DAC63004RTER

DAC63004_V02 TI | Alldatasheet

Document overview

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Technical content

DACx3004 12-Bit and 10-Bit, Ultra-Low-Power, Quad Voltage and Current Output Smart DACs With Auto-Detected I2C, PMBus™, or SPI

1 Features

• Programmable voltage or current outputs with flexible configuration: – Voltage outputs:
• 1 LSB INL and DNL (10-bit)
• Gains of 1x, 1.5x, 2x, 3x, and 4x – Current outputs:
• 1 LSB INL and DNL (8-bit)
• Unipolar and bipolar output range options from 25 μA to 250 μA
• 35-μA/channel IDD in voltage-output mode
• Programmable comparator mode for all channels
• High-impedance output when VDD is off
• High-impedance and resistive pulldown power- down modes
• 50-MHz SPI-compatible interface
• Automatically detected I2C, PMBus™, or SPI interface – 1.62-V VIH with VDD = 5.5 V
• General-purpose input/output (GPIO) configurable as multiple functions
• Predefined waveform generation: sine wave, triangular, sawtooth
• User-programmable nonvolatile memory (NVM)
• Internal, external, or power-supply as reference
• Wide operating range: – Power supply: 1.8 V to 5.5 V – Temperature range: –40˚C to +125˚C
• Tiny package: 16-pin WQFN (3 mm × 3 mm)

2 Applications

• Land mobile radio
• Pulse oximeter
• Optical module
• Standard notebook PC

3 Description

The 12-bit DAC63004 and 10-bit DAC53004 (DACx3004) are a pin-compatible family of ultra- low-power, quad-channel, buffered, voltage-output and current-output smart digital-to-analog converters (DACs). These DACx3004 support Hi-Z power-down mode and Hi-Z output during power-off condition. The DAC outputs provide a force-sense option for use as a programmable comparator and current sink. The multifunction GPIO, function generation, and NVM enable these smart DACs for processor- less applications and design reuse. These devices automatically detect I 2C, PMBus, and SPI interfaces and contain an internal reference. The feature set combined with the tiny package and ultra-low power make these smart DACs an excellent choice for applications such as land mobile radios, pulseoximeters, notebook PCs, and other battery-operated applications for biasing, calibration, and waveform generation. Device Information PART NUMBER PACKAGE(1) BODY SIZE (NOM) DACx3004 WQFN (16) 3.00 mm x 3.00 mm (1) For all available packages, see the orderable addendum at the end of the data sheet. Simplified Block Diagram DACx3004 VDD VOUT/ IOUT VOUT/ IOUT VOUT/ IOUT VOUT/ IOUT DAC REG DAC BUF DAC REG DAC BUF DAC REG DAC BUF DAC REG DAC BUF NVM Internal Reference LDO Output Configuration Logic VREFCAP AGND Digital Interface RX-VCO Crystal Oscillator Power Amplifier TX-VCO SDA/SCLK SCL/SYNC A0/SDI GPIO/SDO DACx3004 for Biasing in Land Mobile Radio DAC63004, DAC53004 SLASEX2A – APRIL 2021 – REVISED DECEMBER 2021 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA.

6.13 Timing Requirements: SPI Read and Daisy

6.14 Timing Requirements: SPI Read and Daisy

11.1 Receiving Notification of Documentation Updates.. 75

12 Mechanical, Packaging, and Orderable

4 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision * (April 2021) to Revision A (December 2021) Page DAC63004, DAC53004 SLASEX2A – APRIL 2021 – REVISED DECEMBER 2021 www.ti.com

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5 Pin Configuration and Functions

16 VREF16 VREF5GPIO/SDO 5GPIO/SDO

15 VDD15 VDD6SCL/SYNC 6SCL/SYNC

2OUT3 2OUT3 11 OUT011 OUT0

14 AGND14 AGND7A0/SDI 7A0/SDI

3OUT2 3OUT2 10 OUT110 OUT1

13 CAP13 CAP8SDA/SCLK 8SDA/SCLK

Thermal PadThermal Pad16 VREF5GPIO/SDO 1FB3 12 FB0

15 VDD6SCL/SYNC

14 AGND7A0/SDI

13 CAP8SDA/SCLK

Figure 5-1. RTE Package, 16-pin WQFN, Top View Table 5-1. Pin Functions PIN TYPE DESCRIPTION NO. NAME 1 FB3 Input Voltage feedback pin for channel 3. In voltage-output mode, connect to OUT3 for closed-loop amplifier output. In current-output mode, keep the FB3 pin unconnected to minimize leakage current. 2 OUT3 Output Analog output voltage from DAC channel 3. 3 OUT2 Output Analog output voltage from DAC channel 2. 4 FB2 Input Voltage feedback pin for channel 2. In voltage-output mode, connect to OUT2 for closed-loop amplifier output. In current-output mode, keep the FB2 pin unconnected to minimize leakage current.

5 GPIO/SDO Input/Output

General-purpose input/output configurable as LDAC, PD, PROTECT, RESET, SDO, and STATUS. For STATUS and SDO, connect the pin to the IO voltage with an external pullup resistor. If unused, connect the GPIO pin to VDD or AGND using an external resistor. This pin can ramp up before VDD. 6 SCL/SYNC Output I2C serial interface clock or SPI chip select input. This pin must be connected to the IO voltage using an external pullup resistor. This pin can ramp up before VDD.

7 A0/SDI Input

Address configuration pin for I2C or serial data input for SPI. For SDI, this pin need not be pulled up or pulled down. This pin can ramp up before VDD. 8 SDA/SCLK Input/Output Bidirectional I2C serial data bus or SPI clock input. This pin must be connected to the IO voltage using an external pullup resistor in the I2C mode. This pin can ramp up before VDD. 9 FB1 Input Voltage feedback pin for channel 1. In voltage-output mode, connect to OUT1 for closed-loop amplifier output. In current-output mode, keep the FB1 pin unconnected to minimize leakage current. 10 OUT1 Output Analog output voltage from DAC channel 1. 11 OUT0 Output Analog output voltage from DAC channel 0. 12 FB0 Input Voltage feedback pin for channel 0. In voltage-output mode, connect to OUT0 for closed-loop amplifier output. In current-output mode, keep the FB0 pin unconnected to minimize leakage current. 13 CAP Power External bypass capacitor for the internal LDO. Connect a capacitor (approximately 1.5 μF) between CAP and AGND. 14 AGND Ground Ground reference point for all circuitry on the device. 15 VDD Power Supply voltage.

16 VREF Power

External reference input. Connect a capacitor (approximately 0.1 μF) between VREF and AGND. Use a pullup resistor to VDD when the external reference is not used. This pin must not ramp up before VDD. In case an external reference is used, make sure the reference ramps up after VDD. — Thermal Pad Ground Connect the thermal pad to AGND. www.ti.com DAC63004, DAC53004 SLASEX2A – APRIL 2021 – REVISED DECEMBER 2021 Copyright © 2021 Texas Instruments Incorporated Submit Document Feedback 3 Product Folder Links: DAC63004 DAC53004

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1) MIN MAX UNIT VDD Supply voltage, VDD to AGND –0.3 6 V Digital inputs to AGND –0.3 VDD + 0.3 V CAP to AGND –0.3 1.65 V VFBX to AGND –0.3 VDD + 0.3 V VOUTX to AGND –0.3 VDD + 0.3 V VREF External reference, VREF to AGND –0.3 VDD + 0.3 V Current into any pin except the OUTx pins –10 10 mA TJ Junction temperature –40 150 °C Tstg Storage temperature –65 150 °C (1) Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute Maximum Ratings do not imply functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions. If used outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not be fully functional, and this may affect device reliability, functionality, performance, and shorten the device lifetime.

6.2 ESD Ratings

V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1) ±2000 V Charged device model (CDM), per ANSI/ESDA/JEDEC JS-002, all pins(2) ±500 (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted) MIN NOM MAX UNIT VDD Positive supply voltage to ground (AGND) 1.7 5.5 V VREF External reference to ground (AGND) 1.7 VDD V VIH Digital input high voltage, 1.7 V < VDD ≤ 5.5 V 1.62 V VIL Digital input low voltage 0.4 V CCAP External capacitor on CAP pin 0.5 15 μF TA Ambient temperature –40 125 °C

6.4 Thermal Information

THERMAL METRIC(1) DACx3004 UNITRTE (WQFN)

16 PINS

RθJA Junction-to-ambient thermal resistance 49 °C/W RθJC(top) Junction-to-case (top) thermal resistance 50 °C/W RθJB Junction-to-board thermal resistance 24.1 °C/W ΨJT Junction-to-top characterization parameter 1.1 °C/W ΨJB Junction-to-board characterization parameter 24.1 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance 8.7 °C/W (1) For information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. DAC63004, DAC53004 SLASEX2A – APRIL 2021 – REVISED DECEMBER 2021 www.ti.com

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6.5 Electrical Characteristics: Voltage Output

all minimum/maximum specifications at TA = –40°C to +125°C and typical specifications at TA = 25°C, 1.7 V ≤ VDD ≤ 5.5 V, DAC reference tied to VDD, gain = 1x, DAC output pin (OUT) loaded with resistive load (RL = 5 kΩ to AGND) and capacitive load (CL = 200 pF to AGND), and digital inputs at VDD or AGND (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT STATIC PERFORMANCE Resolution DAC63004 12 Bits DAC53004 10 INL Integral nonlinearity(1) DAC63004 –4 4 LSB DAC53004 –1 1 DNL Differential nonlinearity(1) –1 1 LSB Zero-code error(4) Code 0d into DAC, external reference, VDD = 5.5 V 6 12 mV Code 0d into DAC, internal VREF, gain = 4x, VDD = 5.5 V 6 15 Zero-code error temperature coefficient(4) Code 0d into DAC ±10 µV/°C Offset error(4) (6) 1.7 V ≤ VDD < 2.7 V, FBx pin shorted to OUTx, DAC code: 32d for 12-bit resolution, 8d for 10-bit resolution –0.75 0.3 0.75 %FSR 2.7 V ≤ VDD ≤ 5.5 V, FBx pin shorted to OUTx, DAC code: 32d for 12-bit resolution, 8d for 10-bit resolution –0.5 0.25 0.5 Offset-error temperature coefficient(4) FBx pin shorted to OUTx, DAC code: 32d for 12-bit resolution, 8d for 10-bit resolution ±0.0003 %FSR/°C Gain error(4) Between end-point codes: 32d to 4064d for 12-bit resolution, 8d to 1016d for 10-bit resolution –0.5 0.25 0.5 %FSR Gain-error temperature coefficient(4) Between end-point codes: 32d to 4064d for 12-bit resolution, 8d to 1016d for 10-bit resolution ±0.0008 %FSR/°C Full-scale error(4) (6) 1.7 V ≤ VDD < 2.7 V, DAC at full-scale –1 1 %FSR 2.7 V ≤ VDD ≤ 5.5 V, DAC at full-scale –0.5 0.5 Full-scale-error temperature coefficient(4) DAC at full-scale ±0.0008 %FSR/°C OUTPUT Output voltage Reference tied to VDD 0 VDD V CL Capacitive load(2) RL = infinite, phase margin = 30° 200 pF Phase margin = 30° 1000 Short-circuit current VDD = 1.7 V, full-scale output shorted to AGND or zero-scale output shorted to VDD mAVDD = 2.7 V, full-scale output shorted to AGND or zero-scale output shorted to VDD VDD = 5.5 V, full-scale output shorted to AGND or zero-scale output shorted to VDD Output-voltage headroom(2) To VDD (DAC output unloaded, internal reference = 1.21 V), VDD ≥ 1.21 V ☓ gain + 0.2 V 0.2 V To VDD and AGND (DAC output unloaded, external reference at VDD, gain = 1x, the VREF pin is not shorted to VDD) 0.8 %FSRTo VDD and AGND (ILOAD = 10 mA at VDD = 5.5 V, ILOAD = 3 mA at VDD = 2.7 V, ILOAD = 1 mA at VDD =

1.8 V), external reference at VDD, gain = 1x, the VREF pin

ZO VFB dc output impedance(3) DAC output enabled, internal reference (gain = 1.5x or 2x) or external reference at VDD (gain = 1x), the VREF pin is not shorted to VDD 400 500 600 kΩ DAC output enabled, internal VREF, gain = 3x or 4x 325 400 485 Power supply rejection ratio (dc) Internal VREF, gain = 2x, DAC at midscale, VDD = 5 V ±10% 0.25 mV/V www.ti.com DAC63004, DAC53004 SLASEX2A – APRIL 2021 – REVISED DECEMBER 2021 Copyright © 2021 Texas Instruments Incorporated Submit Document Feedback 5 Product Folder Links: DAC63004 DAC53004

6.5 Electrical Characteristics: Voltage Output (continued)

all minimum/maximum specifications at TA = –40°C to +125°C and typical specifications at TA = 25°C, 1.7 V ≤ VDD ≤ 5.5 V, DAC reference tied to VDD, gain = 1x, DAC output pin (OUT) loaded with resistive load (RL = 5 kΩ to AGND) and capacitive load (CL = 200 pF to AGND), and digital inputs at VDD or AGND (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT DYNAMIC PERFORMANCE tsett Output voltage settling time 1/4 to 3/4 scale and 3/4 to 1/4 scale settling to 10%FSR, VDD = 5.5 V 20 µs 1/4 to 3/4 scale and 3/4 to 1/4 scale settling to 10%FSR, VDD = 5.5 V, internal VREF, gain = 4x 25 Slew rate VDD = 5.5 V 0.3 V/µs Power-on glitch magnitude At startup (DAC output disabled) 75 mV At startup (DAC output disabled), RL = 100 kΩ 200 Output-enable glitch magnitude DAC output disabled to enabled (DAC registers at zero scale), RL = 100 kΩ 250 mV Vn Output noise voltage (peak to peak) f = 0.1 Hz to 10 Hz, DAC at midscale, VDD = 5.5 V 50 µVPPInternal VREF, gain = 4x, f = 0.1 Hz to 10 Hz, DAC at midscale, VDD = 5.5 V 90 Output noise density f = 1 kHz, DAC at midscale, VDD = 5.5 V 0.35 µV/√HzInternal VREF, gain = 4x, f = 1 kHz, DAC at midscale, VDD = 5.5 V 0.9 Power supply rejection ratio (ac)(3) Internal VREF, gain = 4x, 200-mV 50-Hz or 60-Hz sine wave superimposed on power supply voltage, DAC at midscale -68 dB Code change glitch impulse ±1 LSB change around midscale (including feedthrough) 10 nV-s Code change glitch impulse magnitude ±1 LSB change around midscale (including feedthrough) 15 mV POWER IDD Current flowing into VDD(4) (5) Normal operation, DACs at full scale, digital pins static, external reference at VDD but the VREF pin is not shorted to VDD 35 50 µA/ch (1) Measured with DAC output unloaded. For external reference and internal reference VDD ≥ 1.21 x gain + 0.2 V, between end-point codes: 32d to 4064d for 12-bit resolution, 8d to 1016d for 10-bit resolution. (2) Specified by design and characterization, not production tested. (3) Specified with 200-mV headroom with respect to reference value when internal reference is used. (4) Measured with DAC output unloaded. (5) The total power consumption is calculated by IDD x (total number of channels powered on) + (sleep-mode current). (6) When a DAC channel is configured in IOUT mode for long term and then switched to VOUT mode, the VOUT mode can show parametric drift. DAC63004, DAC53004 SLASEX2A – APRIL 2021 – REVISED DECEMBER 2021 www.ti.com

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6.6 Electrical Characteristics: Current Output

all minimum/maximum specifications at TA = –40°C to +125°C and typical specifications at TA = 25°C, 1.7 V ≤ VDD ≤ 5.5 V, ±250µA output range, and digital inputs at VDD or AGND (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT STATIC PERFORMANCE Resolution 8 Bits INL Integral nonlinearity DAC codes between 10d and 255d for current output range of 0 µA to 25 µA, DAC codes between 0d and 255d for other ranges –1 1 LSB DNL Differential nonlinearity DAC codes between 10d and 255d for current output range of 0 µA to 25 µA, DAC codes between 0d and 255d for other ranges –1 1 LSB Offset error DAC output range: 0 µA to 25 µA, DAC at code 10d ±1.5 %FSR DAC output ranges: 0 µA to 50 µA, 0 µA to 125 µA, and 0 µA to 250 µA; DAC at zero-scale 5 all unipolar negative ranges, DAC at zero-scale -5 DAC output ranges: ±25 µA, ±50 µA, ±125 µA, and ±250 µA; DAC at midscale ±1 Gain error DAC output range: 0 µA to 25 µA, DAC codes between 10d and 255d ±1.5 %FSR DAC output ranges: 0 µA to 50 µA, 0 µA to 125 µA, and 0 µA to 250 µA; DAC codes between 0d and 255d ±1.5 all unipolar negative ranges, DAC codes between 0d and 255d ±5 DAC output ranges: ±25 µA, ±50 µA, ±125 µA, and ±250 µA; DAC codes between 0d and 255d ±1.3 OUTPUT Output compliance voltage(1) DAC output range: 0 µA to 25 µA, to VDD and to AGND 200 mV DAC output ranges: 0 µA to 50 µA, 0 µA to 125 µA, and 0 µA to 250 µA; to VDD 400 all unipolar negative ranges, to VDD 400 DAC output ranges: ±25 µA, ±50 µA, ±125 µA, and ±250 µA; to VDD and to AGND 400 ZO IOUT dc output impedance(2) DAC at midscale, DAC output kept at VDD/2 60 MΩ Power supply rejection ratio (dc) DAC at midscale, output range: 0 µA to 25 µA, VDD changed from 4.5 V to 5.5 V 0.28 LSB/V DAC at midscale, all unipolar positive ranges, VDD changed from 4.5 V to 5.5V 0.33 DAC at midscale, all unipolar negative ranges, VDD changed from 4.5 V to 5.5V 0.83 DAC at midscale, all bipolar ranges, VDD changed from 4.5V to 5.5V 0.23 DYNAMIC PERFORMANCE tsett Output current settling time 1/4 to 3/4 scale and 3/4 to 1/4 scale settling to 1 LSB at 8-bit resolution, VDD = 5.5 V, common-mode voltage at OUTx pin is VDD/2 60 µs Vn Output noise current (peak to peak)

0.1 Hz to 10 Hz, DAC at midscale,

VDD = 5.5 V, ±250-µA output range 150 nAPP Output noise density f = 1 kHz, DAC at midscale, VDD = 5.5 V, ±250-µA output range 1 nA/√Hz Power supply rejection ratio (ac)(3) ±250 µA output range, 200-mV 50-Hz or 60-Hz sine wave superimposed on power-supply voltage, DAC at midscale

0.65 LSB/V

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6.6 Electrical Characteristics: Current Output (continued)

all minimum/maximum specifications at TA = –40°C to +125°C and typical specifications at TA = 25°C, 1.7 V ≤ VDD ≤ 5.5 V, ±250µA output range, and digital inputs at VDD or AGND (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT POWER IDD Current flowing into VDD(3) (4) Normal operation, DACs at midscale, all unipolar output ranges, digital pins static 18 24 µA/ch Normal operation, DACs at full scale, ±25-µA output range, digital pins static 42 50 Normal operation, DACs at full scale, ±50-µA output range, digital pins static 56 70 Normal operation, DACs at full scale, ±125-µA output range, digital pins static 98 120 Normal operation, DACs at full scale, ±250-µA output range, digital pins static 167 200 (1) Measured between DAC codes 0d and 255d. (2) Specified by design and characterization, not production tested. (3) The current flowing into VDD does not account for the load current sourced or sinked on the OUTx pins. The VREF pin is connected to VDD. (4) The total power consumption is calculated by IDD x (total number of channels powered on) + (sleep-mode current).

6.7 Electrical Characteristics: Comparator Mode

all minimum/maximum specifications at TA = –40°C to +125°C and typical specifications at TA = 25°C, 1.7 V ≤ VDD ≤ 5.5 V, DAC reference tied to VDD, gain = 1x in voltage output mode, DAC output pin (OUT) loaded with resistive load (RL = 5 kΩ to AGND) and capacitive load (CL = 200 pF to AGND), and digital inputs at VDD or AGND (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT STATIC PERFORMANCE Offset error(1) (2) 1.7 V ≤ VDD ≤ 5.5 V, DAC at midscale, comparator input at Hi-Z, and DAC operating with external reference –5 0 5 mV Offset error time drift(1) VDD = 5.5 V, external reference, TA = 125°C, FBx in Hi-Z mode, DAC at full scale and VFB at 0 V or DAC at zero scale and VFB at 1.84 V, drift specified for 10 years of continuous operation 4 mV OUTPUT Input voltage VREF connected to VDD, FBx resistor network connected to ground 0 VDD V VREF connected to VDD, FBx resistor network disconnected from ground 0 VDD (1/3 – 1/100) VOL Logic low output voltage ILOAD = 100 μA, output in open-drain mode 0.1 V DYNAMIC PERFORMANCE tresp Output response time DAC at midscale with 10-bit resolution, FBx input at Hi-Z, and transition step at FBx node is (VDAC – 2 LSB) to (VDAC + 2 LSB), transition time measured between 10% and 90% of output, output current of 100 µA, comparator output configured in push-pull mode, load capacitor at DAC output is 25 pF 10 µs (1) Specified by design and characterization, not production tested. (2) This specification does not include the total unadjusted error (TUE) of the DAC. DAC63004, DAC53004 SLASEX2A – APRIL 2021 – REVISED DECEMBER 2021 www.ti.com

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6.8 Electrical Characteristics: General

all minimum/maximum specifications at TA = –40°C to +125°C and typical specifications at TA = 25°C, 1.7 V ≤ VDD ≤ 5.5 V, DAC reference tied to VDD, gain = 1x in voltage output mode or ±250µA output range in current output mode, DAC output pin (OUT) loaded with resistive load (RL = 5 kΩ to AGND) in voltage-output mode and capacitive load (CL = 200 pF to AGND), and digital inputs at VDD or AGND (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT INTERNAL REFERENCE Initial accuracy TA = 25°C 1.1979 1.212 1.224 V Reference output temperature coefficient(1) (2) 50 ppm/°C EXTERNAL REFERENCE VREF input impedance(1) (3) 192 kΩ/ch EEPROM Endurance(1) –40°C ≤ TA ≤ +85°C 20000 Cycles TA = 125°C 1000 Data retention(1) TA = 25°C 50 Years EEPROM programming write cycle time(1) 200 ms Device boot-up time(1) Time taken from power valid (VDD ≥ 1.7 V) to output valid state (output state as programmed in EEPROM), 0.5-µF capacitor on the CAP pin 5 ms DIGITAL INPUTS Digital feedthrough Voltage output mode, DAC output static at midscale, fast mode plus, SCL toggling 20 nV-s Pin capacitance Per pin 10 pF POWER-DOWN MODE IDD Current flowing into VDD(1) DAC in sleep mode, internal reference powered down, external reference at 5.5 V 28 µA DAC in sleep mode, internal reference enabled, additional current through internal reference 10 DAC channels enabled, internal reference enabled, additional current through internal reference per DAC channel in voltage-output mode 12.5 Current flowing into VDD DAC in deep-sleep mode, internal reference powered down, SDO mode disabled 1.5 3 HIGH-IMPEDANCE OUTPUT ILEAK Current flowing into VOUTX and VFBX DAC in Hi-Z output mode, 1.7 V ≤ VDD ≤ 5.5 V 10 nA VDD = 0 V, VOUT ≤ 1.5 V, decoupling capacitor between VDD and AGND = 0.1 μF 200 VDD = 0 V, 1.5 V < VOUT ≤ 5.5 V, decoupling capacitor between VDD and AGND = 0.1 μF 500 100 kΩ between VDD and AGND, VOUT ≤ 1.25 V, series resistance of 10 kΩ at OUTx pin ±2 µA (1) Specified by design and characterization, not production tested. (2) Measured at –40°C and +125°C and calculated the slope. (3) Impedances for the DAC channels are connected in parallel. www.ti.com DAC63004, DAC53004 SLASEX2A – APRIL 2021 – REVISED DECEMBER 2021 Copyright © 2021 Texas Instruments Incorporated Submit Document Feedback 9 Product Folder Links: DAC63004 DAC53004

6.9 Timing Requirements: I2C Standard Mode

all input signals are timed from VIL to 70% of Vpull-up, 1.7 V ≤ VDD ≤ 5.5 V, –40°C ≤ TA ≤ +125°C, and 1.7 V ≤ Vpull-up ≤ VDD V MIN NOM MAX UNIT fSCLK SCL frequency 100 kHz tBUF Bus free time between stop and start conditions 4.7 µs tHDSTA Hold time after repeated start 4 µs tSUSTA Repeated start setup time 4.7 µs tSUSTO Stop condition setup time 4 µs tHDDAT Data hold time 0 ns tSUDAT Data setup time 250 ns tLOW SCL clock low period 4700 ns tHIGH SCL clock high period 4000 ns tF Clock and data fall time 300 ns tR Clock and data rise time 1000 ns tVD_DAT Data valid time 3.45 µs tVD_ACK Data valid acknowledge time 3.45 µs

6.10 Timing Requirements: I2C Fast Mode

all input signals are timed from VIL to 70% of Vpull-up, 1.7 V ≤ VDD ≤ 5.5 V, –40°C ≤ TA ≤ +125°C, and 1.7 V ≤ Vpull-up ≤ VDD V MIN NOM MAX UNIT fSCLK SCL frequency 400 kHz tBUF Bus free time between stop and start conditions 1.3 µs tHDSTA Hold time after repeated start 0.6 µs tSUSTA Repeated start setup time 0.6 µs tSUSTO Stop condition setup time 0.6 µs tHDDAT Data hold time 0 ns tSUDAT Data setup time 100 ns tLOW SCL clock low period 1300 ns tHIGH SCL clock high period 600 ns tF Clock and data fall time 300 ns tR Clock and data rise time 300 ns tVD_DAT Data valid time 0.9 µs tVD_ACK Data valid acknowledge time 0.9 µs

6.11 Timing Requirements: I2C Fast Mode Plus

all input signals are timed from VIL to 70% of Vpull-up, 1.7 V ≤ VDD ≤ 5.5 V, –40°C ≤ TA ≤ +125°C, and 1.7 V ≤ Vpull-up ≤ VDD V MIN NOM MAX UNIT fSCLK SCL frequency 1 MHz tBUF Bus free time between stop and start conditions 0.5 µs tHDSTA Hold time after repeated start 0.26 µs tSUSTA Repeated start setup time 0.26 µs tSUSTO Stop condition setup time 0.26 µs tHDDAT Data hold time 0 ns tSUDAT Data setup time 50 ns tLOW SCL clock low period 0.5 µs tHIGH SCL clock high period 0.26 µs tF Clock and data fall time 120 ns tR Clock and data rise time 120 ns tVD_DAT Data valid time 0.45 µs tVD_ACK Data valid acknowledge time 0.45 µs DAC63004, DAC53004 SLASEX2A – APRIL 2021 – REVISED DECEMBER 2021 www.ti.com

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6.12 Timing Requirements: SPI Write Operation

all input signals are specified with tr = tf = 1 V/ns (10% to 90% of VIO) and timed from a voltage level of (VIL + VIH) / 2, 1.7 V ≤ VIO ≤ 5.5 V, 1.7 V ≤ VDD ≤ 5.5 V, and –40°C ≤ TA ≤ +125°C MIN NOM MAX UNIT f(SCLK) Serial clock frequency 50 MHz tSCLKHIGH SCLK high time 9 ns tSCLKLOW SCLK low time 9 ns tSDIS SDI setup time 8 ns tSDIH SDI hold time 8 ns tCSS CS to SCLK falling edge setup time 18 ns tCSH SCLK falling edge to CS rising edge 10 ns tCSHIGH CS hight time 50 ns tDACWAIT Sequential DAC update wait time for same channel 2 µs tBCASTWAIT Broadcast DAC update wait time 2 µs

6.13 Timing Requirements: SPI Read and Daisy Chain Operation (FSDO = 0)

all input signals are specified with tr = tf = 1 V/ns (10% to 90% of VIO) and timed from a voltage level of (VIL + VIH) / 2, 1.7 V ≤ VIO ≤ 5.5 V, 1.7 V ≤ VDD ≤ 5.5 V, –40°C ≤ TA ≤ +125°C, and FSDO = 0 MIN NOM MAX UNIT f(SCLK) Serial clock frequency 1.25 MHz tSCLKHIGH SCLK high time 350 ns tSCLKLOW SCLK low time 350 ns tSDIS SDI setup time 8 ns tSDIH SDI hold time 8 ns tCSS SYNC to SCLK falling edge setup time 400 ns tCSH SCLK falling edge to SYNC rising edge 400 ns tCSHIGH SYNC hight time 1 µs tSDODLY SCLK rising edge to SDO falling edge, IOL ≤ 5 mA, CL = 20 pF. 300 ns

6.14 Timing Requirements: SPI Read and Daisy Chain Operation (FSDO = 1)

all input signals are specified with tr = tf = 1 V/ns (10% to 90% of VIO) and timed from a voltage level of (VIL + VIH) / 2, 1.7 V ≤ VIO ≤ 5.5 V, 1.7 V ≤ VDD ≤ 5.5 V, –40°C ≤ TA ≤ +125°C, and FSDO = 1 MIN NOM MAX UNIT f(SCLK) Serial clock frequency 2.5 MHz tSCLKHIGH SCLK high time 175 ns tSCLKLOW SCLK low time 175 ns tSDIS SDI setup time 8 ns tSDIH SDI hold time 8 ns tCSS SYNC to SCLK falling edge setup time 300 ns tCSH SCLK falling edge to SYNC rising edge 300 ns tCSHIGH SYNC hight time 1 µs tSDODLY SCLK rising edge to SDO falling edge, IOL ≤ 5 mA, CL = 20 pF. 300 ns www.ti.com DAC63004, DAC53004 SLASEX2A – APRIL 2021 – REVISED DECEMBER 2021 Copyright © 2021 Texas Instruments Incorporated Submit Document Feedback 11 Product Folder Links: DAC63004 DAC53004

6.15 Timing Requirements: GPIO

all input signals are specified with tr = tf = 1 V/ns (10% to 90% of VIO) and timed from a voltage level of (VIL + VIH) / 2, 1.7 V ≤ VIO ≤ 5.5 V, 1.7 V ≤ VDD ≤ 5.5 V, and –40°C ≤ TA ≤ +125°C MIN NOM MAX UNIT tGPIHIGH GPI high time(1) 2 µs tGPILOW GPI low time(1) 2 µs tGPAWGD LDAC falling edge to DAC update delay(2) 2 µs tCS2LDAC SYNC rising edge to LDAC falling edge 1 µs tSTP2LDAC I2C stop bit rising edge to LDAC falling edge 1 µs tLDACW LDAC low time 2 µs (1) The SCL, SDA, A0, and A1 pins can be configured as GPIOs that perform different channel-specific or independent operations. The actual response time of the GPIO is determined by the delay provided by the configured function and the settling time of the DAC. (2) The GPIOs can be configured as channel-specific or global LDAC function.

6.16 Timing Diagrams

S tSUSTO P Low byte ACK cycle Figure 6-1. I2C Timing Diagram tCSS tSDIS tSDIH SYNC SDI tCSHIGH Bit 23 tSCLKLOW Bit 1 Bit 0 tCSH SCLK tSCLKHIGH tCS2LDAC tLDACW GPIO/ LDAC Figure 6-2. SPI Write Timing Diagram DAC63004, DAC53004 SLASEX2A – APRIL 2021 – REVISED DECEMBER 2021 www.ti.com

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FSDO = 0 Bit 23 Bit 1 Bit 0 tSDODZtSDODLY FIRST READ COMMAND tCSS tSDIS tSDIH SDI tCSHIGH Bit 23 SCLK SDO FSDO = 1 Bit 23 Bit 1 Bit 0 tSDODLY ANY COMMAND DATA FROM FIRST READ COMMAND DATA FROM FIRST READ COMMAND tSCLKHIGHtSCLKLOW SYNC Figure 6-3. SPI Read Timing Diagram www.ti.com DAC63004, DAC53004 SLASEX2A – APRIL 2021 – REVISED DECEMBER 2021 Copyright © 2021 Texas Instruments Incorporated Submit Document Feedback 13 Product Folder Links: DAC63004 DAC53004

6.17 Typical Characteristics: Voltage Output

at TA = 25°C, VDD = 5.5 V, external reference = 5.5 V, gain = 1x, 12-bit resolution, and DAC outputs unloaded (unless otherwise noted) Code Voltage Output INL (LSB) 32 544 1056 1568 2080 2592 3104 3616 4064 -3.2 -2.4 -1.6 -0.8 0.8 1.6 2.4 3.2 Channel 0 Channel 1 Channel 2 Channel 3 Internal reference, gain = 4x Figure 6-4. Voltage Output INL vs Digital Input Code Code Voltage Output INL (LSB) 32 544 1056 1568 2080 2592 3104 3616 4064 -3.2 -2.4 -1.6 -0.8 0.8 1.6 2.4 3.2 Channel 0 Channel 1 Channel 2 Channel 3 Figure 6-5. Voltage Output INL vs Digital Input Code Temperature (  C) Voltage Output INL (LSB) -40 -25 -10 5 20 35 50 65 80 95 110 125 -3.2 -2.4 -1.6 -0.8 0.8 1.6 2.4 3.2 CH0 MAX CH1 MAX CH2 MAX CH3 MAX CH0 MIN CH1 MIN CH2 MIN CH3 MIN Figure 6-6. Voltage Output INL vs Temperature Supply Voltage (V) Voltage Output INL (LSB) -3.2 -2.4 -1.6 -0.8 0.8 1.6 2.4 3.2 CH0 MAX CH1 MAX CH2 MAX CH3 MAX CH0 MIN CH1 MIN CH2 MIN CH3 MIN Figure 6-7. Voltage Output INL vs Supply Voltage Code Voltage Output DNL (LSB) 32 544 1056 1568 2080 2592 3104 3616 4064 -0.8 -0.6 -0.4 -0.2 0.2 0.4 0.6 0.8 Channel 0 Channel 1 Channel 2 Channel 3 Internal reference, gain = 4x Figure 6-8. Voltage Output DNL vs Digital Input Code Code Voltage Output DNL (LSB) 32 544 1056 1568 2080 2592 3104 3616 4064 -0.8 -0.6 -0.4 -0.2 0.2 0.4 0.6 0.8 Channel 0 Channel 1 Channel 2 Channel 3 Figure 6-9. Voltage Output DNL vs Digital Input Code DAC63004, DAC53004 SLASEX2A – APRIL 2021 – REVISED DECEMBER 2021 www.ti.com

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6.17 Typical Characteristics: Voltage Output (continued)

at TA = 25°C, VDD = 5.5 V, external reference = 5.5 V, gain = 1x, 12-bit resolution, and DAC outputs unloaded (unless otherwise noted) Temperature (  C) Voltage Output DNL (LSB) -40 -25 -10 5 20 35 50 65 80 95 110 125 -0.8 -0.6 -0.4 -0.2 0.2 0.4 0.6 0.8 CH0 MAX CH1 MAX CH2 MAX CH3 MAX CH0 MIN CH1 MIN CH2 MIN CH3 MIN Figure 6-10. Voltage Output DNL vs Temperature Supply Voltage (V) Voltage Output DNL (LSB) -0.8 -0.6 -0.4 -0.2 0.2 0.4 0.6 0.8 CH0 MAX CH1 MAX CH2 MAX CH3 MAX CH0 MIN CH1 MIN CH2 MIN CH3 MIN Figure 6-11. Voltage Output DNL vs Supply Voltage Code Voltage Output TUE (%FSR) 0 512 1024 1536 2048 2560 3072 3584 4095 -1.5 -1.2 -0.9 -0.6 -0.3 0.3 0.6 0.9 1.2 1.5 Channel 0 Channel 1 Channel 2 Channel 3 Internal reference, gain = 4x Figure 6-12. Voltage Output TUE vs Digital Input Code Figure 6-13. Voltage Output TUE vs Digital Input Code Temperature (  C) Voltage Output TUE (%FSR) -40 -25 -10 5 20 35 50 65 80 95 110 125 -1.5 -1.2 -0.9 -0.6 -0.3 0.3 0.6 0.9 1.2 1.5 Channel 0 Channel 1 Channel 2 Channel 3 DAC channels at midscale Figure 6-14. Voltage Output TUE vs Temperature Supply Voltage (V) Voltage Output TUE (%FSR) -1.5 -1.2 -0.9 -0.6 -0.3 0.3 0.6 0.9 1.2 1.5 Channel 0 Channel 1 Channel 2 Channel 3 DAC channels at midscale Figure 6-15. Voltage Output TUE vs Supply Voltage www.ti.com DAC63004, DAC53004 SLASEX2A – APRIL 2021 – REVISED DECEMBER 2021 Copyright © 2021 Texas Instruments Incorporated Submit Document Feedback 15 Product Folder Links: DAC63004 DAC53004

at TA = 25°C, VDD = 5.5 V, external reference = 5.5 V, gain = 1x, 12-bit resolution, and DAC outputs unloaded (unless otherwise noted) Temperature (  C) Voltage Output Offset Error (%FSR) -40 -25 -10 5 20 35 50 65 80 95 110 125 -0.5 -0.4 -0.3 -0.2 -0.1 0.1 0.2 0.3 0.4 0.5 Channel 0 Channel 1 Channel 2 Channel 3 Figure 6-16. Voltage Output Offset Error vs Temperature Temperature (  C) Voltage Output Gain Error (%FSR) -40 -25 -10 5 20 35 50 65 80 95 110 125 -0.5 -0.4 -0.3 -0.2 -0.1 0.1 0.2 0.3 0.4 0.5 Channel 0 Channel 1 Channel 2 Channel 3 Figure 6-17. Voltage Output Gain Error vs Temperature Load Current (mA) Voltage Output (V) 2.74 2.742 2.744 2.746 2.748 2.75 2.752 2.754 2.756 2.758 2.76 Channel 0 Channel 1 Channel 2 Channel 3 DAC channels at midscale Figure 6-18. Voltage Output vs Load Current Time (  s) 0 10 20 30 40 50 LDAC (1 V/div) V OUT (1 LSB/div) Figure 6-19. Voltage Output Code-to-Code Glitch - Rising Edge Time (  s) 0 10 20 30 40 50 LDAC (1 V/div) V OUT (1 LSB/div) Figure 6-20. Voltage Output Code-to-Code Glitch - Falling Edge Time (  s) 0 10 20 30 40 50 Trigger (1 V/div) V OUT (1 V/div) Settling Band (+10% FSR) Settling Band (-10% FSR) Zero scale to full scale swing Figure 6-21. Voltage Output Setting Time - Rising Edge DAC63004, DAC53004 SLASEX2A – APRIL 2021 – REVISED DECEMBER 2021 www.ti.com

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at TA = 25°C, VDD = 5.5 V, external reference = 5.5 V, gain = 1x, 12-bit resolution, and DAC outputs unloaded (unless otherwise noted) Time (  s) 0 10 20 30 40 50 Trigger (1 V/div) V OUT (1 V/div) Settling Band (+10% FSR) Settling Band (-10% FSR) Full scale to zero scale swing Figure 6-22. Voltage Output Setting Time - Falling Edge Time (  s) 0 200 400 600 800 1000 1200 1400 1600 V DD (1 V/div) V OUT (15 mV/div) DAC in Hi-Z power-down mode Figure 6-23. Voltage Output Power-On Glitch Time (  s) 0 200 400 600 800 1000 1200 1400 1600 V DD (1 V/div) V OUT (1 mV/div) DAC at zero scale Figure 6-24. Voltage Output Power-Off Glitch Time (  s) 0 5 10 15 20 25 30 35 40 CH0 (1 V/div) CH1 (1 V/div) CH2 (1 mV/div) CH3 (1 V/div) Channel 2 is victim, all other channels are aggressors Figure 6-25. Voltage Output Channel-to-Channel Crosstalk Frequency (Hz) Noise Density ( V/ Hz) 10 20 30 50 100 200 500 1000 10000 100000 0.3 0.6 0.9 1.2 1.5 1.8 2.1 2.4 2.7 Internal reference, gain = 4x Figure 6-26. Voltage Output Noise Density Frequency (Hz) Noise Density ( V/ Hz) 10 20 30 50 100 200 500 1000 10000 100000 0.2 0.4 0.6 0.8 1.2 1.4 1.6 1.8 Figure 6-27. Voltage Output Noise Density www.ti.com DAC63004, DAC53004 SLASEX2A – APRIL 2021 – REVISED DECEMBER 2021 Copyright © 2021 Texas Instruments Incorporated Submit Document Feedback 17 Product Folder Links: DAC63004 DAC53004

at TA = 25°C, VDD = 5.5 V, external reference = 5.5 V, gain = 1x, 12-bit resolution, and DAC outputs unloaded (unless otherwise noted) Time (s) Noise Voltage (  V) 0 1 2 3 4 5 6 7 8 9 10 -35 -30 -25 -20 -15 -10 Internal reference, gain = 4x, f = 0.1 Hz to 10 Hz Figure 6-28. Voltage Output Flicker Noise Time (s) Noise Voltage (  V) 0 1 2 3 4 5 6 7 8 9 10 -25 -20 -15 -10 f = 0.1 Hz to 10 Hz Figure 6-29. Voltage Output Flicker Noise Frequency (Hz) AC Power-Supply Rejection Ratio (dB) 10 20 30 50 100 200 500 1000 10000 100000 -70 -60 -50 -40 -30 -20 -10 Figure 6-30. Voltage Output AC PSRR vs Frequency DAC63004, DAC53004 SLASEX2A – APRIL 2021 – REVISED DECEMBER 2021 www.ti.com

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6.18 Typical Characteristics: Current Output

at TA = 25°C, VDD = 5.5 V, output range: ±250 μA (unless otherwise noted) Code Current Output INL (LSB) 0 32 64 96 128 160 192 224 255 -0.8 -0.6 -0.4 -0.2 0.2 0.4 0.6 0.8 Channel 0 Channel 1 Channel 2 Channel 3 Figure 6-31. Current Output INL vs Digital Input Code Code Current Output INL (LSB) 0 32 64 96 128 160 192 224 255 -0.8 -0.6 -0.4 -0.2 0.2 0.4 0.6 0.8 Channel 0 Channel 1 Channel 2 Channel 3 Output range: 0 μA to 250 μA Figure 6-32. Current Output INL vs Digital Input Code Code Current Output INL (LSB) 0 32 64 96 128 160 192 224 255 -0.8 -0.6 -0.4 -0.2 0.2 0.4 0.6 0.8 Channel 0 Channel 1 Channel 2 Channel 3 Output range: 0 μA to –240 μA Figure 6-33. Current Output INL vs Digital Input Code Temperature (  C) Current Output INL (LSB) -40 -25 -10 5 20 35 50 65 80 95 110 125 -0.8 -0.6 -0.4 -0.2 0.2 0.4 0.6 0.8 CH0 MAX CH1 MAX CH2 MAX CH3 MAX CH0 MIN CH1 MIN CH2 MIN CH3 MIN Figure 6-34. Current Output INL vs Temperature Supply Voltage (V) Current Output INL (LSB) -0.8 -0.6 -0.4 -0.2 0.2 0.4 0.6 0.8 CH0 MAX CH1 MAX CH2 MAX CH3 MAX CH0 MIN CH1 MIN CH2 MIN CH3 MIN Figure 6-35. Current Output INL vs Supply Voltage Code Current Output DNL (LSB) 0 32 64 96 128 160 192 224 255 -0.8 -0.6 -0.4 -0.2 0.2 0.4 0.6 0.8 Channel 0 Channel 1 Channel 2 Channel 3 Figure 6-36. Current Output DNL vs Digital Input Code www.ti.com DAC63004, DAC53004 SLASEX2A – APRIL 2021 – REVISED DECEMBER 2021 Copyright © 2021 Texas Instruments Incorporated Submit Document Feedback 19 Product Folder Links: DAC63004 DAC53004

6.18 Typical Characteristics: Current Output (continued)

at TA = 25°C, VDD = 5.5 V, output range: ±250 μA (unless otherwise noted) Code Current Output DNL (LSB) 0 32 64 96 128 160 192 224 255 -0.8 -0.6 -0.4 -0.2 0.2 0.4 0.6 0.8 Channel 0 Channel 1 Channel 2 Channel 3 Output range: 0 μA to 250 μA Figure 6-37. Current Output DNL vs Digital Input Code Code Current Output DNL (LSB) 0 32 64 96 128 160 192 224 255 -0.8 -0.6 -0.4 -0.2 0.2 0.4 0.6 0.8 Channel 0 Channel 1 Channel 2 Channel 3 Output range: 0 μA to –240 μA Figure 6-38. Current Output DNL vs Digital Input Code Temperature (  C) Current Output DNL (LSB) -40 -25 -10 5 20 35 50 65 80 95 110 125 -0.8 -0.6 -0.4 -0.2 0.2 0.4 0.6 0.8 CH0 MAX CH1 MAX CH2 MAX CH3 MAX CH0 MIN CH1 MIN CH2 MIN CH3 MIN Figure 6-39. Current Output DNL vs Temperature Figure 6-40. Current Output DNL vs Supply Voltage Code Current Output TUE (%FSR) 0 32 64 96 128 160 192 224 255 -1.6 -1.2 -0.8 -0.4 0.4 0.8 1.2 1.6 Channel 0 Channel 1 Channel 2 Channel 3 Figure 6-41. Current Output TUE vs Digital Input Code Code Current Output TUE (%FSR) 0 32 64 96 128 160 192 224 255 -6.4 -4.8 -3.2 -1.6 1.6 3.2 4.8 6.4 Channel 0 Channel 1 Channel 2 Channel 3 Output range: 0 μA to 250 μA Figure 6-42. Current Output TUE vs Digital Input Code DAC63004, DAC53004 SLASEX2A – APRIL 2021 – REVISED DECEMBER 2021 www.ti.com

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at TA = 25°C, VDD = 5.5 V, output range: ±250 μA (unless otherwise noted) Code Current Output TUE (%FSR) 0 32 64 96 128 160 192 224 255 -10 Channel 0 Channel 1 Channel 2 Channel 3 Output range: 0 μA to –240 μA Figure 6-43. Current Output TUE vs Digital Input Code Temperature (  C) Current Output TUE (%FSR) -40 -25 -10 5 20 35 50 65 80 95 110 125 -1.6 -1.2 -0.8 -0.4 0.4 0.8 1.2 1.6 Channel 0 Channel 1 Channel 2 Channel 3 DAC channels at midscale Figure 6-44. Current Output TUE vs Temperature Supply Voltage (V) Current Output TUE (%FSR) -1.6 -1.2 -0.8 -0.4 0.4 0.8 1.2 1.6 Channel 0 Channel 1 Channel 2 Channel 3 DAC channels at midscale Figure 6-45. Current Output TUE vs Supply Voltage Temperature (  C) Current Output Offset Error (%FSR) -40 -25 -10 5 20 35 50 65 80 95 110 125 -1.5 -1.2 -0.9 -0.6 -0.3 0.3 0.6 0.9 1.2 1.5 Channel 0 Channel 1 Channel 2 Channel 3 Figure 6-46. Current Output Offset Error vs Temperature Temperature (  C) Current Output Gain Error (%FSR) -40 -25 -10 5 20 35 50 65 80 95 110 125 -1.5 -1.2 -0.9 -0.6 -0.3 0.3 0.6 0.9 1.2 1.5 Channel 0 Channel 1 Channel 2 Channel 3 Figure 6-47. Current Output Gain Error vs Temperature Load Voltage (V) Current Output ( A) -1000 -800 -600 -400 -200 200 400 600 800 1000 CH0, DAC Code = 0 CH1, DAC Code = 0 CH2, DAC Code = 0 CH3, DAC Code = 0 CH0, DAC Code = 255 CH1, DAC Code = 255 CH2, DAC Code = 255 CH3, DAC Code = 255 Figure 6-48. Current Output vs Load Voltage www.ti.com DAC63004, DAC53004 SLASEX2A – APRIL 2021 – REVISED DECEMBER 2021 Copyright © 2021 Texas Instruments Incorporated Submit Document Feedback 21 Product Folder Links: DAC63004 DAC53004

at TA = 25°C, VDD = 5.5 V, output range: ±250 μA (unless otherwise noted) Time (  s) 0 10 20 30 40 50 Trigger (1 V/div) I OUT (Zoomed, 10  A/div) Settling Band ( − 1 LSB) Settling Band (+1 LSB) Figure 6-49. Current Output Setting Time, Rising Edge Time (  s) 0 10 20 30 40 50 Trigger (1 V/div) I OUT (Zoomed, 10  A/div) Settling Band ( − 1 LSB) Settling Band (+1 LSB) Figure 6-50. Current Output Setting Time, Falling Edge Time (  s) 0 500 1000 1500 2000 2500 3000 V DD (1 V/div) I OUT (20  A/div) DAC at mid scale (0 μA) stored in EEPROM Figure 6-51. Current Output Power-On Glitch Time (  s) 0 500 1000 1500 2000 2500 3000 V DD ( 1 V/div) I OUT (40  A/div) DAC at mid scale (0 μA) Figure 6-52. Current Output Power-Off Glitch Time (  s) 0 100 200 300 400 500 600 700 800 900 1000 Channel 1 (100  A/div) Channel 2 (100  A/div) Channel 3 (100  A/div) Channel 4 (0.4  A/div) Channel 4 is victim, all other channels are aggressors Figure 6-53. Current Output Channel-to-Channel Crosstalk Frequency (Hz) AC Power-Supply Rejection Ratio (LSB/V) 10 20 30 50 100 200 500 1000 2000 10000 3000030000 0.2 0.5 100 200 500 Figure 6-54. Current Output AC PSRR vs Frequency DAC63004, DAC53004 SLASEX2A – APRIL 2021 – REVISED DECEMBER 2021 www.ti.com

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at TA = 25°C, VDD = 5.5 V, output range: ±250 μA (unless otherwise noted) Frequency (Hz) Noise Density (nA/ Hz) 10 20 30 50 100 200 500 1000 10000 100000 0.2 0.4 0.6 0.8 Output range: 0 μA to 250 μA Figure 6-55. Current Output Noise Density Frequency (Hz) Noise Density (nA/ Hz) 10 20 30 50 100 200 500 1000 10000 100000 0.2 0.4 0.6 0.8 1.2 1.4 1.6 1.8 Figure 6-56. Current Output Noise Density Output range: 0 μA to 250 μA, f = 0.1 Hz to 10 Hz Figure 6-57. Current Output Flicker Noise Time (s) Noise Current (nA) 0 1 2 3 4 5 6 7 8 9 10 -25 -20 -15 -10 f = 0.1 Hz to 10 Hz Figure 6-58. Current Output Flicker Noise www.ti.com DAC63004, DAC53004 SLASEX2A – APRIL 2021 – REVISED DECEMBER 2021 Copyright © 2021 Texas Instruments Incorporated Submit Document Feedback 23 Product Folder Links: DAC63004 DAC53004

6.19 Typical Characteristics: Comparator

at TA = 25°C, VDD = 5.5 V, external reference = 5.5 V, gain = 1x, 12-bit resolution, FBx pin in Hi-Z mode, and DAC outputs unloaded (unless otherwise noted) Time (  s) 0 2 4 6 8 10 V OUT (1 V/div) V FB (1 LSB/div) Comparator output in push-pull mode Figure 6-59. Comparator Response Time: Low‑to‑High Transition Time (  s) 0 2 4 6 8 10 V OUT (1 V/div) V FB (1 LSB/div) Comparator output in push-pull mode Figure 6-60. Comparator Response Time: High‑to‑Low Transition Temperature (  C) Comparator Offset Error (mV) -40 -25 -10 5 20 35 50 65 80 95 110 125 Channel 0 Channel 1 Channel 2 Channel 3 Figure 6-61. Comparator Offset Error vs Temperature DAC63004, DAC53004 SLASEX2A – APRIL 2021 – REVISED DECEMBER 2021 www.ti.com

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6.20 Typical Characteristics: General

at TA = 25°C, VDD = 5.5 V, and DAC outputs unloaded (unless otherwise noted) Temperature ( C) Internal Reference (V) -40 -25 -10 5 20 35 50 65 80 95 110 125 1.21 1.211 1.212 1.213 1.214 1.215 1.216 1.217 1.218 1.219 1.22 Internal reference Figure 6-62. Internal Reference vs Temperature Supply Voltage (V) Internal Reference (V) 1.213 1.213014 1.213028 1.213042 1.213056 1.21307 1.213084 1.213098 1.213112 1.213126 1.21314 Internal reference Figure 6-63. Internal Reference vs Supply Voltage Temperature (  C) Sleep Mode PD Current (  A) -40 -25 -10 5 20 35 50 65 80 95 110 125 V DD = 1.8 V V DD = 3.3 V V DD = 5.5 V Sleep mode, internal reference disabled Figure 6-64. Power-Down Current vs Temperature Temperature (  C) Deep-Sleep Mode PD Current ( A) -40 -25 -10 5 20 35 50 65 80 95 110 125 0.5 1.5 2.5 V DD = 1.8 V V DD = 3.3 V V DD = 5.5 V Deep-sleep mode Figure 6-65. Power-Down Current vs Temperature External Capacitance on CAP Pin (  F) Boot-up Time (ms) Figure 6-66. Boot-up Time vs Capacitance on CAP pin www.ti.com DAC63004, DAC53004 SLASEX2A – APRIL 2021 – REVISED DECEMBER 2021 Copyright © 2021 Texas Instruments Incorporated Submit Document Feedback 25 Product Folder Links: DAC63004 DAC53004

7 Detailed Description

7.1 Overview

The 12-bit DAC63004 and 10-bit DAC53004 (DACx3004) are a pin-compatible family of ultra-low-power, quad-channel, buffered voltage-output and current-output, smart digital-to-analog converters (DACs). The DAC channels are independently configurable as voltage output or current output. The DAC outputs change to Hi-Z when VDD is off; a feature useful in voltage-margining applications. These smart DACs contain nonvolatile memory (NVM), an internal reference, automatically detectable I 2C and SPI interface, PMBus-compatibility in I2C mode, a force-sense output, and a general-purpose input/output. These devices support Hi-Z power-down modes by default, which can also be configured to 10 k Ω-GND or 100 kΩ-GND using the NVM. The DACx3004 have a power-on-reset (POR) circuit that makes sure all the registers start with default or user-programmed settings using NVM. The DACx3004 operate with either an internal reference, external reference, or with a power supply as the reference, and provide a full-scale output between 1.8 V and 5.5 V. The DACx3004 devices support I 2C standard mode (100 kbps), fast mode (400 kbps), and fast mode plus (1 Mbps). The I 2C interface can be configured with four target addresses using the A0 pin. These devices also support specific PMBus commands such as turn on/off , margin high or low , and more. SPI mode supports a three-wire interface by default, with up to a 50-MHz SCLK input. The GPIO input can be configured as SDO in the NVM for SPI read capability. The GPIO input can also be configured as FAULT-DUMP, LDAC, PD, PROTECT, RESET, and STATUS functions. These devices support deep-sleep mode in addition to sleep (power-down) mode. Deep-sleep mode uses the GPIO pin for power-down and wake up, in which the device draws a very-low power-down current of 3 μA. Together with ultra-low-power operation, the DACx3004 are designed for battery-operated applications, such as land mobile radios, medical pulse oximeters, and laptops. The DACx3004 also include digital slew rate control, and support standard waveform generation such as sine and cosine, triangular, and sawtooth. These devices can generate pulse-width modulation (PWM) output with the combination of the triangular or sawtooth waveform and the FB pin. The force-sense outputs of the DAC channels can be used as programmable comparators. Comparator mode allows programmable hysteresis, latching comparator, and window comparator. These features enable the DACx3004 to go beyond the limitations of a conventional DAC that depends on a processor to function. As a result of processor-less operation and the smart feature set, the DACx3004 are called smart DACs.

7.2 Functional Block Diagram

Figure 7-1. Functional Block Diagram DAC63004, DAC53004 SLASEX2A – APRIL 2021 – REVISED DECEMBER 2021 www.ti.com

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7.3 Feature Description

7.3.1 Smart Digital-to-Analog Converter (DAC) Architecture

The DACx3004 devices consist of string architecture with a voltage-output amplifier and an external FB pin and voltage-to-current converter for each channel. Section 7.2 shows the DAC architecture within the block diagram, is an option to select an external reference on the VREF pin or the power supply as a reference. The voltage output mode uses one of these three reference options. The current output mode uses an internal band gap to generate the current outputs. Both the voltage- and current-output modes support multiple programmable output ranges. The DACx3004 devices support Hi-Z output when VDD is off, maintaining very low leakage current at the output pins with up to 1.25 V of forced voltage. The DAC output pin also starts up in high-impedance mode by default, making these devices an excellent choice for voltage margining and scaling applications. To change the power-up mode to 10 k Ω-GND or 100 k Ω-GND, program the corresponding VOUT-PDN-X field in the COMMON-CONFIG register and load these bits in the device NVM. The DACx3004 devices support an independent comparator mode for each channel. The respective FBx pins act as the inputs for the comparator. The DAC architecture supports inversion of the comparator output using register settings. The comparator outputs can be push-pull or open-drain. The comparator mode supports programmable hysteresis using margin-high and margin-low register fields, latching comparator, and window comparator. The comparator outputs are accessible internally by the device. The DACx3004 devices include a smart feature set to enable processor-less operation and high-integration. The NVM enables a predictable start-up. The GPIO triggers the DAC output without the I 2C interface in the absence of a processor or when the processor or software fails. The integrated functions and the FBx pin enable PWM output for control applications. The FBx pin enables this device to be used as a programmable comparator. The digital slew-rate control and the Hi-Z power-down modes enable a hassle-free voltage margining and scaling function.

7.3.2 Digital Input/Output

The DACx3004 have four digital IO pins that include I 2C, SPI, PMBus, and GPIO interfaces. These devices automatically detect I 2C and SPI protocols at the first successful communication after power-on, and then connect to the detected interface. After an interface protocol is connected, any change in the protocol is ignored. The I 2C interface uses the A0 pin to select from among four address options. The SPI interface is a 3-wire interface by default. No readback capability is available in this mode. The GPIO pin can be configured in the register map and then programmed in to the NVM as the SDO pin. The SPI readback mode is slower than the write mode. The programming interface pins are:

• I2C: SCL, SDA, A0
• SPI: SCLK, SDI, SYNC, SDO/GPIO The GPIO can be configured as multiple functions other than SDO. These are LDAC, PD, STATUS, PROTECT, FAULT-DUMP, and RESET. All the digital pins are open-drain when used as outputs. Therefore, all the output pins must be pulled up to the desired IO voltage using external resistors. www.ti.com DAC63004, DAC53004 SLASEX2A – APRIL 2021 – REVISED DECEMBER 2021 Copyright © 2021 Texas Instruments Incorporated Submit Document Feedback 27 Product Folder Links: DAC63004 DAC53004

7.3.3 Nonvolatile Memory (NVM)

The DACx3004 contain nonvolatile memory (NVM) bits. These memory bits are user programmable and erasable, and retain the set values in the absence of a power supply. All the register bits, as shown in the highlighted gray cells in Table 7-20, can be stored in the NVM by setting NVM-PROG = 1 in the COMMON- TRIGGER register. The NVM-PROG is an autoresetting bit. The default values for all the registers in the DACx3004 are loaded from NVM as soon as a POR event is issued. The DACx3004 also implement NVM-RELOAD bit in the COMMON-TRIGGER register. Set this bit to 1 for the device to start an NVM-reload operation. After completion, the device autoresets the NVM-RELOAD bit to 0. During the NVM write or reload operation, all read/write operations to the device are blocked. Section 6.8 provides the timing specification for the NVM write cycle. The processor must wait for the specified duration before resuming any read or write operation on the SPI or I2C interface.

7.3.4 Power Consumption

The power consumption of the DACx3004 in sleep mode and deep-sleep mode are provided in Section 6.20. In normal operation, the total power consumption of the device depends on the number of channels powered on and the output mode of each channel (voltage or current). In current-output mode, the I DD also depends on the output range. The I DD calculation excludes the load current. For example, in the ±250 μA output mode with a DAC setting of +125 μA, the total current drawn through the VDD pin is the total I DD plus 125 μA. The total IDD in normal operation can be calculated using Equation 1. P NORMAL _ MODE = V DD × I D D _ S L EE P + I DD _ RE F + ∑ X = 0

3 V D D × I DD _ X (1)

where:

• IDD_SLEEP is the current through VDD in sleep mode when all the channels and internal reference are powered down.
• IDD_REF is the reference current, which is: – either the current drawn by the reference input impedance when VDD is used as reference – or the current drawn by the internal reference, if enabled
• IDD_X is the current through VDD for every powered-on channel-X. Note When an external reference is used, the current is calculated mainly as the current sourced from the external reference, which is equal to the reference voltage divided by the input impedance of the VREF pin. DAC63004, DAC53004 SLASEX2A – APRIL 2021 – REVISED DECEMBER 2021 www.ti.com

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7.4 Device Functional Modes

7.4.1 Voltage-Output Mode

The voltage-output mode for each DAC channel can be entered by selecting the power-up option in the VOUT- PDN-X fields in the COMMON-CONFIG register and simultaneously powering down the current output option for the respective channels using the IOUT-PDN-X bits in the same register. Short the OUTx and FBx pins of respective channels externally for closed-loop amplifier output. An open FBx pin saturates the amplifier output. To achieve the desired voltage output, select the correct reference option, select the amplifier gain for the required output range, and program the DAC code in the DAC-X-DATA register of the respective channels.

7.4.1.1 Voltage Reference and DAC Transfer Function

There are three voltage reference options possible with the DACx3004: internal reference, external reference, and the power supply as reference, as shown in Figure 7-2. The DAC transfer function in the voltage-output and comparator modes changes based on the voltage reference selection. Internal Reference VREFVDD MUX Digital IO VOUT-GAIN-X DIS-MODE-IN EN-INT-REF DAC Ladder + OUTx FBx CMP-X-HIZ-IN-DIS or VOUT-PDN-X (Hi-Z) VOUT-PDN-X Internal Bandgap IOUT-PDN-X IOUT-RANGE-X 10k /100k AGND IOUT-PDN-X VOUT-PDN-X Figure 7-2. Voltage Reference Selection and Power-Down Logic

7.4.1.1.1 Internal Reference

The DACx3004 contain an internal reference that is disabled by default. To enable the internal reference, write 1 to bit EN-INT-REF in the COMMON-CONFIG register. The internal reference generates a fixed 1.21-V voltage (typical). Use the VOUT-GAIN-X bit in the DAC-X-VOUT-CMP-CONFIG register to achieve gains of 1.5x, 2x, 3x, or 4x for the DAC output voltage (VOUT). Equation 2 shows DAC transfer function using the internal reference. V OUT = DAC _ DATA

2 N × V REF × GAIN (2)

where:

• N is the resolution in bits, 10 (DAC53004), or 12 (DAC63004).
• DAC_DATA is the decimal equivalent of the binary code that is loaded to the DAC-X-DATA bit in the DAC-X-DATA register. DAC_DATA ranges from 0 to 2N – 1.
• VREF is the internal reference voltage = 1.21 V (typical).
• GAIN = 1.5x, 2x, 3x, or 4x, based on VOUT-X-GAIN bits. www.ti.com DAC63004, DAC53004 SLASEX2A – APRIL 2021 – REVISED DECEMBER 2021 Copyright © 2021 Texas Instruments Incorporated Submit Document Feedback 29 Product Folder Links: DAC63004 DAC53004

7.4.1.1.2 External Reference

By default, the DACx3004 operate from an external reference input. The external reference option can also be selected by configuring the VOUT-GAIN-X field in the DAC-X-VOUT-CMP-CONFIG register appropriately. Write 1 to the DIS-MODE-IN bit in the DEVICE-MODE-CONFIG register to minimize I DD. The external reference can be between 1.7 V and VDD. Equation 3 shows DAC transfer function when the external reference is used. The gain at the output stage of the DAC is always 1x in the external reference mode. Note The external reference must be less than VDD in both transient and steady-state conditions. Therefore, the external reference must ramp up after VDD and ramp down before VDD. V OUT = DAC _ DATA

2 N × V REF (3)

where:

• N is the resolution in bits, 10 (DAC53004), or 12 (DAC63004).
• DAC_DATA is the decimal equivalent of the binary code that is loaded to the DAC-X-DATA field in the DAC-X-DATA register. DAC_DATA ranges from 0 to 2N – 1.
• VREF is the external reference voltage.

7.4.1.1.3 Power-Supply as Reference

The DACx3004 can operate with the power-supply pin (VDD) as a reference. Equation 4 shows DAC transfer function when the power-supply pin is used as reference. The gain at the output stage is always 1x. V OUT = DAC _ DATA

2 N × V DD (4)

where:

• N is the resolution in bits, either 10 (DAC53004), or 12 (DAC63004).
• DAC_DATA is the decimal equivalent of the binary code that is loaded to the DAC-X-DATA bit in the DAC-X-DATA register.
• DAC_DATA ranges from 0 to 2N – 1.
• VDD is used as the DAC reference voltage.

7.4.2 Current-Output Mode

To enter current-output mode for each DAC channel, disable the respective IOUT-PDN-X bits in the COMMON- CONFIG register, and set the respective VOUT-PDN-X bits in the same register to Hi-Z power-down mode. Select the desired current-output range by writing to the IOUT-RANGE-X bit in the DAC-X-IOUT-MISC-CONFIG register. To minimize leakage in current-output mode, disconnect the FBx pin. For the best power-on glitch performance, program the NVM with IOUT mode using the smallest output range before powering on the output channel, and then immediately program the DAC code and desired output range. The transfer function of the output current is shown in Equation 5. I O UT = D AC _ D ATA × I M AX − I MIN 2 8 + I MIN (5) where:

• DAC_DATA is the decimal equivalent of the binary code that is loaded to the DAC-X-DATA bit as specified in Section 7.6.8. DAC_DATA ranges from 0 to 255.
• IMAX is the signed maximum current in the IOUT-RANGE-X setting as specified in Section 7.6.5.
• IMIN is the signed minimum current in the IOUT-RANGE-X setting as specified in Section 7.6.5. DAC63004, DAC53004 SLASEX2A – APRIL 2021 – REVISED DECEMBER 2021 www.ti.com

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7.4.3 Comparator Mode

All the DAC channels can be configured as programmable comparators in the voltage-output mode. To enter the comparator mode for a channel, write 1 to the CMP-X-EN bit in the respective DAC-X-VOUT-CMP-CONFIG register. The comparator output can be configured as push-pull or open-drain using the CMP-X-OD-EN bit. To enable the comparator output on the output pin, write 1 to the CMP-X-OUT-EN bit. To invert the comparator output, write 1 to the CMP-X-INV-EN bit. The FBx pin has a finite impedance. By default, the FBx pin is in the high-impedance mode. To disable high-impedance on the FBx pin, write 1 to the CMP-X-HIZ-IN-DIS bit. Table 7-1 shows the comparator output at the pin for different bit settings. Note In the Hi-Z input mode, the comparator input range is limited to:

• For GAIN = 1x, 1.5x, or 2x: VFB ≤ (VREF × GAIN) / 3
• For GAIN = 3x, or 4x: VFB ≤ (VREF × GAIN) / 6 Any higher input voltage is clipped. Table 7-1. Comparator Output Configuration CMP-X-EN CMP-X-OUT-EN CMP-X-OD-EN CMP-X-INV-EN CMPX-OUT PIN

0 X X X Comparator not enabled

1 1 0 1 Push-pull and inverted output 1 1 1 0 Open-drain output 1 1 1 1 Open-drain and inverted output Figure 7-3 shows the interface circuit when all the DAC channels are configured as comparators. The programmable comparator operation is as shown in Figure 7-4 . Individual comparator channels can be configured in no-hysteresis, with-hysteresis, and window-comparator modes using the CMP-X-MODE bit in the respective DAC-X-CMP-MODE-CONFIG register, as shown in Table 7-2. A0/SDI GPIO/SDO VDD SCL/SYNC SDA/SCLK AGND 0.1 μF 1.5 μF CAPVDDVREF 10 k CMP3 CMP2 FB2/AIN2 CMP2-OUT CMP0 FB0/AIN0 CMP1 FB1/AIN1 VIO 10 k (0 V to VFS/3 or 0 V to VFS) (0 V to VFS/3 or 0 V to VFS) (0 V to VFS/3 or 0 V to VFS)(0 V to VFS/3 or 0 V to VFS) FB3/AIN3 CMP3-OUT CMP0-OUT CMP1-OUT Figure 7-3. Comparator Interface www.ti.com DAC63004, DAC53004 SLASEX2A – APRIL 2021 – REVISED DECEMBER 2021 Copyright © 2021 Texas Instruments Incorporated Submit Document Feedback 31 Product Folder Links: DAC63004 DAC53004

CMP-X-INV-EN = 0 CMP-X-INV-EN = 1 Figure 7-4. Programmable Comparator Operation Table 7-2. Comparator Mode Selection CMP-X-MODE BIT FIELD COMPARATOR CONFIGURATION 00 Normal comparator mode. No hysteresis or window operation. 01 Hysteresis comparator mode. DAC-X-MARGIN-HIGH and DAC-X-MARGIN-LOW registers set the hysteresis. 10 Window comparator mode. DAC-X-MARGIN-HIGH and DAC-X-MARGIN-LOW registers set the window bounds.

11 Invalid setting

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7.4.3.1 Programmable Hysteresis Comparator

Comparator mode provides hysteresis when the CMP-X-MODE bit is set to 01b, as shown in Table 7-2. The hysteresis is provided by the DAC-X-MARGIN-HIGH and DAC-X-MARGIN-LOW registers, as shown in Figure 7-5. When the DAC-X-MARGIN-HIGH is set to full-code or the DAC-X-MARGIN-LOW is set to zero-code, the comparator works as a latching comparator that is, the output is latched after the threshold is crossed. The latched output can be reset by writing to the corresponding RST-CMP-FLAG-X bit in the COMMON-DAC-TRIG register. Figure 7-6 shows the behavior of a latching comparator with active low output and Figure 7-7 shows the behavior of a latching comparator with active high output. Note The value of the DAC-X-MARGIN-HIGH register must be greater than the value of the DAC-X- MARGIN-LOW register. The comparator output in the hysteresis mode can only be noninverting that is, the CMP-X-INV-EN bit in the DAC-X-VOUT-CMP-CONFIG register must be set to 0. In latching mode, for the reset to take effect, the input voltage must be within DAC-X-MARGIN-HIGH and DAC-X- MARGIN-LOW. DAC-X-MARGIN-HIGH DAC-X-MARGIN-LOW OUT-X FBx/AINx CMP-X-INV-EN = 0 Hysteresis Figure 7-5. Programmable Hysteresis Without Latching Output DAC-X-MARGIN-HIGH DAC-X-MARGIN-LOW (ZERO-CODE) OUT-X FBx/AINx CMP-X-INV-EN = 0 RST-CMP-FLAG-X Figure 7-6. Latching Comparator With Active Low Output DAC-X-MARGIN-HIGH (FULL-CODE) DAC-X-MARGIN-LOW OUT-X FBx/AINx CMP-X-INV-EN = 0 RST-CMP-FLAG-X Figure 7-7. Latching Comparator With Active High Output www.ti.com DAC63004, DAC53004 SLASEX2A – APRIL 2021 – REVISED DECEMBER 2021 Copyright © 2021 Texas Instruments Incorporated Submit Document Feedback 33 Product Folder Links: DAC63004 DAC53004

7.4.3.2 Programmable Window Comparator

Window comparator mode is enabled by setting the CMP-X-MODE bit to 10b, as shown in Table 7-2. The window bounds are set by the DAC-X-MARGIN-HIGH and the DAC-X-MARGIN-LOW registers, as shown in Figure 7-8. The output of the window comparator for a given channel is indicated by the respective WIN-CMP-X bit in the CMP-STATUS register. The comparator output (WIN-CMP-X) can be latched by writing 1 to the WIN-LATCH-EN bit in the COMMON-CONFIG register. After being latched, the comparator output can be reset using the corresponding RST-CMP-FLAG-X bit in the COMMON-DAC-TRIG register. For the reset to take effect, the input must be within the window bounds. DAC-X-MARGIN-HIGH DAC-X-MARGIN-LOW WIN-CMP-X WIN-CMP-X FBx/AINx RST-CMP-FLAG-X WIN-LATCH-EN = 0 WIN-LATCH-EN = 1 Figure 7-8. Window Comparator Operation A single comparator is used per channel to check both the margin-high and margin-low limits of the window. Therefore, the window comparator function has a finite response time as specified in Section 6.7. Also, the static behavior of the WIN-CMP-X bit is not reflected at the output pins. Set the CMP-X-OUT-EN bit to 0. The WIN-CMP-X bit must be read digitally using the communication interface. This bit can also be mapped to the GPIO pin, as shown in Table 7-19. Note

• The value of the DAC-X-MARGIN-HIGH register must be greater than that of the DAC-X-MARGIN- LOW register.
• Set the SLEW-RATE-X bit to 0000b (no-slew) and LOG-SLEW-EN-X bit to 0b in the DAC-X-FUNC- CONFIG register to get the best response time from the window comparator.
• The CMP-X-OUT-EN bit in the DAC-X-VOUT-CMP-CONFIG register can be set to 0b to eliminate undesired toggling of the OUT pin.

7.4.4 Fault-Dump Mode

The DACx3004 provides a feature to save a few registers into the NVM when the FAULT-DUMP bit is triggered or the GPIO mapped to fault-dump (as shown in Table 7-18) is triggered. This feature is useful in system-level fault management to capture the state of the device or system just before a fault is triggered, to allow diagnosis after the fault has occurred. The registers saved when fault-dump is triggered, are:

• CMP-STATUS[7:0]
• DAC-0-DATA[15:8]
• DAC-1-DATA[15:8]
• DAC-2-DATA[15:8]
• DAC-3-DATA[15:8] Note When the fault-dump cycle is in progress, any change in the data can corrupt the final outcome. Make sure the comparator and the DAC codes are stable during the NVM write cycle. Table 7-3 shows the storage format of the registers in the NVM. DAC63004, DAC53004 SLASEX2A – APRIL 2021 – REVISED DECEMBER 2021 www.ti.com

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Table 7-3. Fault-Dump NVM Storage Format NVM ROWS B31-B24 B23-B16 B15-B8 B7-B0 Row1 CMP-STATUS[7:0] Don't care Row2 DAC-0-DATA[15:8] DAC-1-DATA[15:8] DAC-2-DATA[15:8] DAC-3-DATA[15:8] The data captured in the NVM after the fault dump can be read in a specific sequence: 1. Set the EE-READ-ADDR bit to 0b in the COMMON-CONFIG register, to select row1 of the NVM. 2. Trigger the read of the selected NVM row by writing 1 to the READ-ONE-TRIG in the COMMON-TRIGGER register; this bit autoresets. This action copies that data from the selected NVM row to SRAM addresses 0x9D (LSB 16 bits from the NVM) and 0x9E (MSB 16 bits from the NVM). 3. To read the SRAM data: a. Write 0x009D to the SRAM-CONFIG register. b. Read the data from the SRAM-DATA register to get the LSB 16 bits. c. Write 0x009E to the SRAM-CONFIG register. d. Read the data from the SRAM-DATA register again to get the MSB bits. 4. Set the EE-READ-ADDR bit to 1b in the COMMON-CONFIG register, to select row2 of the NVM. Repeat steps 2 and 3.

7.4.5 Application-Specific Modes

This section provides the details of application-specific functional modes available in DACx3004.

7.4.5.1 Voltage Margining and Scaling

Voltage margining or scaling is a primary application for DACx3004. This section provides specific features available for this application such as Hi-Z output, slew-rate control, PROTECT input, and PMBus compatibility.

7.4.5.1.1 High-Impedance Output and PROTECT Input

All the DAC output channels remain in high-impedance (Hi-Z) when VDD is off. Figure 7-9 shows a simplified schematic of DACx3004 used in a voltage-margining application. The series resistor R S is needed in voltage- output mode, but is optional in current-output mode. Almost all linear regulators and DC/DC converters have a feedback voltage of ≤ 1.25 V. The low-leakage currents at the outputs are maintained for V FB of ≤ 1.25 V. Thus, for all practical purposes, the DAC outputs appear as Hi-Z when VDD of the DAC is off in voltage margining and scaling applications. This feature allows for seamless integration of the DACx3004 into a system without any need for additional power-supply sequencing for the DAC. DAC VINVREG RS VFB Linear Regulator or DC/DC Converter VDD 1.25 V ZOUT ILEAK PROTECT Figure 7-9. High-Impedance (Hi-Z) Output and PROTECT Input The DAC channels power down to Hi-Z at boot up. The outputs can power up with a preprogrammed code that corresponds to the nominal output of the DC/DC converter or the linear regulator. This feature allows for smooth power up and power down of the DAC without impacting the feedback loop of the DC/DC converter or the linear regulator. The GPIO pin of the DACx3004 can be configured as a PROTECT function, as shown in Table 7-18. PROTECT takes the DAC outputs to a predictable state with a slewed or direct transition. This function is useful in systems where a fault condition (such as a brownout), a subsystem failure, or a software crash requires that the DAC outputs reach a predefined state without the involvement of a processor. The detected event can be fed to the GPIO pin that is configured as the PROTECT input. The PROTECT function can also be triggered using www.ti.com DAC63004, DAC53004 SLASEX2A – APRIL 2021 – REVISED DECEMBER 2021 Copyright © 2021 Texas Instruments Incorporated Submit Document Feedback 35 Product Folder Links: DAC63004 DAC53004

the PROTECT bit in the COMMON-TRIGGER register. Configure the behavior of the PROTECT function in the PROTECT-CONFIG field in the DEVICE-MODE-CONFIG register, as shown in Table 7-4. Note

• After the PROTECT function is triggered, the write functionality is disabled on the communication interface until the function is completed.
• The PROTECT-FLAG bit in the CMP-STATUS register is set to 1 when the PROTECT function is triggered. This bit can be polled by reading the CMP-STATUS register. After the PROTECT function is complete, a read command on the CMP-STATUS register resets the PROTECT-FLAG bit. Table 7-4. PROTECT Function Configuration PROTECT-CONFIG FIELD FUNCTION 00 Switch to Hi-Z power-down (no slew). 01 Switch to DAC code stored in NVM (no slew) and then switch to Hi-Z power-down. 10 Slew to margin-low code and then switch to Hi-Z power-down. 11 Slew to margin-high code and then switch to Hi-Z power-down.

7.4.5.1.2 Programmable Slew-Rate Control

When the DAC data registers are written, the voltage on DAC output (V OUT) immediately transitions to the new code following the slew rate and settling time specified in the Electrical Characteristics. The slew rate control feature allows the user to control the rate at which the output voltage (V OUT) changes. When this feature is enabled (using the SLEW-RATE-X[3:0] bits), the DAC output changes from the current code to the code in the DAC-X-MARGIN-HIGH or DAC-X-MARGIN-LOW registers (when margin high or low commands are issued to the DAC) using the step size and time-period per step set in CODE-STEP-X and SLEW-RATE-X bits in the DAC-X-FUNC-CONFIG register:

• SLEW-RATE-X defines the time-period per step at which the digital slew updates.
• CODE-STEP-X defines the number of LSBs by which the output value changes at each update, for the corresponding channels. Table 7-5 and Table 7-6 show different settings available for CODE-STEP-X and SLEW-RATE-X. With the default slew rate control setting of no-slew, the output changes immediately at a rate limited by the output drive circuitry and the attached load. When the slew rate control feature is used, the output changes happen at the programmed slew rate. This configuration results in a staircase formation at the output as shown in Figure 7-10. Do not write to CODE-STEP- X, SLEW-RATE-X, or DAC-X-DATA during the output slew operation. Equation 6 provides the equation for the calculating the slew time (tSLEW). DAC63004, DAC53004 SLASEX2A – APRIL 2021 – REVISED DECEMBER 2021 www.ti.com

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Figure 7-10. Programmable Slew-Rate Control t SL EW = SL EW _ RATE × MAR G I N _ HIGH − MARGIN _ L O W + 1 C O D E _ STEP (6) where:

• SLEW_RATE is the SLEW-RATE-X setting as specified in Table 7-6.
• CODE_STEP is the CODE-STEP-X setting as specified in Table 7-5.
• MARGIN_HIGH is the DAC-X-MAGIN-HIGH as specified in Section 7.6.2.
• MARGIN_LOW is the DAC-X-MAGIN-LOW as specified in Section 7.6.3. Table 7-5. Code Step REGISTER CODE-STEP-X[2] CODE-STEP-X[1] CODE-STEP-X[0] CODE STEP SIZE DAC-X-FUNC-CONFIG 0 0 0 1 LSB (default) 0 0 1 2 LSB 0 1 0 3 LSB 0 1 1 4 LSB 1 0 0 6 LSB 1 0 1 8 LSB 1 1 0 16 LSB 1 1 1 32 LSB Table 7-6. Slew Rate REGISTER SLEW-RATE-X[3] SLEW-RATE-X[2] SLEW-RATE-X[1] SLEW-RATE-X[0] TIME PERIOD (PER STEP) DAC-X-FUNC-CONFIG 0 0 0 0 No slew (default) 0 0 0 1 4 µs 0 0 1 0 8 µs 0 0 1 1 12 µs 0 1 0 0 18 µs 0 1 0 1 27 µs 0 1 1 0 40.5 µs 0 1 1 1 60.75 µs 1 0 0 0 91.13 µs 1 0 0 1 136.69 µs 1 0 1 0 239.2 µs 1 0 1 1 418.61 µs 1 1 0 0 732.56 µs 1 1 0 1 1281.98 µs 1 1 1 0 2563.96 µs 1 1 1 1 5127.92 µs www.ti.com DAC63004, DAC53004 SLASEX2A – APRIL 2021 – REVISED DECEMBER 2021 Copyright © 2021 Texas Instruments Incorporated Submit Document Feedback 37 Product Folder Links: DAC63004 DAC53004

7.4.5.1.3 PMBus Compatibility Mode

The PMBus protocol is an I 2C-based communication standard for power-supply management. PMBus contains standard command codes tailored to power supply applications. The DACx3004 implement some PMBus commands such as Turn Off, Turn On, Margin Low , Margin High , Communication Failure Alert Bit (CML) , as well as PMBUS revision. Figure 7-11 shows typical PMBus connections. The EN-PMBUS bit in the INTERFACE- CONFIG register must be set to 1 to enable the PMBus protocol. ALERT CONTROL DATA CLOCK ADDRESS WP ALERT CONTROL DATA CLOCK ADDRESS WP ALERT CONTROL DATA CLOCK ADDRESS WP System Host Bus Controller PMBus-compatible device #1 Alert signal Control signal Data Clock Optional Required PMBus-compatible device #2 PMBus-compatible device #3 Figure 7-11. PMBus Connections DAC63004, DAC53004 SLASEX2A – APRIL 2021 – REVISED DECEMBER 2021 www.ti.com

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Similar to I 2C, PMBus is a variable length packet of 8-bit data bytes, each with a receiver acknowledge, wrapped between a start and stop bit. The first byte is always a 7-bit target address followed by a write bit, sometimes called the even address that identifies the intended receiver of the packet. The second byte is an 8-bit command byte, identifying the PMBus command being transmitted using the respective command code. After the command byte, the transmitter either sends data associated with the command to write to the receiver command register (from least significant byte to most significant byte, as shown in Table 7-7), or sends a new start bit indicating the desire to read the data associated with the command register from the receiver. Then the receiver transmits the data following the same least significant byte first format (see Table 7-8). Table 7-7. PMBus Update Sequence Address (A) byte Section 7.5.2.2.1 Command byte Section 7.5.2.2.2 Data byte - LSDB Data byte - MSDB (Optional) Table 7-8. PMBus Read Sequence S MSB … R/W (0) ACK MSB … LSB ACK Sr MSB … R/W (1) ACK MSB … LSB ACK MSB … LSB ACK ADDRESS BYTE Section 7.5.2.2.1 COMMAND BYTE Section 7.5.2.2.2 Sr ADDRESS BYTE Section 7.5.2.2.1 LSDB MSDB (Optional) From Controller Target From Controller Target From Controller Target From Target Controller From Target Controller The DACx3004 I2C interface implements some of the PMBus commands. Table 7-9 shows the supported PMBus commands that are implemented in DACx3004.The DAC uses DAC-X-MARGIN-LOW, DAC-X-MARGIN- HIGH bits, SLEW-RATE-X, and CODE-STEP-X bits for PMBUS-OPERATION-CMD-X. To access multiple channels, write the PMBus page address as specified in Table 7-21 to the PMBUS-PAGE register first, followed by a write to the channel-specific register. Table 7-9. PMBus Operation Commands REGISTER PMBUS-OPERATION-CMD-X[15:8] DESCRIPTION PMBUS-OP-CMD-X 00h Turn off 80h Turn on 94h Margin low A4h Margin high The DACx3004 also implement PMBus features such as group command protocol and communication time-out failure. The CML bit in the PMBUS-CML register indicates a communication fault in the PMBus. This bit is reset by writing 1. To get the PMBus version, read the PMBUS-VERSION register. www.ti.com DAC63004, DAC53004 SLASEX2A – APRIL 2021 – REVISED DECEMBER 2021 Copyright © 2021 Texas Instruments Incorporated Submit Document Feedback 39 Product Folder Links: DAC63004 DAC53004

7.4.5.2 Function Generation

The DACx3004 implement a continuous function or waveform generation feature. These devices can generate a triangular wave, sawtooth wave, and sine wave independently for every channel.

7.4.5.2.1 Triangular Waveform Generation

The triangular waveform uses the DAC-X-MARGIN-LOW and DAC-X-MARGIN-HIGH registers for minimum and maximum levels, respectively. The frequency of the waveform depends on the min and max levels, CODE-STEP and SLEW-RATE settings as shown in Equation 7 . An external RC load with a time-constant larger than the slew-rate settings can be dominant over the internal frequency calculation. The CODE-STEP-X and SLEW- RATE-X settings are available in the DAC-X-FUNC-CONFIG register. Writing 0b000 to the FUNC-CONFIG-X bit field in the DAC-X-FUNC-CONFIG register selects triangular waveform. f TRIANGLE _ W AVE = 1 2 × SLEW _ RATE × M ARGIN _ HIGH − MARGIN _ L O W + 1 CODE _ STEP (7) where:

• SLEW_RATE is the SLEW-RATE-X setting as specified in Table 7-6.
• CODE_STEP is the CODE-STEP-X setting as specified in Table 7-5.
• MARGIN_HIGH is the DAC-X-MAGIN-HIGH as specified in Section 7.6.2.
• MARGIN_LOW is the DAC-X-MAGIN-LOW as specified in Section 7.6.3.

7.4.5.2.2 Sawtooth Waveform Generation

The sawtooth and the inverse sawtooth waveforms use the DAC-X-MARGIN-LOW and DAC-X-MARGIN-HIGH registers for minimum and maximum levels, respectively. The frequency of the waveform depends on the min and max levels, CODE-STEP and SLEW-RATE settings as shown in Equation 8. An external RC load with a time constant larger than the slew-rate settings can be dominant over the internal frequency calculation. The CODE-STEP-X and SLEW-RATE-X settings are available in the DAC-X-FUNC-CONFIG register. Write 0b001 to the FUNC-CONFIG-X bit field in the DAC-X-FUNC-CONFIG register to select sawtooth waveform, and write 0b010 to select inverse sawtooth waveform. f SAW TOO T H _ W AVE = 1 SLEW _ RATE × MARGI N _ H I GH − MARGIN _ L OW + 1 CODE _ S T E P (8) where:

• SLEW_RATE is the SLEW-RATE-X setting as specified in Table 7-6.
• CODE_STEP is the CODE-STEP-X setting as specified in Table 7-5.
• MARGIN_HIGH is the DAC-X-MAGIN-HIGH as specified in Section 7.6.2.
• MARGIN_LOW is the DAC-X-MAGIN-LOW as specified in Section 7.6.3. DAC63004, DAC53004 SLASEX2A – APRIL 2021 – REVISED DECEMBER 2021 www.ti.com

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7.4.5.2.3 Sine Waveform Generation

The sine wave function uses 24 preprogrammed points per cycle. The frequency of the sine wave depends on the SLEW-RATE settings as shown in Equation 9: f SI N E _ W AVE = 1 24 × SLEW _ RATE (9) where SLEW_RATE is the SLEW-RATE-X setting as specified in Table 7-6. An external RC load with a time constant larger than the slew-rate settings can be dominant over the internal frequency calculation. The SLEW-RATE-X setting is available in the DAC-X-FUNC-CONFIG register. Writing 0b100 to the FUNC-CONFIG-X bit field in the DAC-X-FUNC-CONFIG register selects sine wave. The codes for the sine wave are fixed. Use the gain settings at the output amplifier for changing the full-scale output using the internal reference option. The gain settings are accessible through the VOUT-GAIN-X bits in the DAC-X-VOUT-CMP-CONFIG register. Table 7-10 shows the list of hard-coded discrete points for the sine wave with 12-bit resolution and Figure 7-12 shows the pictorial representation of the sine wave. There are four phase settings available for the sine wave that are selected using the PHASE-SEL-X bit in the DAC-X-FUNC-CONFIG register. Table 7-10. Sine Wave Data Points SEQUENCE 12-BIT VALUE SEQUENCE 12-BIT VALUE 0 0x800 12 0x800 1 0x9A8 13 0x658 2 0xB33 14 0x4CD 3 0xC87 15 0x379 4 0xD8B 16 0x275 5 0xE2F 17 0x1D1 6 0xE66 18 0x19A 7 0xE2F 19 0x1D1 8 0xD8B 20 0x275 9 0xC87 21 0x379 10 0xB33 22 0x4CD 11 0x9A8 23 0x658 TIME PERIOD0 5 6 7 17 18 19 Figure 7-12. Sine Wave Generation www.ti.com DAC63004, DAC53004 SLASEX2A – APRIL 2021 – REVISED DECEMBER 2021 Copyright © 2021 Texas Instruments Incorporated Submit Document Feedback 41 Product Folder Links: DAC63004 DAC53004

7.4.6 Device Reset and Fault Management

This section provides the details of power-on-reset (POR), software reset, and other diagnostics and fault- management features of DACx3004.

7.4.6.1 Power-On Reset (POR)

The DACx3004 family of devices includes a power-on reset (POR) function that controls the output voltage at power up. After the V DD supply has been established, a POR event is issued. The POR causes all registers to initialize to default values, and communication with the device is valid only after a POR (boot-up) delay. The default value for all the registers in the DACx3004 is loaded from NVM as soon as the POR event is issued. When the device powers up, a POR circuit sets the device to the default mode. The POR circuit requires specific VDD levels, as indicated in Figure 7-13, to make sure that the internal capacitors discharge and reset the device at power up. To make sure that a POR occurs, V DD must be less than 0.7 V for at least 1 ms. When V DD drops to less than 1.65 V, but remains greater than 0.7 V (shown as the undefined region), the device may or may not reset under all specified temperature and power-supply conditions. In this case, initiate a POR. When V DD remains greater than 1.65 V, a POR does not occur. No power-on reset Power-on reset 0.7 V Undefined 0 V 1.65 V 1.71 V 5.5 V VDD (V) Specified supply voltage range Figure 7-13. Threshold Levels for VDD POR Circuit

7.4.6.2 External Reset

An external reset to the device can be triggered through the GPIO pin or through the register map. To initiate a device software reset event, write the reserved code 1010 to the RESET field in the COMMON-TRIGGER register. A software reset initiates a POR event. The GPIO pin can be configured as a RESET pin as shown in Table 7-18. This configuration must be programmed into the NVM so that the setting is not cleared after the device reset. The RESET input must be a low pulse. The device starts the boot-up sequence after the falling edge of the RESET input. The rising edge of the RESET input does not have any effect.

7.4.6.3 Register-Map Lock

The DACx3004 implement a register-map lock feature that prevents an accidental or unintended write to the DAC registers. The device locks all the registers when the DEV-LOCK bit in the COMMON-CONFIG register is set to 1. However, the software reset function through the COMMON-TRIGGER register is not blocked when using I2C interface. To bypass the DEV-LOCK setting, write 0101 to the DEV-UNLOCK bits in the COMMON- TRIGGER register. DAC63004, DAC53004 SLASEX2A – APRIL 2021 – REVISED DECEMBER 2021 www.ti.com

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7.4.6.4 NVM Cyclic Redundancy Check (CRC)

The DACx3004 implement a cyclic redundancy check (CRC) feature for the NVM to make sure that the data stored in the NVM is uncorrupted. There are two types of CRC alarm bits implemented in DACx3004:

• NVM-CRC-FAIL-USER
• NVM-CRC-FAIL-INT The NVM-CRC-FAIL-USER bit indicates the status of user-programmable NVM bits, and the NVM-CRC-FAIL- INT bit indicates the status of internal NVM bits The CRC feature is implemented by storing a 16-Bit CRC (CRC-16-CCITT) along with the NVM data each time NVM program operation (write or reload) is performed and during the device start up. The device reads the NVM data and validates the data with the stored CRC. The CRC alarm bits (NVM-CRC-FAIL-USER and NVM-CRC-FAIL-INT in the GENERAL-STATUS register) report any errors after the data are read from the device NVM. The alarm bits are set only at boot-up.

7.4.6.4.1 NVM-CRC-FAIL-USER Bit

A logic 1 on NVM-CRC-FAIL-USER bit indicates that the user-programmable NVM data are corrupt. During this condition, all registers in the DAC are initialized with factory reset values, and any DAC registers can be written to or read from. To reset the alarm bits to 0, issue a software reset (see Section 7.4.6.2) command, or cycle power to the DAC. A software reset or power-cycle also reloads the user-programmable NVM bits. In case the failure persists, reprogram the NVM.

7.4.6.4.2 NVM-CRC-FAIL-INT Bit

A logic 1 on NVM-CRC-FAIL-INT bit indicates that the internal NVM data are corrupt. During this condition, all registers in the DAC are initialized with factory reset values, and any DAC registers can be written to or read from. In case of a temporary failure, to reset the alarm bits to 0, issue a software reset (see Section 7.4.6.2) command or cycle power to the DAC. A permanent failure in the NVM makes the device unusable. www.ti.com DAC63004, DAC53004 SLASEX2A – APRIL 2021 – REVISED DECEMBER 2021 Copyright © 2021 Texas Instruments Incorporated Submit Document Feedback 43 Product Folder Links: DAC63004 DAC53004

7.4.7 Power-Down Mode

The DACx3004 output amplifier and internal reference can be independently powered down through the EN- INT-REF, VOUT-PDN-X, and IOUT-PDN-X bits in the COMMON-CONFIG register, as shown in Figure 7-2. At power up, the DAC output and the internal reference are disabled by default. In power-down mode, the DAC outputs (OUTx pins) are in a high-impedance state. To change this state to 10 k Ω-AGND or 100 k Ω-AGND in voltage-output mode (at power up), use the VOUT-PDN-X bits. The power-down state for current-output mode is always high-impedance. The DAC power-up state can be programmed to any state (power-down or normal mode) using the NVM. Table 7-11 shows the DAC power-down bits. The individual channel power-down bits can be mapped to the GPIO pin using the GPIO-CONFIG register. This function is called sleep mode. In this mode, the internal low-dropout regulator (LDO) and the common functional blocks are still powered-on, and the device draws a maximum of 28 μA of current through the power supply. Table 7-11. DAC Power-Down Bits REGISTER VOUT-PDN-X[1] VOUT-PDN-X[0] IOUT-PDN-X DESCRIPTION COMMON-CONFIG 0 0 1 Power up VOUT-X 0 1 1 Power down VOUT-X with 10 kΩ to AGND. Power down IOUT-X to Hi-Z. 1 0 1 Power down VOUT-X with 100 kΩ to AGND. Power down IOUT-X to Hi-Z. 1 1 1 Power down VOUT-X to Hi-Z. Power down IOUT-X to Hi-Z (default). 1 1 0 Power down VOUT-X to Hi-Z. Power up IOUT-X.

7.4.7.1 Deep-Sleep Mode

The DACx3004 provides a deep-sleep mode, where the internal LDO and most of the common functional blocks are powered-down. The GPIO pin must be used to enter and exit this mode. The I 2C or SPI interface does not work during the deep-sleep mode. The steps to enter and exit the deep-sleep mode are: 1. Make sure that the GPIO pin is pulled high. 2. Write 1 to the DEEP-SLEEP-EN bit in the GPIO-CONFIG register. 3. Disable GP output and SDO by writing 0 to GPO-EN and SDO-EN bits. 4. Enable GPIO input mode by writing 1 to GPI-EN and 0b0000 to GPI-CONFIG bits. 5. To program these settings into the NVM, write 1 to the NVM-PROG bit in the COMMON-TRIGGER register. 6. A negative-edge trigger on the GPIO puts the device into the deep-sleep mode. The LDO takes approximately 550 μs to switch off. The device remains in this mode as long as the signal is low. 7. To bring the device out of the deep-sleep mode, pull the GPIO pin high. The digital circuitry and the LDO takes approximately 550 μs to switch on. DAC63004, DAC53004 SLASEX2A – APRIL 2021 – REVISED DECEMBER 2021 www.ti.com

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7.5 Programming

The DACx3004 are programmed through either a 3-wire SPI or 2-wire I 2C interface. A 4-wire SPI mode is enabled by mapping the GPIO pin as SDO. The SPI readback operates at a lower SCLK than the standard SPI write operation. The type of interface is determined based on the first protocol to communicate after device power up. After the interface type is determined, the device ignores any change in the type while the device is on. The interface type can be changed after a power cycle.

7.5.1 SPI Programming Mode

An SPI access cycle for DACx3004 is initiated by asserting the SYNC pin low. The serial clock, SCLK, can be a continuous or gated clock. SDI data are clocked on SCLK falling edges. The SPI frame for DACx3004 is 24 bits long. Therefore, the SYNC pin must stay low for at least 24 SCLK falling edges. The access cycle ends when the SYNC pin is deasserted high. If the access cycle contains less than the minimum clock edges, the communication is ignored. By default, the SDO pin is not enabled (three-wire SPI). In the three-wire SPI mode, if the access cycle contains more than the minimum clock edges, only the first 24 bits are used by the device. When SYNC is high, the SCLK and SDI signals are blocked, and SDO becomes Hi-Z to allow data readback from other devices connected on the bus. Table 7-12 and Figure 7-14 describe the format for the 24-bit SPI access cycle. The first byte input to SDI is the instruction cycle. The instruction cycle identifies the request as a read or write command and the 7-bit address that is to be accessed. The last 16 bits in the cycle form the data cycle. Table 7-12. SPI Read/Write Access Cycle BIT FIELD DESCRIPTION 23 R/W Identifies the communication as a read or write command to the address register: R/W = 0 sets a write operation. R/W = 1 sets a read operation 22-16 A[6:0] Register address: specifies the register to be accessed during the read or write operation 15-0 DI[15:0] Data cycle bits: If a write command, the data cycle bits are the values to be written to the register with address A[6:0]. If a read command, the data cycle bits are don't care values. 1 248 9 D23 D16 D15 D0 Write command SYNC SCLK SDI SDO 1 248 9 D23 D16 D15 D0 Any command D23 D16 D15 D0 HiZ HiZ HiZWrite command echo Figure 7-14. SPI Write Cycle Read operations require that the SDO pin is first enabled by setting the SDO-EN bit in the INTERFACE-CONFIG register. This configuration is called four-wire SPI. A read operation is initiated by issuing a read command access cycle. After the read command, a second access cycle must be issued to get the requested data. The output data format is shown in Table 7-13 and Figure 7-15. Data are clocked out on the SDO pin either on the falling edge or rising edge of SCLK according to the FSDO bit, as shown in Figure 6-3. Table 7-13. SDO Output Access Cycle BIT FIELD DESCRIPTION

23 R/W Echo R/W from previous access cycle

22-16 A[6:0] Echo register address from previous access cycle 15-0 DI[15:0] Readback data requested on previous access cycle www.ti.com DAC63004, DAC53004 SLASEX2A – APRIL 2021 – REVISED DECEMBER 2021 Copyright © 2021 Texas Instruments Incorporated Submit Document Feedback 45 Product Folder Links: DAC63004 DAC53004

Figure 7-15. SPI Read Cycle The daisy-chain operation is also enabled with the SDO pin. In daisy-chain mode, multiple devices are connected in a chain with the SDO pin of one device is connected to SDI pin of the following device, as shown in Figure 7-16. The SPI host drives the SDI pin of the first device in the chain. The SDO pin of the last device in the chain is connected to the POCI pin of the SPI host. In four-wire SPI mode, if the access cycle contains multiples of 24 clock edges, only the last 24 bits are used by the device first device in the chain. If the access cycle contains clock edges that are not in multiples of 24, the SPI packet is ignored by the device. Figure 7-17 describes the packet format for the daisy-chain write cycle. SDI SDO SCLK SYNC TI SPI Device TI SPI Device TI SPI Device C B A SDI SDO SCLK SYNC SDI SDO SCLK SYNC RPULL-UP VIO RPULL-UP VIO RPULL-UP VIO Figure 7-16. SPI Daisy-Chain Connection 1 248 9 D23 D16 D15 D0 Device A command SYNC SCLK SDI-C SDO-C D23 – D1 Device B command 25 48 D23 – D1 Device C command 49 72 Device A command Device B command Figure 7-17. SPI Daisy-Chain Write Cycle DAC63004, DAC53004 SLASEX2A – APRIL 2021 – REVISED DECEMBER 2021 www.ti.com

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7.5.2 I2C Programming Mode

The DACx3004 devices have a 2-wire serial interface (SCL and SDA), and one address pin (A0), as shown in the pin diagram, Figure 5-1 . The I 2C bus consists of a data line (SDA) and a clock line (SCL) with pullup structures. When the bus is idle, both SDA and SCL lines are pulled high. All the I2C-compatible devices connect to the I2C bus through the open drain I/O pins, SDA and SCL. The I2C specification states that the device that controls communication is called a controller, and the devices that are controlled by the controller are called targets. The controller generates the SCL signal. The controller also generates special timing conditions (start condition, repeated start condition, and stop condition) on the bus to indicate the start or stop of a data transfer. Device addressing is completed by the controller. The controller on an I2C bus is typically a microcontroller or digital signal processor (DSP). The DACx3004 family operates as a target on the I 2C bus. A target acknowledges controller commands, and upon controller control, receives or transmits data. Typically, the DACx3004 family operates as a target receiver. A controller writes to the DACx3004, a target receiver. However, if a controller requires the DACx3004 internal register data, the DACx3004 operate as a target transmitter. In this case, the controller reads from the DACx3004. According to I 2C terminology, read and write refer to the controller. The DACx3004 family supports the following data transfer modes:

• Standard mode (100 kbps)
• Fast mode (400 kbps)
• Fast mode plus (1.0 Mbps) The data transfer protocol for standard and fast modes is exactly the same; therefore, both modes are referred to as F/S-mode in this document. The fast mode plus protocol is supported in terms of data transfer speed, but not output current. The low-level output current would be 3 mA; similar to the case of standard and fast modes. The DACx3004 family supports 7-bit addressing. The 10-bit addressing mode is not supported. The device supports the general call reset function. Sending the following sequence initiates a software reset within the device: start or repeated start, 0x00, 0x06, stop. The reset is asserted within the device on the rising edge of the ACK bit, following the second byte. Other than specific timing signals, the I2C interface works with serial bytes. At the end of each byte, a ninth clock cycle generates and detects an acknowledge signal. An acknowledge is when the SDA line is pulled low during the high period of the ninth clock cycle. A not-acknowledge is when the SDA line is left high during the high period of the ninth clock cycle, as shown in Figure 7-18. Data output by transmitter Data output by receiver SCL from controller 1 2 S Start condition 8 9 Not acknowledge Acknowledge Clock pulse for acknowledgement Figure 7-18. Acknowledge and Not Acknowledge on the I2C Bus www.ti.com DAC63004, DAC53004 SLASEX2A – APRIL 2021 – REVISED DECEMBER 2021 Copyright © 2021 Texas Instruments Incorporated Submit Document Feedback 47 Product Folder Links: DAC63004 DAC53004

7.5.2.1 F/S Mode Protocol

The following steps explain a complete transaction in F/S mode. 1. The controller initiates data transfer by generating a start condition. The start condition is when a high-to-low transition occurs on the SDA line while SCL is high, as shown in Figure 7-19. All I2C-compatible devices recognize a start condition. 2. The controller then generates the SCL pulses, and transmits the 7-bit address and the read/write direction bit (R/W) on the SDA line. During all transmissions, the controller makes sure that data are valid. A valid data condition requires the SDA line to be stable during the entire high period of the clock pulse, as shown in Figure 7-20. All devices recognize the address sent by the controller and compare the address to the respective internal fixed address. Only the target device with a matching address generates an acknowledge by pulling the SDA line low during the entire high period of the 9th SCL cycle, as shown in Figure 7-18. When the controller detects this acknowledge, the communication link with a target has been established. 3. The controller generates further SCL cycles to transmit (R/W bit 0) or receive (R/W bit 1) data to the target. In either case, the receiver must acknowledge the data sent by the transmitter. The acknowledge signal can be generated by the controller or by the target, depending on which is the receiver. The 9-bit valid data sequences consists of eight data bits and one acknowledge-bit, and can continue as long as necessary. 4. To signal the end of the data transfer, the controller generates a stop condition by pulling the SDA line from low-to-high while the SCL line is high, as shown in Figure 7-19. This action releases the bus and stops the communication link with the addressed target. All I2C-compatible devices recognize the stop condition. Upon receipt of a stop condition, the bus is released, and all target devices then wait for a start condition followed by a matching address. SCL Stop condition SDA Start condition S P Figure 7-19. Start and Stop Conditions SCL Data line stable Data valid SDA Change of data allowed Figure 7-20. Bit Transfer on the I2C Bus DAC63004, DAC53004 SLASEX2A – APRIL 2021 – REVISED DECEMBER 2021 www.ti.com

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7.5.2.2 I2C Update Sequence

For a single update, the DACx3004 require a start condition, a valid I2C address byte, a command byte, and two data bytes, as listed in Table 7-14. Table 7-14. Update Sequence Address (A) byte Section 7.5.2.2.1 Command byte Section 7.5.2.2.2 Data byte - MSDB Data byte - LSDB After each byte is received, the DACx3004 family acknowledges the byte by pulling the SDA line low during the high period of a single clock pulse, as shown in Figure 7-21. These four bytes and acknowledge cycles make up the 36 clock cycles required for a single update to occur. A valid I2C address byte selects the DACx3004. 1 7 8 9 1 2 - 8 9 S or Sr SDA SCL MSB Address START or REPEATED START condition Recognize START or REPEATED START condition R/W ACK Acknowledgement signal from target Generate ACKNOWLEDGE signal Sr or P P Sr REPEATED START or STOP condition Recognize STOP or REPEATED START condition ACK Figure 7-21. I2C Bus Protocol The command byte sets the operating mode of the selected DACx3004 device. For a data update to occur when the operating mode is selected by this byte, the DACx3004 device must receive two data bytes: the most significant data byte (MSDB) and least significant data byte (LSDB). The DACx3004 device performs an update on the falling edge of the acknowledge signal that follows the LSDB. When using fast mode (clock = 400 kHz), the maximum DAC update rate is limited to 10 kSPS. Using fast mode plus (clock = 1 MHz), the maximum DAC update rate is limited to 25 kSPS. When a stop condition is received, the DACx3004 device releases the I2C bus and awaits a new start condition. www.ti.com DAC63004, DAC53004 SLASEX2A – APRIL 2021 – REVISED DECEMBER 2021 Copyright © 2021 Texas Instruments Incorporated Submit Document Feedback 49 Product Folder Links: DAC63004 DAC53004

7.5.2.2.1 Address Byte

The address byte, as shown in Table 7-15, is the first byte received from the controller device following the start condition. The first four bits (MSBs) of the address are factory preset to 1001. The next three bits of the address are controlled by the A0 pin. The A0 pin input can be connected to VDD, AGND, SCL, or SDA. The A0 pin is sampled during the first byte of each data frame to determine the address. The device latches the value of the address pin, and consequently responds to that particular address according to Table 7-16. Table 7-15. Address Byte COMMENT MSB LSB — AD6 AD5 AD4 AD3 AD2 AD1 AD0 R/W General address 1 0 0 1 See Table 7-16 (target address column) 0 or 1 Broadcast address 1 0 0 0 1 1 1 0 Table 7-16. Address Format TARGET ADDRESS A0 PIN

000 AGND

001 VDD

010 SDA

011 SCL

The DACx3004 supports broadcast addressing, which is used for synchronously updating or powering down multiple DACx3004 devices. When the broadcast address is used, the DACx3004 responds regardless of the address pin state. Broadcast is supported only in write mode.

7.5.2.2.2 Command Byte

Table 7-21 lists the command byte in the ADDRESS column. DAC63004, DAC53004 SLASEX2A – APRIL 2021 – REVISED DECEMBER 2021 www.ti.com

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7.5.2.3 I2C Read Sequence

To read any register the following command sequence must be used: 1. Send a start or repeated start command with a target address and the R/W bit set to 0 for writing. The device acknowledges this event. 2. Send a command byte for the register to be read. The device acknowledges this event again. 3. Send a repeated start with the target address and the R/W bit set to 1 for reading. The device acknowledges this event. 4. The device writes the MSDB byte of the addressed register. The controller must acknowledge this byte. 5. Finally, the device writes out the LSDB of the register. The broadcast address cannot be used for reading. Table 7-17. Read Sequence S MSB … R/W (0) ACK MSB … LSB ACK Sr MSB … R/W (1) ACK MSB … LSB ACK MSB … LSB ACK ADDRESS BYTE Section 7.5.2.2.1 COMMAND BYTE Section 7.5.2.2.2 Sr ADDRESS BYTE Section 7.5.2.2.1 MSDB LSDB From Controller Target From Controller Target From Controller Target From Target Controller From Target Controller

7.5.3 General-Purpose Input/Output (GPIO) Modes

Together with I2C and SPI, the DACx3004 also support a GPIO that can be configured in the NVM for multiple functions. This pin allows for updating the DAC output channels and reading status bits without using the programming interface, thus enabling processor-less operation. In the GPIO-CONFIG register, write 1 to the GPI-EN bit to set the GPIO pin as an input, or write 1 to the GPO-EN bit to set the pin as output. There are global and channel-specific functions mapped to the GPIO pin. For channel-specific functions, select the channels using the GPI-CH-SEL field in the GPIO-CONFIG register. Table 7-18 lists the functional options available for the GPIO as input and Table 7-19 lists the options for the GPIO as output. Some of the GP input operations are edge-triggered after the device boots up. After the power supply ramps up, the device registers the GPI level and executes the associated command. This feature allows the user to configure the initial output state at power-on. By default, the GPIO pin is not mapped to any operation. When the GPIO pin is mapped to a specific input function, the corresponding software bit functionality is disabled to avoid a race condition. When used as a RESET input, the GPIO pin must transmit an active-low pulse for triggering a device reset. All other constraints of the functions are applied to the GPIO-based trigger. Note Pull the GPIO pin to high or low when not used. When the GPIO pin is used as RESET, the configuration must be programmed into the NVM. Otherwise, the setting is cleared after the device resets. www.ti.com DAC63004, DAC53004 SLASEX2A – APRIL 2021 – REVISED DECEMBER 2021 Copyright © 2021 Texas Instruments Incorporated Submit Document Feedback 51 Product Folder Links: DAC63004 DAC53004

Table 7-18. General-Purpose Input Function Map REGISTER BIT FIELD VALUE CHANNELS GPIO EDGE / LEVEL FUNCTION GPIO-CONFIG GPI-CONFIG

0000 All

Falling-edge Trigger DEEP-SLEEP mode. Rising-edge Bring the device out of deep-sleep.

0010 All

Falling-edge Trigger FAULT-DUMP Rising-edge No effect

0011 As per GPI-CH-SEL

Falling-edge IOUT power-down Rising-edge IOUT power-up

0100 As per GPI-CH-SEL

VOUT power-down. Pulldown resistor as per the VOUT-PDN-X setting Rising-edge VOUT power-up

0101 All

Falling-edge Trigger PROTECT function Rising-edge No effect

0111 All

Falling-edge Trigger CLR function Rising-edge No effect 1000 As per GPI-CH-SEL. Both the SYNC-CONFIG-X and the GPI-CH-SEL must be configured for every channel. Falling-edge Trigger LDAC function Rising-edge No effect

1001 As per GPI-CH-SEL

Falling-edge Stop function generation Rising-edge Start function generation

1010 As per GPI-CH-SEL

Falling-edge Trigger margin-low Rising-edge Trigger margin-high

1011 All

Trigger device RESET. The RESET configuration must be programmed into the NVM. Rising-edge No effect

1100 All

Falling-edge Allows NVM programming Rising-edge Blocks NVM programming

1101 All

Falling-edge Allows register map update rising-edge Blocks register map write except a write to the DEV-UNLOCK field through I2C or SPI and to the RESET field through I2C Others NA NA Not applicable Table 7-19. General-Purpose Output (STATUS) Function Map REGISTER BIT FIELD VALUE FUNCTION GPIO-CONFIG GPO-CONFIG

0001 NVM-BUSY

0100 DAC-0-BUSY

0101 DAC-1-BUSY

0110 DAC-2-BUSY

0111 DAC-3-BUSY

1000 WIN-CMP-0

1001 WIN-CMP-1

1010 WIN-CMP-2

1011 WIN-CMP-3

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7.6 Register Map

Table 7-20. Register Map REGISTER(1) (2) MOST SIGNIFICANT DATA BYTE (MSDB) LEAST SIGNIFICANT DATA BYTE (LSDB) BIT15 BIT14 BIT13 BIT12 BIT11 BIT10 BIT9 BIT8 BIT7 BIT6 BIT5 BIT4 BIT3 BIT2 BIT1 BIT0 NOP NOP DAC-X-MARGIN- HIGH DAC-X-MARGIN-HIGH X DAC-X-MARGIN- LOW DAC-X-MARGIN-LOW X DAC-X-VOUT- CMP-CONFIG X VOUT-X-GAIN X CMP-X-OD- EN CMP-X- OUT-EN CMP-X-HIZ- IN-DIS CMP-X-INV- EN CMP-X-EN DAC-X-IOUT-MISC- CONFIG X IOUT-X-RANGE X DAC-X-CMP- MODE-CONFIG X CMP-X-MODE X DAC-X-FUNC- CONFIG CLR-SEL-X SYNC- CONFIG-X BRD- CONFIG-X FUNC-GEN-CONFIG-BLOCK-X DAC-X-DATA DAC-X-DATA X COMMON-CONFIG WIN- LATCH-EN DEV-LOCK EE-READ- ADDR EN-INT-REF VOUT-PDN-3 IOUT-PDN-3 VOUT-PDN-2 IOUT-PDN-2 VOUT-PDN-1 IOUT-PDN-1 VOUT-PDN-0 IOUT-PDN-0 COMMON- TRIGGER DEV-UNLOCK RESET LDAC CLR X FAULT- DUMP PROTECT READ-ONE- TRIG NVM-PROG NVM- RELOAD COMMON-DAC- TRIG RST-CMP- FLAG-0 TRIG-MAR- LO-0 TRIG-MAR- HI-0 START- FUNC-0 RST-CMP- FLAG-1 TRIG-MAR- LO-1 TRIG-MAR- HI-1 START- FUNC-1 RST-CMP- FLAG-2 TRIG-MAR- LO-2 TRIG-MAR- HI-2 START- FUNC-2 RST-CMP- FLAG-3 TRIG-MAR- LO-3 TRIG-MAR- HI-3 START- FUNC-3 GENERAL-STATUS NVM-CRC- FAIL-INT NVM-CRC- FAIL-USER X DAC- BUSY-3 DAC- BUSY-2 DAC- BUSY-1 DAC- BUSY-0 NVM-BUSY DEVICE-ID CMP-STATUS X PROTECT- FLAG WIN-CMP-3 WIN-CMP-2 WIN-CMP-1 WIN-CMP-0 CMP- FLAG-3 CMP- FLAG-2 CMP- FLAG-1 CMP- FLAG-0 GPIO-CONFIG GF-EN DEEP- SLEEP-EN GPO-EN GPO-CONFIG GPI-CH-SEL GPI-CONFIG GPI-EN DEVICE-MODE- CONFIG RESERVED DIS-MODE- IN RESERVED PROTECT-CONFIG RESERVED X INTERFACE- CONFIG X TIMEOUT- EN X EN-PMBUS X FAST-SDO- EN X SDO-EN SRAM-CONFIG X SRAM-ADDR SRAM-DATA SRAM-DATA DAC-X-DATA-8BIT DAC-X-DATA-8BIT X BRDCAST-DATA BRDCAST-DATA X PMBUS-PAGE PMBUS-PAGE NA PMBUS-OP-CMD PMBUS-OPERATION-CMD-X NA PMBUS-CML X CML X NA PMBUS-VERSION PMBUS-VERSON NA (1) The highlighted gray cells indicate the register bits or fields that are stored in the NVM. (2) X = Don't care. www.ti.com DAC63004, DAC53004 SLASEX2A – APRIL 2021 – REVISED DECEMBER 2021 Copyright © 2021 Texas Instruments Incorporated Submit Document Feedback 53 Product Folder Links: DAC63004 DAC53004

Table 7-21. Register Names I2C/SPI ADDRESS PMBUS PAGE ADDR PMBUS REGISTER ADDR REGISTER NAME SECTION 00h FFh D0h NOP Section 7.6.1 01h 00h 25h DAC-0-MARGIN-HIGH Section 7.6.2 02h 00h 26h DAC-0-MARGIN-LOW Section 7.6.3 03h FFh D1h DAC-0-VOUT-CMP-CONFIG Section 7.6.4 04h FFh D2h DAC-0-IOUT-MISC-CONFIG Section 7.6.5 05h FFh D3h DAC-0-CMP-MODE-CONFIG Section 7.6.6 06h FFh D4h DAC-0-FUNC-CONFIG Section 7.6.7 07h 01h 25h DAC-1-MARGIN-HIGH Section 7.6.1 08h 01h 26h DAC-1-MARGIN-LOW Section 7.6.2 09h FFh D5h DAC-1-VOUT-CMP-CONFIG Section 7.6.3 0Ah FFh D6h DAC-1-IOUT-MISC-CONFIG Section 7.6.4 0Bh FFh D7h DAC-1-CMP-MODE-CONFIG Section 7.6.5 0Ch FFh D8h DAC-1-FUNC-CONFIG Section 7.6.6 0Dh 02h 25h DAC-2-MARGIN-HIGH Section 7.6.1 0Eh 02h 26h DAC-2-MARGIN-LOW Section 7.6.2 0Fh FFh D9h DAC-2-VOUT-CMP-CONFIG Section 7.6.3 10h FFh DAh DAC-2-IOUT-MISC-CONFIG Section 7.6.4 11h FFh DBh DAC-2-CMP-MODE-CONFIG Section 7.6.5 12h FFh DCh DAC-2-FUNC-CONFIG Section 7.6.6 13h 03h 25h DAC-3-MARGIN-HIGH Section 7.6.1 14h 03h 26h DAC-3-MARGIN-LOW Section 7.6.2 15h FFh DDh DAC-3-VOUT-CMP-CONFIG Section 7.6.3 16h FFh DEh DAC-3-IOUT-MISC-CONFIG Section 7.6.4 17h FFh DFh DAC-3-CMP-MODE-CONFIG Section 7.6.5 18h FFh E0h DAC-3-FUNC-CONFIG Section 7.6.6 19h 00h 21h DAC-0-DATA Section 7.6.8 1Ah 01h 21h DAC-1-DATA Section 7.6.8 1Bh 02h 21h DAC-2-DATA Section 7.6.8 1Ch 03h 21h DAC-3-DATA Section 7.6.8 1Fh FFh E3h COMMON-CONFIG Section 7.6.9 20h FFh E4h COMMON-TRIGGER Section 7.6.10 21h FFh E5h COMMON-DAC-TRIG Section 7.6.11 DAC63004, DAC53004 SLASEX2A – APRIL 2021 – REVISED DECEMBER 2021 www.ti.com

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Table 7-21. Register Names (continued) I2C/SPI ADDRESS PMBUS PAGE ADDR PMBUS REGISTER ADDR REGISTER NAME SECTION 22h FFh E6h GENERAL-STATUS Section 7.6.12 23h FFh E7h CMP-STATUS Section 7.6.13 24h FFh E8h GPIO-CONFIG Section 7.6.14 25h FFh E9h DEVICE-MODE-CONFIG Section 7.6.15 26h FFh EAh INTERFACE-CONFIG Section 7.6.16 2Bh FFh EFh SRAM-CONFIG Section 7.6.17 2Ch FFh F0h SRAM-DATA Section 7.6.18 40h NA NA DAC-0-DATA-8BIT Section 7.6.19 41h NA NA DAC-1-DATA-8BIT Section 7.6.19 42h NA NA DAC-2-DATA-8BIT Section 7.6.19 43h NA NA DAC-3-DATA-8BIT Section 7.6.19 50h FFh F1h BRDCAST-DATA Section 7.6.20 NA All pages 00h PMBUS-PAGE Section 7.6.21 NA 00h 01h PMBIS-OP-CMD-0 Section 7.6.22 NA 01h 01h PMBUS-OP-CMD-1 Section 7.6.22 NA 02h 01h PMBUS-OP-CMD-2 Section 7.6.22 NA 03h 01h PMBUS-OP-CMD-3 Section 7.6.22 NA All pages 78h PMBUS-CML Section 7.6.23 NA All pages 98h PMBUS-VERSION Section 7.6.24 Table 7-22. Access Type Codes Access Type Code Description X X Don't care Read Type R R Read Write Type W W Write Reset or Default Value -n Value after reset or the default value www.ti.com DAC63004, DAC53004 SLASEX2A – APRIL 2021 – REVISED DECEMBER 2021 Copyright © 2021 Texas Instruments Incorporated Submit Document Feedback 55 Product Folder Links: DAC63004 DAC53004

7.6.1 NOP Register (address = 00h) [reset = 0000h]

PMBus page address = FFh, PMBus register address = D0h Figure 7-22. NOP Register 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 NOP R-0h Table 7-23. NOP Register Field Descriptions Bit Field Type Reset Description 15-0 NOP R 0000h No operation

7.6.2 DAC-X-MARGIN-HIGH Register (address = 01h, 07h, 0Dh, 13h) [reset = 0000h]

PMBus page address = 00h, 01h, 02h, 03h, PMBus register address = 25h Figure 7-23. DAC-X-MARGIN-HIGH Register (X = 0, 1, 2, 3) 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 DAC-X-MARGIN-HIGH[11:0] DAC-X-MARGIN-HIGH[9:0] X R/W-0h X-0h Table 7-24. DAC-X-MARGIN-HIGH Register Field Descriptions Bit Field Type Reset Description 15-4 DAC-X-MARGIN-HIGH[11:0] DAC-X-MARGIN-HIGH[9:0] R/W 000h Margin-high code for DAC output Data are in straight-binary format. MSB left-aligned. Use the following bit-alignment: DAC63004: {DAC-X-MARGIN-HIGH[11:0]} DAC53004: {DAC-X-MARGIN-HIGH[9:0], X, X} X = Don't care bits. 3-0 X X 0 Don't care

7.6.3 DAC-X-MARGIN-LOW Register (address = 02h, 08h, 0Eh, 14h) [reset = 0000h]

PMBus page address = 00h, 01h, 02h, 03h, PMBus register address = 26h Figure 7-24. DAC-X-MARGIN-LOW Register (X = 0, 1, 2, 3) 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 DAC-X-MARGIN-LOW[11:0] DAC-X-MARGIN-LOW[9:0] X R/W-0h X-0h Table 7-25. DAC-X-MARGIN-LOW Register Field Descriptions Bit Field Type Reset Description 15-4 DAC-X-MARGIN-LOW[11:0] DAC-X-MARGIN-LOW[9:0] R/W 000h Margin-low code for DAC output Data are in straight-binary format. MSB left-aligned. Use the following bit-alignment: DAC63004: {DAC-X-MARGIN-LOW[11:0]} DAC53004: {DAC-X-MARGIN-LOW[9:0], X, X} X = Don't care bits. 3-0 X X 0 Don't care DAC63004, DAC53004 SLASEX2A – APRIL 2021 – REVISED DECEMBER 2021 www.ti.com

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7.6.4 DAC-X-VOUT-CMP-CONFIG Register (address = 03h, 09h, 0Fh, 15h) [reset = 0000h]

PMBus page address = FFh, PMBus register address = D1h, D5h, D9h, DDh Figure 7-25. DAC-X-VOUT-CMP-CONFIG Register (X = 0, 1, 2, 3) 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 X VOUT-GAIN-X X CMP- X-OD- EN CMP- X-OUT- EN CMP-X- HIZ-IN- DIS CMP- X-INV- EN CMP- X-EN X-0h R/W-0h X-0h R/W-0h R/W-0h R/W-0h R/W-0h R/W-0h Table 7-26. DAC-X-VOUT-CMP-CONFIG Register Field Descriptions Bit Field Type Reset Description 15-13 X X 0h Don't care 12-10 VOUT-GAIN-X R/W 0h 000: Gain = 1x, external reference on VREF pin 001: Gain = 1x, VDD as reference 010: Gain = 1.5x, internal reference 011: Gain = 2x, internal reference 100: Gain = 3x, internal reference 101: Gain = 4x, internal reference Others: Invalid 9-5 X X 0h Don't care

4 CMP-X-OD-EN R/W 0 0: Set OUTx pin as push-pull

1: Set OUTx pin as open-drain in comparator mode (CMP-X-EN = 1 and CMP-X-OUT-EN = 1)

3 CMP-X-OUT-EN R/W 0 0: Generate comparator output but consume internally

1: Bring comparator output to the respective OUTx pin 2 CMP-X-HIZ-IN-DIS R/W 0 0: FBx input has high-impedance. Input voltage range is limited. 1: FBx input is connected to resistor divider and has finite impedance. Input voltage range is same as full-scale.

1 CMP-X-INV-EN R/W 0 0: Don't invert the comparator output

1: Invert the comparator output

0 CMP-X-EN R/W 0 0: Disable comparator mode

1: Enable comparator mode. Current-output must be in power- down. Voltage-output mode must be enabled. www.ti.com DAC63004, DAC53004 SLASEX2A – APRIL 2021 – REVISED DECEMBER 2021 Copyright © 2021 Texas Instruments Incorporated Submit Document Feedback 57 Product Folder Links: DAC63004 DAC53004

7.6.5 DAC-X-IOUT-MISC-CONFIG Register (address = 04h, 0Ah, 10h, 16h) [reset = 0000h]

PMBus page address = FFh, PMBus register address = D2h, D6h, DAh, DEh Figure 7-26. DAC-X-IOUT-MISC-CONFIG Register (X = 0, 1, 2, 3) 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 X IOUT-RANGE-X X X-0h R/W-0h X-0h Table 7-27. DAC-X-IOUT-MISC-CONFIG Register Field Descriptions Bit Field Type Reset Description 15-13 X X 0h Don't care 12-9 IOUT-RANGE-X R/W 0000 0000: 0 μA to 25 μA 0001: 0 μA to 50 μA 0010: 0 μA to 125 μA 0011: 0 μA to 250 μA 0100: 0 μA to ‒24 μA 0101: 0 μA to ‒48 μA 0110: 0 μA to ‒120 μA 0111: 0 μA to ‒240 μA 1000: ‒25 μA to +25 μA 1001: ‒50 μA to +50 μA 1010: ‒125 μA to +125 μA 1011: ‒250 μA to +250 μA Others: Invalid 8-0 X X 000h Don't care

7.6.6 DAC-X-CMP-MODE-CONFIG Register (address = 05h, 0Bh, 11h, 17h) [reset = 0000h]

PMBus page address = FFh, PMBus register address = D3h, D7h, DBh, DFh Figure 7-27. DAC-X-CMP-MODE-CONFIG Register (X = 0, 1, 2, 3) 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 X CMP-X-MODE X X-0h R/W-0h X-0h Table 7-28. DAC-X-CMP-MODE-CONFIG Register Field Descriptions Bit Field Type Reset Description 15-12 X X 00h Don't care 11-10 CMP-X-MODE R/W 00 00: No hysteresis or window function 01: Hysteresis provided using DAC-X-MARGIN-HIGH and DAC- X-MARGIN-LOW registers 10: Window comparator mode with DAC-X-MARGIN-HIGH and DAC-X-MARGIN-LOW registers setting window bounds 11: Invalid 9-0 X X 000h Don't care DAC63004, DAC53004 SLASEX2A – APRIL 2021 – REVISED DECEMBER 2021 www.ti.com

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7.6.7 DAC-X-FUNC-CONFIG Register (address = 06h, 0Ch, 12h, 18h) [reset = 0000h]

PMBus page address = FFh, PMBus register address = D4h, D8h, DCh, E0h Figure 7-28. DAC-X-FUNC-CONFIG Register (X = 0, 1, 2, 3) 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 CLR-SEL-X SYNC- CONFIG-X BRD- CONFIG-X FUNC-GEN-CONFIG-BLOCK R/W-0h R/W-0h R/W-0h R/W-0h Table 7-29. DAC-X-FUNC-CONFIG Register Field Descriptions Bit Field Type Reset Description

15 CLR-SEL-X R/W 0 0: Clear DAC-X to zero-scale

1: Clear DAC-X to mid-scale

14 SYNC-CONFIG-X R/W 0 0: DAC-X output updates immediately after a write command

1: DAC-X output updates with LDAC pin falling-edge or when the LDAC bit in the COMMON-TRIGGER register is set to 1

13 BRD-CONFIG-X R/W 0 0: Don't update DAC-X with broadcast command

1: Update DAC-X with broadcast command Table 7-30. Linear-Slew Mode: FUNC-GEN-CONFIG-BLOCK Field Descriptions Bit Field Type Reset Description 12-11 PHASE-SEL-X R/W 0 00: 0° 01: 120° 10: 240° 11: 90° 10-8 FUNC-CONFIG-X R/W 0 000: Triangular wave 001: Sawtooth wave 010: Inverse sawtooth wave 100: Sine wave 111: Disable function generation Others: Invalid

7 LOG-SLEW-EN-X R/W 0 0: Enable linear slew

6-4 CODE-STEP-X R/W 0 CODE-STEP for linear slew mode: 000: 1-LSB 001: 2-LSB 010: 3-LSB 011: 4-LSB 100: 6-LSB 101: 8-LSB 110: 16-LSB 111: 32-LSB 3-0 SLEW-RATE-X R/W 0 SLEW-RATE for linear slew mode: 0000: No slew for margin-high and margin-low. Invalid for waveform generation. 0001: 4 µs/step 0010: 8 µs/step 0011: 12 µs/step 0100: 18 µs/step 0101: 27.04 µs/step 0110: 40.48 µs/step 0111: 60.72 µs/step 1000: 91.12 µs/step 1001: 136.72 µs/step 1010: 239.2 µs/step 1011: 418.64 µs/step 1100: 732.56 µs/step 1101: 1282 µs/step 1110: 2563.96 µs/step 1111: 5127.92 µs/step www.ti.com DAC63004, DAC53004 SLASEX2A – APRIL 2021 – REVISED DECEMBER 2021 Copyright © 2021 Texas Instruments Incorporated Submit Document Feedback 59 Product Folder Links: DAC63004 DAC53004

Table 7-31. Logarithmic-Slew Mode: FUNC-GEN-CONFIG-BLOCK Field Descriptions Bit Field Type Reset Description 12-11 PHASE-SEL-X R/W 0 00: 0° 01: 120° 10: 240° 11: 90° 10 - 8 FUNC-CONFIG-X R/W 0 000: Triangular wave 001: Sawtooth wave 010: Inverse sawtooth wave 100: Sine wave 111: Disable function generation Others: Invalid 7 LOG-SLEW-EN-X R/W 0 1: Enable logarithmic slew. In logarithmic slew mode, the DAC output moves from the DAC- X-MARGIN-LOW code to the DAC-X-MARGIN-HIGH code, or vice versa, in 3.125% steps. When slewing in the positive direction, the next step is (1 + 0.03125) times the current step. When slewing in the negative direction, the next step is (1 ‒ 0.03125) times the current step. When DAC-X-MARGIN-LOW is 0, the slew starts from code 1. The time interval for each step is defined by RISE-SLEW-X and FALL-SLEW-X. 6-4 RISE-SLEW-X R/W 0 SLEW-RATE for logarithmic slew mode (DAC-X-MARGIN-LOW to DAC-X-MARGIN-HIGH): 000: 4 µs/step 001: 12 µs/step 010: 27.04 µs/step 011: 60.72 µs/step 100: 136.72 µs/step 101: 418.64 µs/step 110: 1282 µs/step 111: 5127.92 µs/step 3-1 FALL-SLEW-X R/W 0 SLEW-RATE for logarithmic slew mode (DAC-X-MARGIN-HIGH to DAC-X-MARGIN-LOW): 000: 4 µs/step 001: 12 µs/step 010: 27.04 µs/step 011: 60.72 µs/step 100: 136.72 µs/step 101: 418.64 µs/step 110: 1282 µs/step 111: 5127.92 µs/step

0 X X 0 Don't care

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7.6.8 DAC-X-DATA Register (address = 19h, 1Ah, 1Bh, 1Ch) [reset = 0000h]

PMBus page address = 00h, 01h, 02h, 03h, PMBus register address = 21h Figure 7-29. DAC-X-DATA Register (X = 0, 1, 2, 3) 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 DAC-X-DATA[11:0] DAC-X-DATA[9:0] X R/W-0h X-0h Table 7-32. DAC-X-DATA Register Field Descriptions Bit Field Type Reset Description 15-4 DAC-X-DATA[11:0] DAC-X-DATA[9:0] R/W 000h Data for DAC output Data are in straight-binary format. MSB left-aligned. MSB left- aligned. Use the following bit-alignment: DAC63004: {DAC-X-DATA[11:0]} DAC53004: {DAC-X-DATA[9:0], X, X} X = Don't care bits. 3-0 X X 0h Don't care

7.6.9 COMMON-CONFIG Register (address = 1Fh) [reset = 0FFFh]

PMBus page address = FFh, PMBus register address = E3h Figure 7-30. COMMON-CONFIG Register 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 WIN- LATCH- EN DEV- LOCK EE-READ- ADDR EN-INT- REF VOUT-PDN-3 IOUT- PDN-3 VOUT-PDN-2 IOUT- PDN-2 VOUT-PDN-1 IOUT- PDN-1 VOUT-PDN-0 IOUT- PDN-0 R/W-0h R/W-0h R/W-0h R/W-0h R/W-11b R/W-1b R/W-11b R/W-1b R/W-11b R/W-1b R/W-11b R/W-1b Table 7-33. COMMON-CONFIG Register Field Descriptions Bit Field Type Reset Description

15 WIN-LATCH-EN R/W 0 0: Non-latching window-comparator output

1: Latching window-comparator output

14 DEV-LOCK R/W 0 0: Device not locked

1: Device locked, the device locks all the registers. To set this bit back to 0 (unlock device), write to the unlock code to the DEV- UNLOCK field in the COMMON-TRIGGER register first, followed by a write to the DEV-LOCK bit as 0.

13 EE-READ-ADDR R/W 0 0: Fault-dump read enable at address 0x00

1: Fault-dump read enable at address 0x01

12 EN-INT-REF R/W 0 0: Disable internal reference

1: Enable internal reference. This bit must be set before using internal reference gain settings. 11-10, 8-7, 5-4, 2-1 VOUT-PDN-X R/W 11 00: Power-up VOUT-X 01: Power-down VOUT-X with 10 KΩ to AGND 10: Power-down VOUT-X with 100 KΩ to AGND 11: Power-down VOUT-X with Hi-Z to AGND 9, 6, 3, 0 IOUT-PDN-X R/W 1 0: Power-up IOUT-X 1: Power-down IOUT-X www.ti.com DAC63004, DAC53004 SLASEX2A – APRIL 2021 – REVISED DECEMBER 2021 Copyright © 2021 Texas Instruments Incorporated Submit Document Feedback 61 Product Folder Links: DAC63004 DAC53004

7.6.10 COMMON-TRIGGER Register (address = 20h) [reset = 0000h]

PMBus page address = FFh, PMBus register address = E4h Figure 7-31. COMMON-TRIGGER Register 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 DEV-UNLOCK RESET LDAC CLR X FAULT- DUMP PROTECT READ- ONE- TRIG NVM- PROG NVM- RELOAD R/W-0h R/W-0h R/W-0h R/W-0h X-0h R/W-0h R/W-0h R/W-0h R/W-0h R/W-0h Table 7-34. COMMON-TRIGGER Register Field Descriptions Bit Field Type Reset Description 15-12 DEV-UNLOCK R/W 0000 0101: Device unlocking password Others: Don't care 11 - 8 RESET W 0000 1010: POR reset triggered. This bit self-resets. Others: Don't care

7 LDAC R/W 0 0: LDAC operation not triggered

1: LDAC operation triggered if the respective SYNC-CONFIG-X bit in the DAC-X-FUNC-CONFIG register is 1. This bit self-resets.

6 CLR R/W 0 0: DAC registers and outputs unaffected

1: DAC registers and outputs set to zero-code or mid-code based on the respective CLR-SEL-X bit in the DAC-X-FUNC-CONFIG register. This bit self-resets.

5 X X 0 Don't care

4 FAULT-DUMP R/W 0 0: Fault-dump is not triggered

1: Triggers fault-dump sequence. This bit self-resets.

3 PROTECT R/W 0 0: PROTECT function not triggered

1: Trigger PROTECT function. This bit is self-resetting.

2 READ-ONE-TRIG R/W 0 0: Fault-dump read not triggered

1: Read one row of NVM for fault-dump. This bit self-resets.

1 NVM-PROG R/W 0 0: NVM write not triggered

1: NVM write triggered. This bit self-resets.

0 NVM-RELOAD R/W 0 0: NVM reload not triggered

1: Reload data from NVM to register map. This bit self-resets. DAC63004, DAC53004 SLASEX2A – APRIL 2021 – REVISED DECEMBER 2021 www.ti.com

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7.6.11 COMMON-DAC-TRIG Register (address = 21h) [reset = 0000h]

PMBus page address = FFh, PMBus register address = E5h Figure 7-32. COMMON-DAC-TRIG Register 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 RESET- CMP- FLAG-0 TRIG- MAR- LO-0 TRIG- MAR- HI-0 START- FUNC-0 RESET- CMP- FLAG-1 TRIG- MAR- LO-1 TRIG- MAR- HI-1 START- FUNC-1 RESET- CMP- FLAG-2 TRIG- MAR- LO-2 TRIG- MAR- HI-2 START- FUNC-2 RESET- CMP- FLAG-2 TRIG- MAR- LO-3 TRIG- MAR- HI-3 START- FUNC-3 W-0h W-0h W-0h R/W-0h W-0h W-0h W-0h R/W-0h W-0h W-0h W-0h R/W-0h W-0h W-0h W-0h R/W-0h Table 7-35. COMMON-DAC-TRIG Register Field Descriptions Bit Field Type Reset Description 15, 11, 7, RESET-CMP-FLAG-X W 0 0: Latching-comparator output unaffected 1: Reset latching-comparator and window-comparator output. This bit self-resets. 14, 10, 6, TRIG-MAR-LO-X W 0 0: Don't care 1: Trigger margin-low command. This bit self-resets. 13, 9, 5, 1 TRIG-MAR-HI-X W 0 0: Don't care 1: Trigger margin-high command. This bit self-resets. 12, 8, 4, 0 START-FUNC-X R/W 0 0: Stop function generation 1: Start function generation as per FUNC-GEN-CONFIG-X in the DAC-X-FUNC-CONFIG register. www.ti.com DAC63004, DAC53004 SLASEX2A – APRIL 2021 – REVISED DECEMBER 2021 Copyright © 2021 Texas Instruments Incorporated Submit Document Feedback 63 Product Folder Links: DAC63004 DAC53004

7.6.12 GENERAL-STATUS Register (address = 22h) [reset = 00h, DEVICE-ID, VERSION-ID]

PMBus page address = FFh, PMBus register address = E6h Figure 7-33. GENERAL-STATUS Register 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 NVM- CRC- FAIL-INT NVM- CRC- FAIL- USER X DAC-3- BUSY DAC-2- BUSY DAC-1- BUSY DAC-0- BUSY X DEVICE-ID VERSION-ID R-0h R-0h R-0h R-0h R-0h R-0h R-0h X-0h R R-0h Table 7-36. GENERAL-STATUS Register Field Descriptions Bit Field Type Reset Description

15 NVM-CRC-FAIL-INT R 0 0: No CRC error in OTP

1: Indicates a failure in OTP loading. A software reset or power-cycle can bring the device out of this condition in case of temporary failure.

14 NVM-CRC-FAIL-USER R 0 0: No CRC error in NVM loading

1: Indicates a failure in NVM loading. The register settings are corrupted. The device allows all operations during this error condition. Reprogram the NVM to get original state. A software reset brings the device out of this temporary error condition.

13 X R 0 Don't care

12 DAC-3-BUSY R 0 0: DAC-3 channel can accept commands

1: DAC-3 channel does not accept commands

11 DAC-2-BUSY R 0 0: DAC-2 channel can accept commands

1: DAC-2 channel does not accept commands

10 DAC-1-BUSY R 0 0: DAC-1 channel can accept commands

1: DAC-1 channel does not accept commands

9 DAC-0-BUSY R 0 0: DAC-0 channel can accept commands

1: DAC-0 channel does not accept commands

8 X R 0 Don't care

7-2 DEVICE-ID R DAC53004: 05h DAC63004: 04h Device identifier 1-0 VERSION-ID R 00 Version identifier DAC63004, DAC53004 SLASEX2A – APRIL 2021 – REVISED DECEMBER 2021 www.ti.com

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7.6.13 CMP-STATUS Register (address = 23h) [reset = 0000h]

PMBus page address = FFh, PMBus register address = E7h Figure 7-34. CMP-STATUS Register 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 X PROTECT- FLAG WIN- CMP-3 WIN- CMP-2 WIN- CMP-1 WIN- CMP-0 CMP- FLAG- CMP- FLAG- CMP- FLAG- CMP- FLAG- X-0h R-0h R-0h R-0h R-0h R-0h R-0h R-0h R-0h R-0h Table 7-37. CMP-STATUS Register Field Descriptions Bit Field Type Reset Description 15-9 X X 0 Don't care 8 PROTECT-FLAG R 0 0: PROTECT operation not triggered. 1: PROTECT function is completed or in progress. This bit resets to 0 when read. 7, 6, 5, 4 WIN-CMP-X R 0 Window comparator output from respective channels. The output is latched or unlatched based on the WINDOW-LATCH-EN setting in the COMMON-CONFIG register. 3, 2, 1, 0 CMP-FLAG-X R 0 Synchronized comparator output from respective channels.

7.6.14 GPIO-CONFIG Register (address = 24h) [reset = 0000h]

PMBus page address = FFh, PMBus register address = E8h Figure 7-35. GPIO-CONFIG Register 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 GF-EN DEEP- SLEEP- EN GPO-EN GPO-CONFIG GPI-CH-SEL GPI-CONFIG GPI-EN R/W-0h R/W-0h R/W-0h R/W-0h R/W-0h R/W-0h R/W-0h Table 7-38. GPIO-CONFIG Register Field Descriptions Bit Field Type Reset Description 15 GF-EN R/W 0 0: Glitch filter disabled for GP input. This setting provides faster response. 1: Glitch filter enabled for GP input. This setting introduces additional propagation delay but provides robustness.

14 DEEP-SLEEP-EN R/W 0 0: Deep-sleep mode disabled

1: Deep-sleep mode enabled for GP input

13 GPO-EN R/W 0 0: Disable output mode for GPIO pin

1: Enable output mode for GPIO pin 12-9 GPO-CONFIG R/W 0000 STATUS function setting. The GPIO pin is mapped to the following register bits as output: 0001: NVM-BUSY 0100: DAC-0-BUSY 0101: DAC-1-BUSY 0110: DAC-2-BUSY 0111: DAC-3-BUSY 1000: WIN-CMP-0 1001: WIN-CMP-1 1010: WIN-CMP-2 1011:WIN-CMP-3 Others: Invalid www.ti.com DAC63004, DAC53004 SLASEX2A – APRIL 2021 – REVISED DECEMBER 2021 Copyright © 2021 Texas Instruments Incorporated Submit Document Feedback 65 Product Folder Links: DAC63004 DAC53004

Table 7-38. GPIO-CONFIG Register Field Descriptions (continued) Bit Field Type Reset Description 8-5 GPI-CH-SEL R/W 0000 Each bit corresponds to a DAC channel. 0b is disabled and 1b is enabled. GPI-CH-SEL[0]: Channel 0 GPI-CH-SEL[1]: Channel 1 GPI-CH-SEL[2]: Channel 2 GPI-CH-SEL[3]: Channel 3 Example: when GPI-CH-SEL is 0101, both channel-0 and channel-2 are enabled and both channel-1 and channel-3 are disabled. 4-1 GPI-CONFIG R/W 0000 GPIO pin input configuration. Global settings act on the entire device. Channel-specific settings are dependent on the channel selection by the GPI-CH-SEL bits: 0000: DEEP-SLEEP (global). GPIO falling-edge triggers deep- sleep mode, GPIO rising-edge takes the device out of deep-sleep mode. 0010: FAULT-DUMP (global). GPIO falling-edge triggers fault- dump, GPIO = 1 has no effect. 0011: IOUT power-up, down (channel-specific). GPIO falling-edge triggers power-down, GPIO rising-edge triggers power-up. 0100: VOUT power-up/down (channel-specific). The output load is as per the VOUT-PDN-X setting. GPIO falling-edge triggers power-down, GPIO rising-edge triggers power-up. 0101: PROTECT input (global). GPIO falling-edge asserts PROTECT function, GPIO = 1 has no effect. 0111: CLR input (global). GPIO = 0 asserts CLR function, GPIO = 1 has no effect. 1000: LDAC input (channel-specific). GPIO falling-edge asserts LDAC function, GPIO = 1 has no effect. Both the SYNC-CONFIG- X and the GPI-CH-SEL must be configured for every channel. 1001: Start, stop function generation (channel-specific). GPIO falling-edge stops function generation. GPIO rising-edge starts function generation. 1010: Trigger margin-high, low (channel-specific). GPIO falling- edge triggers margin-low. GPIO rising-edge triggers margin-high. 1011: RESET input (global). The falling-edge of the GPIO pin asserts the RESET function. The RESET input must be a pulse. The GPIO rising-edge brings the device out of reset. The RESET configuration must be programmed into the NVM. Otherwise the setting will be cleared after the device reset. 1100: NVM write-protection (global). GPIO falling-edge allows NVM programming. GPIO rising-edge blocks NVM programming. 1101: Register-map lock (global). GPIO falling-edge allows update to the register map. GPIO rising-edge blocks any register map update except a write to the DEV-UNLOCK field through I2C or SPI and to the RESET field through I2C. Others: Not applicable

0 GPI-EN R/W 0 0: Disable input mode for GPIO pin

1: Enable input mode for GPIO pin DAC63004, DAC53004 SLASEX2A – APRIL 2021 – REVISED DECEMBER 2021 www.ti.com

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7.6.15 DEVICE-MODE-CONFIG Register (address = 25h) [reset = 0000h]

PMBus page address = FFh, PMBus register address = E9h Figure 7-36. DEVICE-MODE-CONFIG Register 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 RESERVED DIS- MODE-IN RESERVED PROTECT- CONFIG RESERVED X R/W-0h R/W-0h R/W-0h R/W-0h R/W-0h X-0h Table 7-39. DEVICE-MODE-CONFIG Register Field Descriptions Bit Field Type Reset Description 15-14 RESERVED R/W 00 Always write 0b00 13 DIS-MODE-IN R/W 0 Write 1 to this bit for low-power consumption. 12-10 RESERVED R/W 0 Always write 0b000 9-8 PROTECT-CONFIG R/W 00 00: Switch to Hi-Z power-down (no slew) 01: Switch to DAC code stored in NVM (no slew) and then switch to Hi-Z power-down 10: Slew to margin-low code and then switch to Hi-Z power-down 11: Slew to margin-high code and then switch to Hi-Z power-down 7-5 RESERVED R/W 0 Always write 0b000 4-0 X R/W 00h Don't care

7.6.16 INTERFACE-CONFIG Register (address = 26h) [reset = 0000h]

Figure 7-37. INTERFACE-CONFIG Register 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 X TIMEOUT- EN X EN-PMBUS X FSDO- EN X SDO- EN X-0h R/W-0h X-0h R/W-0h X-0h R/W-0h X-0h R/W-0h Table 7-40. INTERFACE-CONFIG Register Field Descriptions Bit Field Type Reset Description 15-13 X X 0h Don't care

12 TIMEOUT-EN R/W 0 0: I2C timeout disabled

1: I2C timeout enabled 11-9 X X 0h Don't care

8 EN-PMBUS R/W 0 0: PMBus disabled

1: Enable PMBus 7-3 X X 00h Don't care

2 FSDO-EN R/W 0 0: Fast SDO disabled

1: Fast SDO enabled

1 X X 0 Don't care

0 SDO-EN R/W 0 0: SDO disabled

1: SDO enabled on GPIO pin www.ti.com DAC63004, DAC53004 SLASEX2A – APRIL 2021 – REVISED DECEMBER 2021 Copyright © 2021 Texas Instruments Incorporated Submit Document Feedback 67 Product Folder Links: DAC63004 DAC53004

7.6.17 SRAM-CONFIG Register (address = 2Bh) [reset = 0000h]

PMBus page address = FFh, PMBus register address = EFh Figure 7-38. SRAM-CONFIG Register 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 X SRAM-ADDR X-0h R/W-0h Table 7-41. SRAM-CONFIG Register Field Descriptions Bit Field Type Reset Description 15-8 X X 0h Don't care 7-0 SRAM-ADDR R/W 0h 8-bit SRAM address. Writing to this register field configures the SRAM address to be accessed next. This address automatically increments after a write to the SRAM.

7.6.18 SRAM-DATA Register (address = 2Ch) [reset = 0000h]

PMBus page address = FFh, PMBus register address = F0h Figure 7-39. SRAM-DATA Register 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 SRAM-DATA R/W-0h Table 7-42. SRAM-DATA Register Field Descriptions Bit Field Type Reset Description 15-0 SRAM-ADDR R/W 0h 16-bit SRAM data. This data is written to or read from the address configured in the SRAM-CONFIG register. DAC63004, DAC53004 SLASEX2A – APRIL 2021 – REVISED DECEMBER 2021 www.ti.com

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7.6.19 DAC-X-DATA-8BIT Register (address = 40h, 41h, 42h, 43h) [reset = 0000h]

PMBus page address = Not applicable, PMBus register address = Not applicable Figure 7-40. DAC-X-DATA-8BIT Register 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 DAC-X-DATA-8BIT[7:0] X R/W-0h X-0h Table 7-43. DAC-X-DATA-8BIT Register Field Descriptions Bit Field Type Reset Description 15-8 DAC-X-DATA-8BIT[7:0] R/W 00h 8-bit data for current output. This register provides faster update rate in the I2C mode. Data are in straight-binary format 7-0 X X 00h Not applicable

7.6.20 BRDCAST-DATA Register (address = 50h) [reset = 0000h]

PMBus page address = FFh, PMBus register address = F1h Figure 7-41. BRDCAST-DATA Register 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 BRDCAST-DATA[11:0] BRDCAST-DATA[9:0] X R/W-0h X-0h Table 7-44. BRDCAST-DATA Register Field Descriptions Bit Field Type Reset Description 15-4 BRDCAST-DATA[11:0] BRDCAST-DATA[9:0] R/W 000h Broadcast code for all DAC channels Data are in straight-binary format. MSB left-aligned. Use the following bit-alignment: DAC63004: {BRDCAST-DATA[11:0]} DAC53004: {BRDCAST-DATA[9:0], X, X} X = Don't care bits. The BRD-CONFIG-X bit in the DAC-X-FUNC-CONFIG register must be enabled for the respective channels. 3-0 X X 0h Don't care.

7.6.21 PMBUS-PAGE Register [reset = 0300h]

PMBus page address = X, PMBus register address = 00h Figure 7-42. PMBUS-PAGE Register 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 PMBUS-PAGE X R/W-03h X-00h Table 7-45. PMBUS_OPERATION Register Field Descriptions Bit Field Type Reset Description 15-8 PMBUS-PAGE R/W 03h 8-bit PMBus page address as specified in Table 7-21. 7-0 X X 00h Not applicable www.ti.com DAC63004, DAC53004 SLASEX2A – APRIL 2021 – REVISED DECEMBER 2021 Copyright © 2021 Texas Instruments Incorporated Submit Document Feedback 69 Product Folder Links: DAC63004 DAC53004

7.6.22 PMBUS-OP-CMD-X Register [reset = 0000h]

PMBus page address = 00h, 01h, 02h, 03h, PMBus register address = 01h Figure 7-43. PMBUS-OP-CMD-X Register (X = 0, 1, 2, 3) 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 PMBUS-OPERATION-CMD-X X R/W-00h X-00h Table 7-46. PMBUS-OP-CMD-X Register Field Descriptions Bit Field Type Reset Description 15-8 PMBUS-OPERATION-CMD-X R/W 00h PMBus operation commands: 00h: Turn off 80h: Turn on A4h: Margin high, DAC output margins high to DAC-X-MARGIN- HIGH code 94h: Margin low, DAC output margins low to DAC-X-MARGIN- LOW code 7-0 X X 00h Not applicable

7.6.23 PMBUS-CML Register [reset = 0000h]

PMBus page address = X, PMBus register address = 78h Figure 7-44. PMBUS-CML Register 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 X CML X N/A X-00h R/W-0h X-0h X-00h Table 7-47. PMBUS-CML Register Field Descriptions Bit Field Type Reset Description 15-10 X X 00h Don't care

9 CML R/W 0 0: No communication fault

1: PMBus communication fault for write with incorrect number of clocks, read before write command, invalid command address, and invalid or unsupported data value; reset this bit by writing 1.

8 X X 0h Don't care

7-0 X X 00h Not applicable

7.6.24 PMBUS-VERSION Register [reset = 2200h]

PMBus page address = X, PMBus register address =98h Figure 7-45. PMBUS-VERSION Register 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 PMBUS-VERSION X R-22h X-00h Table 7-48. PMBUS-VERSION Register Field Descriptions Bit Field Type Reset Description 15-8 PMBUS-VERSION R 22h PMBus version 7-0 X X 00h Not applicable DAC63004, DAC53004 SLASEX2A – APRIL 2021 – REVISED DECEMBER 2021 www.ti.com

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8 Application and Implementation

Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes, as well as validating and testing their design implementation to confirm system functionality.

8.1 Application Information

The DACx3004 are quad-channel buffered, force-sense output, voltage-output and current-output smart DACs that include an NVM and internal reference, and available in a tiny 3-mm × 3-mm package. In voltage-output mode, short the OUTx and FBx pins for each channel. In current-output mode, leave the FBx pins unconnected. The FBx pins function as inputs in comparator mode. The external reference must not exceed VDD, either during transient or steady-state conditions. For the best Hi-Z output performance, use a pullup resistor on the VREF pin to VDD. In case the VDD remains floating during the off condition, place a 100-k Ω resistor to AGND for proper detection of the VDD off condition. All the digital outputs are open drain; use external pullup resistors on these pins. The interface protocol is detected at power-on, and the device locks to the protocol as long as VDD is on. In I 2C mode, when allocating the I 2C addresses in the system, consider the broadcast address as well. I2C timeout can be enabled for robustness. SPI mode is 3-wire by default. Configure the GPIO pin as SDO in the NVM for SPI readback capability. The SPI clock speed in readback mode is slower than that in write mode. Power-down mode sets the DAC outputs in Hi-Z by default. Change the configuration appropriately for different power-down settings. The DAC channels can also power-up with a programmed DAC code in the NVM.

8.2 Typical Application

A power-supply margining and scaling circuit is used to trim, scale, or test the output of a power converter. This example circuit is used to test a system by margining the power supplies for adaptive voltage scaling or to program a desired value at the output. Adjustable power supplies, such as low-dropout regulators (LDOs) and DC/DC converters, provide a feedback or adjust the input that is used to set the desired output. A precision voltage-output DAC is the best choice for controlling the power-supply output linearly. Figure 8-1 shows a control circuit for a switch-mode power supply (SMPS) using the DACx3004. Typical applications of power-supply margining are communications equipment, enterprise servers, test and measurement, and general-purpose power-supply modules. SMPS / LDO R1 VFB SENSE PH GND VOUTIN BOOT CLCB L DACx3004 VDD VIN VOUT/ IOUT VOUT/ IOUT VOUT/ IOUT VOUT/ IOUT DAC REG DAC BUF DAC REG DAC BUF DAC REG DAC BUF DAC REG DAC BUF NVMInternal Reference LDO Output Configuration Logic VREF CAP AGND Digital Interface SCL/SYNC SDA/SCLK A0/SDI PROTECT 1.5 μF 0.1 μ 10 kΩ Power-supply: 0 - 3 Figure 8-1. Voltage Margining and Scaling www.ti.com DAC63004, DAC53004 SLASEX2A – APRIL 2021 – REVISED DECEMBER 2021 Copyright © 2021 Texas Instruments Incorporated Submit Document Feedback 71 Product Folder Links: DAC63004 DAC53004

8.2.1 Design Requirements

Table 8-1. Design Parameters PARAMETER VALUE Power-supply nominal output 3.3 V Reference voltage of the converter (VFB) 0.6 V Margin ±10% (that is, 2.97 V to 3.63 V) DAC output range 1.8 V Nominal current through R1 and R2 100 µA

8.2.2 Detailed Design Procedure

The DACx3004 features a Hi-Z power-down mode that is set by default at power-up, unless the device is programmed otherwise using the NVM. When the DAC output is at Hi-Z, the current through R 3 is zero and the SMPS is set at the nominal output voltage of 3.3 V. To have the same nominal condition when the DAC powers up, bring up the device at the same output as V FB (that is 0.6 V). This configuration makes sure there is no current through R3 even at power-up. Calculate R1 as (VOUT – VFB) / 100 µA = 27 kΩ. To achieve ±10% margin-high and margin-low conditions, the DAC must sink or source additional current through R1. Calculate the current from the DAC (IMARGIN) using Equation 10 as 12 µA. I M ARGIN = V OUT × 1 + MAR G I N − V F B R 1 − I NOM IN A L (10) where

• IMARGIN is the margin current sourced or sinked from the DAC.
• MARGIN is the percentage margin value divided by 100.
• INOMINAL is the nominal current through R1 and R2. To calculate the value of R 3, first decide the DAC output range, and make sure to avoid the codes near zero-scale and full-scale for safe operation in the linear region. A DAC output of 20 mV is a safe consideration as the minimum output, and (1.8 V – 0.6 V – 20 mV = 1.18 V) as the maximum output. When the DAC output is at 20 mV, the power supply goes to margin high, and when the DAC output is at 1.18 V, the power supply goes to margin low. Calculate the value of R3 using Equation 11 as 48.3 kΩ. Choose a standard resistor value and adjust the DAC outputs. Choosing R 3 = 47 k Ω makes the DAC margin high code as 1.164 V and the DAC margin low code as 36 mV. R 3 = V DAC − V FB I M ARG I N (11) When the DACx3004 are set in the current-output mode, the series resistor R 3 is not required. Set the DAC output at the current-output range of –25 µA to +25 µA, and set the DAC code appropriately to achieve a margin current of ±12 µA. The DACx3004 have a slew-rate feature that is used to toggle between margin high, margin low, and nominal outputs with a defined slew rate. See Section 7.6.7 for the slew-rate setting details. Note The DAC-X-MARGIN-HIGH register value in DACx3004 results in the margin-low value at the power supply output. Similarly, the DAC-X-MARGIN-LOW register value in DACx3004 results in the margin- high value at the power-supply output. DAC63004, DAC53004 SLASEX2A – APRIL 2021 – REVISED DECEMBER 2021 www.ti.com

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The pseudocode for getting started with a power-supply control application is as follows: //SYNTAX: WRITE <REGISTER NAME (Hex code)>, <MSB DATA>, <LSB DATA> //Write DAC code for nominal output (repeat for all DAC channels) //For a 1.8-V output range, the 10-bit hex code for 0.6 V is 0x155. With 16-bit left alignment, this becomes 0x5540 WRITE DAC_DATA(0x19), 0x55, 0x40 //Power-up voltage output on all channels, enables internal reference WRITE COMMON-CONFIG(0x1F), 0x12, 0x49 //Set channel 0 gain setting to 1.5x internal reference (1.8 V) WRITE DAC-0-VOUT-CMP-CONFIG(0x3), 0x08, 0x00 //Set channel 1 gain setting to 1.5x internal reference (1.8 V) WRITE DAC-1-VOUT-CMP-CONFIG(0x9), 0x08, 0x00 //Set channel 2 gain setting to 1.5x internal reference (1.8 V) WRITE DAC-2-VOUT-CMP-CONFIG(0xF), 0x08, 0x00 //Set channel 3 gain setting to 1.5x internal reference (1.8 V) WRITE DAC-3-VOUT-CMP-CONFIG(0x15), 0x08, 0x00 //Configure GPI for Margin-High, Low trigger for all channels WRITE GPIO-CONFIG(0x24), 0x01, 0xF5 //Set slew rate and code step (repeat for all channels) //CODE_STEP: 2 LSB, SLEW_RATE: 60.72 µs/step WRITE DAC-0-FUNC-CONFIG(0x06), 0x00, 0x17 //Write DAC margin high code (repeat for all channels) //For a 1.8-V output range, the 10-bit hex code for 1.164 V is 0x296. With 16-bit left alignment, this becomes 0xA540 WRITE DAC-0-MARGIN-HIGH(0x01), 0xA5, 0x40 //Write DAC margin low code (repeat for all channels) //For a 1.8-V output range, the 10-bit hex code for 36 mV is 0x14. With 16-bit left alignment, this becomes 0x0500 WRITE DAC-0-MARGIN-LOW(0x02), 0x05, 0x00 //Save settings to NVM WRITE COMMON-TRIGGER(0x20), 0x00, 0x02

8.2.3 Application Curves

Figure 8-2. Power-Supply Margin High Figure 8-3. Power-Supply Margin Low www.ti.com DAC63004, DAC53004 SLASEX2A – APRIL 2021 – REVISED DECEMBER 2021 Copyright © 2021 Texas Instruments Incorporated Submit Document Feedback 73 Product Folder Links: DAC63004 DAC53004

9 Power Supply Recommendations

The DACx3004 family of devices does not require specific power-supply sequencing. These devices require a single power supply, VDD. However, make sure the external voltage reference is applied after VDD. Use a 0.1-µF decoupling capacitor for the VDD pin. Use a bypass capacitor with a value approximately 1.5 µF for the CAP pin.

10 Layout

10.1 Layout Guidelines

The DACx3004 pin configuration separates the analog, digital, and power pins for an optimized layout. For signal integrity, separate the digital and analog traces, and place decoupling capacitors close to the device pins.

10.2 Layout Example

Figure 10-1. Layout Example Note: The ground and power planes have been omitted for clarity. Connect the thermal pad to ground. DAC63004, DAC53004 SLASEX2A – APRIL 2021 – REVISED DECEMBER 2021 www.ti.com

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11 Device and Documentation Support

TI offers an extensive line of development tools. Tools and software to evaluate the performance of the device, generate code, and develop solutions are listed below.

11.1 Receiving Notification of Documentation Updates

To receive notification of documentation updates, navigate to the device product folder on ti.com. Click on Subscribe to updates to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document.

11.2 Support Resources

TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight from the experts. Search existing answers or ask your own question to get the quick design help you need. Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

11.3 Trademarks

PMBus™ is a trademark of SMIF, Inc.. TI E2E™ is a trademark of Texas Instruments. All trademarks are the property of their respective owners.

11.4 Electrostatic Discharge Caution

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

11.5 Glossary

TI Glossary This glossary lists and explains terms, acronyms, and definitions.

12 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. www.ti.com DAC63004, DAC53004 SLASEX2A – APRIL 2021 – REVISED DECEMBER 2021 Copyright © 2021 Texas Instruments Incorporated Submit Document Feedback 75 Product Folder Links: DAC63004 DAC53004

www.ti.com 12-Dec-2021 Addendum-Page 1 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead finish/ Ball material (6) MSL Peak Temp (3) Op Temp (°C) Device Marking (4/5) Samples DAC53004RTER ACTIVE WQFN RTE 16 3000 RoHS & Green NIPDAU Level-2-260C-1 YEAR -40 to 125 D53004 DAC53004RTET ACTIVE WQFN RTE 16 250 RoHS & Green NIPDAU Level-2-260C-1 YEAR -40 to 125 D53004 DAC63004RTER ACTIVE WQFN RTE 16 3000 RoHS & Green NIPDAU Level-2-260C-1 YEAR -40 to 125 D63004 DAC63004RTET ACTIVE WQFN RTE 16 250 RoHS & Green NIPDAU Level-2-260C-1 YEAR -40 to 125 D63004 PDAC63004RTET ACTIVE WQFN RTE 16 250 TBD Call TI Call TI -40 to 125 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement. (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two lines if the finish value exceeds the maximum column width.

www.ti.com 12-Dec-2021 Addendum-Page 2 Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant PACKAGE MATERIALS INFORMATION www.ti.com 13-Dec-2021 Pack Materials-Page 1

*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) DAC53004RTER WQFN RTE 16 3000 367.0 367.0 35.0 DAC53004RTET WQFN RTE 16 250 210.0 185.0 35.0 DAC63004RTER WQFN RTE 16 3000 367.0 367.0 35.0 DAC63004RTET WQFN RTE 16 250 210.0 185.0 35.0 PACKAGE MATERIALS INFORMATION www.ti.com 13-Dec-2021 Pack Materials-Page 2

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