCLOCK = 50MSPS and fOUT = 1.0MHz.

+1.24V Ref. Latches 10-Bit Data Input DAC900 FSA BW +VD+VA R SET AGND CLK DGND REF IN 0.1µF INT/EXT IOUT IOUT BYP PD 20pF 50Ω 50Ω 20pF 1:1 0.1µF 0.1µF +5V +5V Bit 1 Bit 2 Bit 3 Bit 4 Bit 5 Bit 6 Bit 7 Bit 8 Bit 9 Bit 10 NC NC NC NC CLK D DGND NC A BYP I OUT IOUT AGND BW FSA REF IN INT/EXT PD DAC900 PIN DESIGNATOR DESCRIPTION

1 Bit 1 Data Bit 1 (D9), MSB

2 Bit 2 Data Bit 2 (D8)

3 Bit 3 Data Bit 3 (D7)

4 Bit 4 Data Bit 4 (D6)

5 Bit 5 Data Bit 5 (D5)

6 Bit 6 Data Bit 6 (D4)

7 Bit 7 Data Bit 7 (D3)

8 Bit 8 Data Bit 8 (D2)

9 Bit 9 Data Bit 9 (D1)

10 Bit 10 Data Bit 10 (D0), LSB

11 NC No Connection

12 NC No Connection

13 NC No Connection

14 NC No Connection

15 PD Power Down, Control Input; Active

HIGH. Contains internal pull-down circuit; may be left unconnected if not used.

16 INT/EXT Reference Select Pin; Internal ( = 0) or

External ( = 1) Reference Operation. 17 REF IN Reference Input/Ouput. See Applications section for further details.

18 FSA Full-Scale Output Adjust

19 BW Bandwidth/Noise Reduction Pin:

Bypass with 0.1µF to +VA for Optimum Performance.

20 AGND Analog Ground

21 I OUT Complementary DAC Current Output

22 I OUT DAC Current Output

23 BYP Bypass Node: Use 0.1 µF to AGND 24 +V A Analog Supply Voltage, 2.7V to 5.5V

25 NC No Connection

26 DGND Digital Ground

D Digital Supply Voltage, 2.7V to 5.5V

28 CLK Clock Input

PIN DESCRIPTIONSPIN CONFIGURATION Top View SO, TSSOP TYPICAL CONNECTION CIRCUIT

Data Changes Stable Valid Data Data Changes SYMBOL DESCRIPTION MIN TYP MAX UNITS t1 Clock Pulse HIGH Time 3 ns t2 Clock Pulse LOW Time 3 ns tS Data Setup Time 1.5 ns tH Data Hold Time 1.0 ns tPD Propagation Delay Time 1 ns tSET Output Settling Time to 0.1% 30 ns

TYPICAL CHARACTERISTICS: V D = VA = +5V At TA = +25°C, Differential IOUT = 20mA, 50Ω double-terminated load, SFDR up to Nyquist, unless otherwise specified. DAC Code TYPICAL DNL Error (LSBs) 1.00 0.75 0.50 0.25 –0.25 –0.50 –0.75 –1.00 100 200 300 400 500 600 700 800 900 1000 1024 DAC Code TYPICAL INL Error (LSBs) 1.00 0.75 0.50 0.25 –0.25 –0.50 –0.75 –1.00 100 200 300 400 500 600 700 800 900 1000 1024 SFDR vs fOUT AT 25MSPS Frequency (MHz) SFDR (dBc) 0dBFS –6dBFS SFDR vs fOUT AT 50MSPS Frequency (MHz) SFDR (dBc) –6dBFS 0dBFS SFDR vs fOUT AT 100MSPS Frequency (MHz) SFDR (dBc) 0dBFS –6dBFS SFDR vs fOUT AT 125MSPS Frequency (MHz) SFDR (dBc) 0dBFS –6dBFS

TYPICAL CHARACTERISTICS: V D = VA = +5V (Cont.) At TA = +25°C, Differential IOUT = 20mA, 50Ω double-terminated load, SFDR up to Nyquist, unless otherwise specified. SFDR vs fOUT AT 165MSPS Frequency (MHz) SFDR (dBc) –6dBFS 0dBFS SFDR vs fOUT AT 200MSPS Frequency (MHz) SFDR (dBc) –6dBFS 0dBFS DIFFERENTIAL vs SINGLE-ENDED SFDR vs fOUT AT 100MSPS Frequency (MHz) SFDR (dBc) Diff (0dBFS) IOUT (–6dBFS) IOUT (0dBFS) Diff (–6dBFS) X X X X X X X SFDR vs IOUTFS and fOUT AT 100MSPS, 0dBFS IOUTFS (mA) SFDR (dBc) 51 0 2 02 X X X X 2.1MHz 10.1MHz 5.04MHz 40.4MHz *** * THD vs fCLOCK AT fOUT = 2.1MHz fCLOCK (MSPS) THD (dBc) –70 –75 –80 –85 –90 –95 –100 25 50 100 125 1500 2HD 3HD SFDR vs TEMPERATURE AT 100MSPS, 0dBFS Temperature (°C) SFDR (dBc) –20 0 25 70 50 85–40 2.1MHz 10.1MHz 40.4MHz XXXX XXX

TYPICAL CHARACTERISTICS: V D = VA = +5V (Cont.) At TA = +25°C, Differential IOUT = 20mA, 50Ω double-terminated load, SFDR up to Nyquist, unless otherwise specified. DUAL-TONE OUTPUT SPECTRUM Frequency (MHz) Magnitude (dBm) –10 –20 –30 –40 –50 –60 –70 –80 –90 –100 5 1 01 52 02 53 03 54 04 55 0 fCLOCK = 100MSPS fOUT1 = 13.5MHz fOUT2 = 14.5MHz SFDR = 60dBc Amplitude = 0dBFS FOUR-TONE OUTPUT SPECTRUM Frequency (MHz) Magnitude (dBm) –10 –20 –30 –40 –50 –60 –70 –80 –90 –100 51 0 1 5 2 0 2 5 fCLOCK = 50MSPS fOUT1 = 6.25MHz fOUT2 = 6.75MHz fOUT3 = 7.25MHz fOUT4 = 7.75MHz SFDR = 66dBc Amplitude = 0dBFS

TYPICAL CHARACTERISTICS: V D = VA = +3V At TA = +25°C, Differential IOUT = 20mA, 50Ω double-terminated load, SFDR up to Nyquist, unless otherwise specified. SFDR vs fOUT AT 25MSPS Frequency (MHz) SFDR (dBc) 0dBFS –6dBFS SFDR vs fOUT AT 50MSPS Frequency (MHz) SFDR (dBc) –6dBFS 0dBFS SFDR vs fOUT AT 100MSPS Frequency (MHz) SFDR (dBc) –6dBFS 0dBFS SFDR vs fOUT AT 125MSPS Frequency (MHz) SFDR (dBc) 0dBFS –6dBFS SFDR vs fOUT AT 165MSPS Frequency (MHz) SFDR (dBc) –6dBFS 0dBFS DIFFERENTIAL vs SINGLE-ENDED SFDR vs fOUT AT 100MSPS Frequency (MHz) SFDR (dBc) Diff (0dBFS) IOUT (–6dBFS) IOUT (0dBFS) Diff (–6dBFS) X X X X X X X

TYPICAL CHARACTERISTICS: V D = VA = +3V (Cont.) At TA = +25°C, Differential IOUT = 20mA, 50Ω double-terminated load, SFDR up to Nyquist, unless otherwise specified. IOUTFS (mA) SFDR (dBc) 51 0 2 02 X X *** * X X SFDR vs IOUTFS and fOUT AT 100MSPS 2.1MHz 5.04MHz 10.1MHz 40.4MHz THD vs fCLOCK AT fOUT = 2.1MHz fCLOCK (MSPS) THD (dBc) –70 –75 –80 –85 –90 –95 –100 25 50 100 125 1500 2HD 3HD SFDR vs TEMPERATURE AT 100MSPS, 0dBFS Temperature (°C) SFDR (dBc) –20 0 25 70 50 85–40 2.1MHz 10.1MHz 40.4MHz XX XXX X X DUAL-TONE OUTPUT SPECTRUM Frequency (MHz) Magnitude (dBm) –10 –20 –30 –40 –50 –60 –70 –80 –90 –100 5 1 01 52 02 53 03 54 04 55 0 fCLOCK = 100MSPS fOUT1 = 13.5MHz fOUT2 = 14.5MHz SFDR = 61.5dBc Amplitude = 0dBFS FOUR-TONE OUTPUT SPECTRUM Frequency (MHz) Magnitude (dBm) –10 –20 –30 –40 –50 –60 –70 –80 –90 –100 51 0 1 5 2 0 2 5 fCLOCK = 50MSPS fOUT1 = 6.25MHz fOUT2 = 6.75MHz fOUT3 = 7.25MHz fOUT4 = 7.75MHz SFDR = 62.5dBc Amplitude = 0dBFS

APPLICATION INFORMATION

The architecture of the DAC900 uses the current steering technique to enable fast switching and a high update rate. The core element within the monolithic DAC is an array of segmented current sources, which are designed to deliver a full-scale output current of up to 20mA, as shown in Figure 1. An internal decoder addresses the differential current switches each time the DAC is updated and a corresponding output current is formed by steering all currents to either output summing node, I OUT or IOUT . The complementary outputs deliver a differential output signal that improves the dynamic performance through reduction of even-order harmonics, common-mode signals (noise), and double the peak-to-peak output signal swing by a factor of two, compared to single- ended operation. The segmented architecture results in a significant reduction of the glitch energy, and improves the dynamic performance (SFDR) and DNL. The current outputs maintain a very high output impedance of greater than 200kΩ . The full-scale output current is determined by the ratio of the internal reference voltage (1.24V) and an external resistor, R SET . The resulting IREF is internally multiplied by a factor of 32 to produce an effective DAC output current that can range from 2mA to 20mA, depending on the value of R SET . The DAC900 is split into a digital and an analog portion, each of which is powered through its own supply pin. The digital section includes edge-triggered input latches and the decoder logic, while the analog section comprises the cur- rent source array with its associated switches and the refer- ence circuitry. DAC TRANSFER FUNCTION The total output current, I OUTFS , of the DAC900 is the summation of the two complementary output currents: IOUTFS = IOUT + IOUT (1) The individual output currents depend on the DAC code and can be expressed as: IOUT = IOUTFS • (Code/1024) (2) IOUT = IOUTFS • (1023 – Code/1024) (3) where ‘Code’ is the decimal representation of the DAC data input word. Additionally, IOUTFS is a function of the refer- ence current IREF , which is determined by the reference voltage and the external setting resistor, RSET . IOUTFS = 32 • IREF = 32 • VREF /RSET (4) In most cases the complementary outputs will drive resistive loads or a terminated transformer. A signal voltage will develop at each output according to: V OUT = IOUT • RLOAD (5) V OUT = IOUT • RLOAD (6) FIGURE 1. Functional Block Diagram of the DAC900. NOTE: Supply bypassing not shown.

FIGURE 8. External Reference Configuration. ability of dynamic gain control. times may be chosen within their specified limits. operate over a supply range of 2.7V to 5.5V. the normal operation of the converter. signal layers by ground layers, etc.

Further supply decoupling with surface mount tantalum capacitors (1uF to 4.7uF) may be added as needed in proximity of the converter. Low noise is required for all supply and ground connections to the DAC900. It is recommended to use a multilayer pc- board utilizing separate power and ground planes. Mixed signal designs require particular attention to the routing of the different supply currents and signal traces. Generally, analog supply and ground planes should only extend into analog signal areas, such as the DAC output signal and the reference signal. Digital supply and ground planes must be confined to areas covering digital circuitry, including the digital input lines connecting to the converter, as well as the clock signal. The analog and digital ground planes should be joined together at one point underneath the DAC. This can be realized with a short track of approximately 1/8" (3mm). The power to the DAC900 should be provided through the use of wide pcb runs or planes. Wide runs will present a lower trace impedance, further optimizing the supply decou- pling. The analog and digital supplies for the converter should only be connected together at the supply connector of the pc-board. In the case of only one supply voltage being available to power the DAC, ferrite beads along with bypass capacitors may be used to create an LC filter. This will generate a low-noise analog supply voltage that can then be connected to the +V A supply pin of the DAC900. While designing the layout, it is important to keep the analog signal traces separate from any digital line, in order to prevent noise coupling onto the analog signal path.

www.ti.com 21-May-2010 Addendum-Page 1 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp (3) Samples (Requires Login) DAC900E ACTIVE TSSOP PW 28 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR DAC900E/2K5 ACTIVE TSSOP PW 28 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR DAC900E/2K5G4 ACTIVE TSSOP PW 28 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR DAC900EG4 ACTIVE TSSOP PW 28 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR DAC900U ACTIVE SOIC DW 28 20 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR DAC900U/1K ACTIVE SOIC DW 28 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR DAC900U/1KG4 ACTIVE SOIC DW 28 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR DAC900UG4 ACTIVE SOIC DW 28 20 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

www.ti.com 21-May-2010 Addendum-Page 2 Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 Pack Materials-Page 1

*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) DAC900E/2K5 TSSOP PW 28 2500 367.0 367.0 38.0 DAC900U/1K SOIC DW 28 1000 367.0 367.0 55.0 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 Pack Materials-Page 2

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