DAC082S085CIMMX/NO.A

DAC082S085 TI | Alldatasheet

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Technical content

Sample & Buy T echnical Documents Tools & Software Support & Community Reference Design An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. DAC082S085 SNAS365G –MAY 2006–REVISED JUNE 2016 DAC082S0858-BitMicroPowerDUALDigital-to-AnalogConverterWithRail-to-RailOutput

1 Features

1• Ensured Monotonicity

• Low Power Operation
• Rail-to-Rail Voltage Output
• Power-On Reset to 0 V
• Simultaneous Output Updating
• Wide Power Supply Range: 2.7 V to 5.5 V
• Industry's Smallest Package
• Power-Down Modes
• Key Specifications: – Resolution: 8 Bits – INL: ±0.5 LSB (Maximum) – DNL: 0.18 / –0.13 LSB (Maximum) – Settling Time: 4.5 µs (Maximum) – Zero Code Error: 15 mV (Maximum) – Full-Scale Error: –0.75% FS (Maximum) – Supply Power: – Normal: 0.6 mW (3 V) / 1.6 mW (5 V) (Typical) – Power Down: 0.3 µW (3 V) / 0.8 µW (5 V) (Typical)

2 Applications

• Battery-Powered Instruments
• Digital Gain and Offset Adjustment
• Programmable Voltage and Current Sources
• Programmable Attenuators

3 Description

The DAC082S085 device is a full-featured, general- purpose, DUAL, 8-bit, voltage-output, digital-to-analog converter (DAC) that can operate from a single 2.7-V to 5.5-V supply and consumes 0.6 mW at 3 V and 1.6 mW at 5 V. The DAC082S085 is packaged in 10-pin SON and VSSOP packages. The 10-pin WSON package makes the DAC082S085 the smallest DUAL DAC in its class. The on-chip output amplifier allows rail-to-rail output swing, and the three-wire serial interface operates at clock rates up to 40 MHz over the entire supply voltage range. Competitive devices are limited to 25-MHz clock rates at supply voltages in the 2.7 V to 3.6 V range. The serial interface is compatible with standard SPI™ , QSPI, MICROWIRE, and DSP interfaces. Device Information(1) PART NUMBER PACKAGE BODY SIZE (NOM) DAC082S085 VSSOP (10) 3.00 mm × 3.00 mm WSON (10) 3.00 mm × 3.00 mm (1) For all available packages, see the orderable addendum at the end of the data sheet. DNL at VA = 3 V

SNAS365G –MAY 2006–REVISED JUNE 2016 www.ti.com Product Folder Links: DAC082S085 Submit Documentation Feedback Copyright © 2006–2016, Texas Instruments Incorporated Table of Contents

12.2 Receiving Notification of Documentation Updates 24

13 Mechanical, Packaging, and Orderable

4 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision F (March 2013) to Revision G Page

• Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Changes from Revision E (March 2013) to Revision F Page

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5 Description (continued)

The reference for the DAC082S085 serves both channels and can vary in voltage between 1 V and VA, providing the widest possible output dynamic range. The DAC082S085 has a 16-bit input shift register that controls the outputs to be updated, the mode of operation, the power-down condition, and the binary input data. Both outputs can be updated simultaneously or individually depending on the setting of the two mode of operation bits. A power-on reset circuit ensures that the DAC output powers up to 0 V and remains there until there is a valid write to the device. A power-down feature reduces power consumption to less than a microWatt with three different termination options. The low power consumption and small packages of the DAC082S085 make it an excellent choice for use in battery-operated equipment. The DAC082S085 is one of a family of pin-compatible DACs, including the 10-bit DAC102S085 and the 12-bit DAC124S085. The DAC082S085 operates over the extended industrial temperature range of −40°C to 105°C.

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6 Pin Configuration and Functions

NO. NAME 1 VA Supply Power supply input. Must be decoupled to GND. 2 VOUTA Analog Output Channel A analog output voltage. 3 VOUTB Analog Output Channel B analog output voltage.

4 NC — Not connected

5 NC — Not connected

6 GND Ground Ground reference for all on-chip circuitry. 7 VREFIN Analog Input Unbuffered reference voltage shared by all channels. Must be decoupled to GND. 8 DIN Digital Input Serial data input. Data is clocked into the 16-bit shift register on the falling edges of SCLK after the fall of SYNC.

9 SYNC Digital Input

Frame synchronization input for the data input. When this pin goes low, it enables the input shift register and data is transferred on the falling edges of SCLK. The DAC is updated on the 16th clock cycle unless SYNC is brought high before the 16th clock, in which case the rising edge of SYNC acts as an interrupt and the write sequence is ignored by the DAC. 10 SCLK Digital Input Serial clock input. Data is clocked into the input shift register on the falling edges of this pin. PAD PAD Ground Exposed die attach pad can be connected to ground or left floating. Soldering the pad to the PCB offers optimal thermal performance and enhances package self-alignment during reflow.

www.ti.com SNAS365G –MAY 2006–REVISED JUNE 2016 Product Folder Links: DAC082S085 Submit Documentation FeedbackCopyright © 2006–2016, Texas Instruments Incorporated (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) All voltages are measured with respect to GND = 0 V, unless otherwise specified. (3) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and specifications. (4) When the input voltage at any pin exceeds 5.5 V or is less than GND, the current at that pin must be limited to 10 mA. The 20-mA maximum package input current rating limits the number of pins that can safely exceed the power supplies with an input current of 10 mA to two. (5) The absolute maximum junction temperature (TJmax) for this device is 150°C. The maximum allowable power dissipation is dictated by TJmax, the junction-to-ambient thermal resistance (RθJA), and the ambient temperature (TA), and can be calculated using the formula PDMAX = (TJmax − TA) / RθJA. The values for maximum power dissipation is reached only when the device is operated in a severe fault condition (for example, when input or output pins are driven beyond the operating ratings, or the power supply polarity is reversed).

7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)(2)(3) MIN MAX UNIT Supply voltage, VA 6.5 V Voltage on any input pin –0.3 6.5 V Input current at any pin(4) 10 mA Package input current(4) 20 mA Power consumption at TA = 25°C See(5) Junction temperature, TJ 150 °C Storage temperature, Tstg –65 150 °C (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) Human-body model is 100-pF capacitor discharged through a 1.5-kΩ resistor. Machine model is 220 pF discharged through 0 Ω.

7.2 ESD Ratings

V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)(2) ±2500 V Machine model (MM) ±250 (1) All voltage are measured with respect to GND = 0 V, unless otherwise specified. (2) The inputs are protected as shown below. Input voltage magnitudes up to 5.5 V, regardless of VA, does not cause errors in the conversation result. For example, if VA is 3 V, the digital input pins can be driven with a 5-V logic device.

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)(1) MIN MAX UNIT Operating temperature, TA –40 105 °C Supply voltage, VA 2.7 5.5 V Reference voltage, VREFIN 1 VA V Digital input voltage(2) 0 5.5 V Output load 0 1500 pF SCLK frequency Up to 40 MHz

SNAS365G –MAY 2006–REVISED JUNE 2016 www.ti.com Product Folder Links: DAC082S085 Submit Documentation Feedback Copyright © 2006–2016, Texas Instruments Incorporated (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.

7.4 Thermal Information

THERMAL METRIC(1) DAC082S085 UNITDGS (VSSOP) DSC (WSON)

10 PINS 10 PINS

RθJA Junction-to-ambient thermal resistance 240 250 °C/W RθJC(top) Junction-to-case (top) thermal resistance 53.3 40.7 °C/W RθJB Junction-to-board thermal resistance 78.9 23.7 °C/W ψJT Junction-to-top characterization parameter 4.8 0.4 °C/W ψJB Junction-to-board characterization parameter 77.6 23.8 °C/W RθJC(bottom) Junction-to-case (bottom) thermal resistance N/A 4.7 °C/W (1) To ensure accuracy, it is required that VA and VREFIN be well bypassed. (2) Typical figures are at TJ = 25°C, and represent most likely parametric norms. Test limits are specified to AOQL (Average Outgoing Quality Level). (3) This parameter is specified by design or characterization and is not tested in production.

7.5 Electrical Characteristics

The following specifications apply for VA = 2.7 V to 5.5 V, VREFIN = VA, CL = 200 pF to GND, fSCLK = 30 MHz, input code range 3 to 252. All limits are at TA = 25°C, unless otherwise specified.(1) PARAMETER TEST CONDITIONS MIN TYP(2) MAX UNIT STATIC PERFORMANCE Resolution TMIN ≤ TA ≤ TMAX 8 Bits Monotonicity TMIN ≤ TA ≤ TMAX 8 Bits INL Integral non-linearity TA = 25°C ±0.14 LSB TMIN ≤ TA ≤ TMAX ±0.5 DNL Differential non-linearity VA = 2.7 V to 5.5 V TA = 25°C Max 0.04 LSBMin −0.02 TMIN ≤ TA ≤ TMAX −0.13 0.18 ZE Zero code error IOUT = 0 TA = 25°C 4 mV TMIN ≤ TA ≤ TMAX 15 FSE Full-scale error IOUT = 0 TA = 25°C −0.1 %FSR TMIN ≤ TA ≤ TMAX −0.75 GE Gain error All ones Loaded to DAC register TA = 25°C −0.2 %FSR TMIN ≤ TA ≤ TMAX −1 ZCED Zero code error drift −20 µV/°C TC GE Gain error tempco VA = 3 V −0.7 ppm/°C VA = 5 V –1 OUTPUT CHARACTERISTICS Output voltage(3) TMIN ≤ TA ≤ TMAX 0 VREFIN V IOZ High-impedance output leakage current(3) TMIN ≤ TA ≤ TMAX ±1 µA ZCO Zero code output VA = 3 V, IOUT = 200 µA 1.3 mV VA = 3 V, IOUT = 1 mA 6 VA = 5 V, IOUT = 200 µA 7 VA = 5 V, IOUT = 1 mA 10 FSO Full-scale output VA = 3 V, IOUT = 200 µA 2.984 V VA = 3 V, IOUT = 1 mA 2.934 VA = 5 V, IOUT = 200 µA 4.989 VA = 5 V, IOUT = 1 mA 4.958 IOS Output short-circuit current (source) VA = 3 V, VOUT = 0 V, Input Code = FFh –56 mA VA = 5 V, VOUT = 0 V, Input Code = FFh –69 Output short-circuit current (sink) VA = 3 V, VOUT = 3 V, Input Code = 00h 52 mA VA = 5 V, VOUT = 5 V, Input Code = 00h 75 IO Continuous output current(3) Available on each DAC output TMIN ≤ TA ≤ TMAX 11 mA CL Maximum load capacitance RL = ∞ 1500 pF RL = 2 kΩ 1500

www.ti.com SNAS365G –MAY 2006–REVISED JUNE 2016 Product Folder Links: DAC082S085 Submit Documentation FeedbackCopyright © 2006–2016, Texas Instruments Incorporated Electrical Characteristics (continued) The following specifications apply for VA = 2.7 V to 5.5 V, VREFIN = VA, CL = 200 pF to GND, fSCLK = 30 MHz, input code range 3 to 252. All limits are at TA = 25°C, unless otherwise specified.(1) PARAMETER TEST CONDITIONS MIN TYP(2) MAX UNIT ZOUT DC output impedance 7.5 Ω REFERENCE INPUT CHARACTERISTICS VREFIN Input range minimum TA = 25°C 0.2 VTMIN ≤ TA ≤ TMAX 1 Input range maximum TMIN ≤ TA ≤ TMAX VA Input impedance 60 kΩ LOGIC INPUT CHARACTERISTICS IIN Input current(3) TMIN ≤ TA ≤ TMAX ±1 µA VIL Input low voltage(3) VA = 3 V TA = 25°C 0.9 V TMIN ≤ TA ≤ TMAX 0.6 VA = 5 V TA = 25°C 1.5 TMIN ≤ TA ≤ TMAX 0.8 VIH Input high voltage(3) VA = 3 V TA = 25°C 1.4 V TMIN ≤ TA ≤ TMAX 2.1 VA = 5 V TA = 25°C 2.1 TMIN ≤ TA ≤ TMAX 2.4 CIN Input capacitance(3) TMIN ≤ TA ≤ TMAX 3 pF POWER REQUIREMENTS VA Supply voltage minimum TMIN ≤ TA ≤ TMAX 2.7 V Supply voltage maximum TMIN ≤ TA ≤ TMAX 5.5 IN Normal supply current (output unloaded) fSCLK = 30 MHz VA = 2.7 V to 3.6 V TA = 25°C 210 µA TMIN ≤ TA ≤ TMAX 270 VA = 4.5 V to 5.5 V TA = 25°C 320 TMIN ≤ TA ≤ TMAX 410 fSCLK = 0 VA = 2.7 V to 3.6 V 190 VA = 4.5 V to 5.5 V 290 IPD Power down supply current (output unloaded, SYNC = DIN = 0 V after PD mode loaded) All PD Modes(3) VA = 2.7 V to 3.6 V TA = 25°C 0.1 µA TMIN ≤ TA ≤ TMAX 1 VA = 4.5 V to 5.5 V TA = 25°C 0.15 µA TMIN ≤ TA ≤ TMAX 1 PN Normal supply power (output unloaded) fSCLK = 30 MHz VA = 2.7 V to 3.6 V TA = 25°C 0.6 mW TMIN ≤ TA ≤ TMAX 1 VA = 4.5 V to 5.5 V TA = 25°C 1.6 TMIN ≤ TA ≤ TMAX 2.3 fSCLK = 0 VA = 2.7 V to 3.6 V 0.6 VA = 4.5 V to 5.5 V 1.5 PPD Power down supply current (output unloaded, SYNC = DIN = 0 V after PD mode loaded) All PD Modes(3) VA = 2.7 V to 3.6 V TA = 25°C 0.3 µW TMIN ≤ TA ≤ TMAX 3.6 VA = 4.5 V to 5.5 V TA = 25°C 0.8 TMIN ≤ TA ≤ TMAX 5.5

(2) This parameter is specified by design or characterization and is not tested in production.

7.6 Timing Requirements

Figure 1. Serial Timing Diagram

7.7 Typical Characteristics

Figure 2. Input and Output Transfer Characteristic Figure 3. INL at VA = 3 V Figure 4. INL at VA = 5 V Figure 5. DNL at VA = 3 V Figure 6. DNL at VA = 5 V Figure 7. INL/DNL vs VREFIN at VA = 3 V

2.5 kŸ 100 kŸ

8 BIT DAC

Copyright © 2016, Texas Instruments Incorporated 100 kŸ 2.5 kŸ DAC082S085 SNAS365G –MAY 2006–REVISED JUNE 2016 www.ti.com Product Folder Links: DAC082S085 Submit Documentation Feedback Copyright © 2006–2016, Texas Instruments Incorporated

8 Detailed Description

8.1 Overview

The DAC082S085 is fabricated on a CMOS process with an architecture that consists of switches and resistor strings that are followed by an output buffer.

8.2 Functional Block Diagram

8.2.1 Feature Description

8.2.1.1 DAC Architecture

The DAC082S085 is fabricated on a CMOS process with an architecture that consists of switches and resistor strings that are followed by an output buffer. The reference voltage is externally applied at VREFIN and is shared by both DACs. For simplicity, a single resistor string is shown in Figure 29. This string consists of 256 equal valued resistors with a switch at each junction of two resistors, plus a switch to ground. The code loaded into the DAC register determines which switch is closed, connecting the proper node to the amplifier. The input coding is straight binary with an ideal output voltage calculated in Equation 1: VOUTA,B = VREFIN × (D / 256) where

• D is the decimal equivalent of the binary code that is loaded into the DAC register. (D can take on any value between 0 and 255. This configuration ensures that the DAC is monotonic.) (1)

Figure 29. DAC Resistor String

8.2.1.2 Output Amplifiers

amplifier are described in Electrical Characteristics. code and full-scale outputs for given load currents are available in the Electrical Characteristics.

8.2.1.3 Reference Voltage

8.2.1.4 Power-On Reset

valid write sequence is made to the DAC.

8.3 Device Functional Modes

8.3.1 Power-Down Modes

2.5 kΩ or 100 kΩ to ground respectively (see Table 1).

0 0 Write to specified register but do not update outputs. 0 1 Write to specified register and update outputs. 1 0 Write to all registers and update outputs. Table 1. Power-Down Modes Time) is typically tWU µs as stated in Timing Requirements.

8.4 Programming

8.4.1 Serial Interface

at clock rates up to 40 MHz. See Figure 1 for information on a write sequence. sequences to minimize power consumption.

8.4.2 Input Shift Register

updating their outputs, or powering down both outputs). The final twelve bits of the shift register are the data bits. the DAC register on the sixteenth falling edge of SCLK. See Figure 1. Figure 30. Input Register Contents there is no change in the mode of operation or in the DAC output voltages.

8.4.3 DSP and Microprocessor Interfacing

to hasten the design process.

8.4.3.1 ADSP-2101/ADSP2103 Interfacing

register and must be configured for Internal Clock Operation, Active Low Framing and 16-bit Word Length. Transmission is started by writing a word to the TX register after the SPORT mode has been enabled. Figure 31. ADSP-2101/2103 Interface the 80C51/80L51 transmits data with the LSB first while the DAC082S085 requires data with the MSB first. Figure 32. 80C51/80L51 Interface line of the DAC082S085 is driven from a port line (PC7 in the figure), similar to the 80C51/80L51. second byte of data to the DAC, after which PC7 must be raised to end the write sequence. Figure 33. 68HC11 Interface

0.1 PF+10 PF

8.4.3.4 Microwire Interface

Figure 34. Microwire Interface

9 Application and Implementation

validate and test their design implementation to confirm system functionality.

9.1 Application Information

to-rail amplifier must be used if the amplifier supplies are limited to ±5 V.

9.2 Typical Application

9.2.1 Bipolar Operation

Figure 35. Bipolar Operation

9.2.1.1 Design Requirements

• The DAC082S085 uses a single supply.
• The output is required to be bipolar with a voltage range of ±5 V.
• Dual supplies are used for the output amplifier.

9.2.1.2 Detailed Design Procedure

• D is the input code in decimal form (With VA = 5 V and R1 = R2) (3) Table 2 lists the rail-to-rail amplifiers suitable for this application.

Table 2. Some Rail-to-Rail Amplifiers

9.2.1.3 Application Curve

Figure 36. Bipolar Input / Output Transfer Characteristic

10 Power Supply Recommendations

the supply pin (VA) and VREFIN can be connected together and share the same supply voltage.

10.1 Using References as Power Supplies

10.1.1 LM4130

reduces output noise. The LM4130 comes in a space-saving, 5-pin SOT-23. Figure 37. The LM4130 as a Power Supply

10.1.2 LM4050

DAC082S085. It is available in 4.096-V and 5-V versions and comes in a space-saving, 3-pin SOT-23. Figure 38. The LM4050 as a Power Supply

• VZ(min) and VZ(max) are the nominal LM4050 output voltages ± the LM4050 output tolerance over temperature

• IZ(max) is the maximum allowable current through the LM4050
• IZ(min) is the minimum current required by the LM4050 for proper regulation
• IDAC(max) is the maximum DAC082S085 supply current (5)

10.1.3 LP3985

LP3985 comes in a space-saving, 5-pin SOT-23 and 5-bump DSBGA packages. Figure 39. Using the LP3985 Regulator understanding of the capacitor specification is required to ensure correct device operation.

10.1.4 LP2980

grade. It is available in 3-V, 3.3-V, and 5-V versions, among others. Figure 40. Using the LP2980 Regulator

11 Layout

11.1 Layout Guidelines

ground plane design uses a fencing technique to prevent the mixing of analog and digital ground current. return path below their traces. board. The clock and data lines must have controlled impedances.

11.2 Layout Example

Figure 41. DAC082S085 Layout Example

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12 Device and Documentation Support

12.1 Device Support

12.1.1 Device Nomenclature

12.1.1.1 Specification Definitions

DIFFERENTIAL NON-LINEARITY (DNL) is the measure of the maximum deviation from the ideal step size of 1 LSB, which is VREF / 256 = VA / 256. DAC-to-DAC CROSSTALK is the glitch impulse transferred to a DAC output in response to a full-scale change in the output of another DAC. DIGITAL CROSSTALK is the glitch impulse transferred to a DAC output at mid-scale in response to a full-scale change in the input register of another DAC. DIGITAL FEEDTHROUGH is a measure of the energy injected into the analog output of the DAC from the digital inputs when the DAC outputs are not updated. It is measured with a full-scale code change on the data bus. FULL-SCALE ERROR is the difference between the actual output voltage with a full scale code (FFFh) loaded into the DAC and the value of VA × 255 / 256. GAIN ERROR is the deviation from the ideal slope of the transfer function. It can be calculated from Zero and Full-Scale Errors as GE = FSE – ZE, where GE is Gain error, FSE is Full-Scale Error and ZE is Zero Error. GLITCH IMPULSE is the energy injected into the analog output when the input code to the DAC register changes. It is specified as the area of the glitch in nanovolt-seconds. INTEGRAL NON-LINEARITY (INL) is a measure of the deviation of each individual code from a straight line through the input to output transfer function. The deviation of any given code from this straight line is measured from the center of that code value. The end point method is used. INL for this product is specified over a limited range, per the electrical tables. LEAST SIGNIFICANT BIT (LSB) is the bit that has the smallest value or weight of all bits in a word. This value is LSB = VREF / 2n where

• VREF is the supply voltage for this product
• n is the DAC resolution in bits, which is 8 for the DAC082S085 (6) MAXIMUM LOAD CAPACITANCE is the maximum capacitance that can be driven by the DAC with output stability maintained. MONOTONICITY is the condition of being monotonic, where the DAC has an output that never decreases when the input code increases. MOST SIGNIFICANT BIT (MSB) is the bit that has the largest value or weight of all bits in a word. Its value is 1/2 of VA. MULTIPLYING BANDWIDTH is the frequency at which the output amplitude falls 3 dB below the input sine wave on VREFIN with a full-scale code loaded into the DAC. POWER EFFICIENCY is the ratio of the output current to the total supply current. The output current comes from the power supply. The difference between the supply and output currents is the power consumed by the device without a load. SETTLING TIME is the time for the output to settle to within 1/2 LSB of the final value after the input code is updated. TOTAL HARMONIC DISTORTION (THD) is the measure of the harmonics present at the output of the DACs with an ideal sine wave applied to VREFIN. THD is measured in dB. WAKE-UP TIME is the time for the output to exit power-down mode. This is the time from the falling edge of the 16th SCLK pulse to when the output voltage deviates from the power-down voltage of 0 V.

SNAS365G –MAY 2006–REVISED JUNE 2016 www.ti.com Product Folder Links: DAC082S085 Submit Documentation Feedback Copyright © 2006–2016, Texas Instruments Incorporated Device Support (continued) ZERO CODE ERROR is the output error, or voltage, present at the DAC output after a code of 000h has been entered.

12.2 Receiving Notification of Documentation Updates

To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper right corner, click on Alert me to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document.

12.3 Community Resource

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers. Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

12.4 Trademarks

E2E is a trademark of Texas Instruments. SPI is a trademark of Motorola, Inc.. All other trademarks are the property of their respective owners.

12.5 Electrostatic Discharge Caution

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

12.6 Glossary

SLYZ022 — TI Glossary. This glossary lists and explains terms, acronyms, and definitions.

13 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.

www.ti.com 23-May-2025 PACKAGING INFORMATION Orderable part number Status (1) Material type (2) Package | Pins Package qty | Carrier RoHS (3) Lead finish/ Ball material (4) MSL rating/ Peak reflow (5) Op temp (°C) Part marking (6) DAC082S085CIMM/NO.A Active Production VSSOP (DGS) | 10 1000 | SMALL T&R Yes SN Level-1-260C-UNLIM -40 to 105 X76C DAC082S085CIMM/NOPB Active Production VSSOP (DGS) | 10 1000 | SMALL T&R Yes SN Level-1-260C-UNLIM -40 to 105 X76C DAC082S085CIMMX/NO.A Active Production VSSOP (DGS) | 10 3500 | LARGE T&R Yes SN Level-1-260C-UNLIM -40 to 105 X76C DAC082S085CIMMX/NOPB Active Production VSSOP (DGS) | 10 3500 | LARGE T&R Yes SN Level-1-260C-UNLIM -40 to 105 X76C DAC082S085CISD/NO.A Active Production WSON (DSC) | 10 1000 | SMALL T&R Yes SN Level-1-260C-UNLIM -40 to 105 X77C DAC082S085CISD/NOPB Active Production WSON (DSC) | 10 1000 | SMALL T&R Yes SN Level-1-260C-UNLIM -40 to 105 X77C DAC082S085CISDX/NO.A Active Production WSON (DSC) | 10 4500 | LARGE T&R Yes SN Level-1-260C-UNLIM -40 to 105 X77C DAC082S085CISDX/NOPB Active Production WSON (DSC) | 10 4500 | LARGE T&R Yes SN Level-1-260C-UNLIM -40 to 105 X77C (1) Status: For more details on status, see our product life cycle. (2) Material type: When designated, preproduction parts are prototypes/experimental devices, and are not yet approved or released for full production. Testing and final process, including without limitation quality assurance, reliability performance testing, and/or process qualification, may not yet be complete, and this item is subject to further changes or possible discontinuation. If available for ordering, purchases will be subject to an additional waiver at checkout, and are intended for early internal evaluation purposes only. These items are sold without warranties of any kind. (3) RoHS values: Yes, No, RoHS Exempt. See the TI RoHS Statement for additional information and value definition. (4) Lead finish/Ball material: Parts may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two lines if the finish value exceeds the maximum column width. (5) MSL rating/Peak reflow: The moisture sensitivity level ratings and peak solder (reflow) temperatures. In the event that a part has multiple moisture sensitivity ratings, only the lowest level per JEDEC standards is shown. Refer to the shipping label for the actual reflow temperature that will be used to mount the part to the printed circuit board. (6) Part marking: There may be an additional marking, which relates to the logo, the lot trace code information, or the environmental category of the part. Multiple part markings will be inside parentheses. Only one part marking contained in parentheses and separated by a "~" will appear on a part. If a line is indented then it is a continuation of the previous line and the two combined represent the entire part marking for that device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. Addendum-Page 1

www.ti.com 23-May-2025 In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2

PACKAGE MATERIALS INFORMATION www.ti.com 9-Aug-2022 TAPE AND REEL INFORMATION Reel Width (W1) REEL DIMENSIONS A0B0K0WDimension designed to accommodate the component lengthDimension designed to accommodate the component thicknessOverall width of the carrier tapePitch between successive cavity centersDimension designed to accommodate the component width TAPE DIMENSIONSK0 P1B0WA0Cavity QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE Pocket QuadrantsSprocket HolesQ1Q1Q2Q2Q3Q3Q4Q4User Direction of Feed P1ReelDiameter *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant DAC082S085CIMMX/ NOPB DAC082S085CISDX/ NOPB Pack Materials-Page 1

PACKAGE MATERIALS INFORMATION www.ti.com 9-Aug-2022 TAPE AND REEL BOX DIMENSIONS Width (mm) W LH *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) DAC082S085CIMM/NOPB VSSOP DGS 10 1000 210.0 185.0 35.0 DAC082S085CIMMX/ NOPB VSSOP DGS 10 3500 367.0 367.0 35.0 DAC082S085CISD/NOPB WSON DSC 10 1000 210.0 185.0 35.0 DAC082S085CISDX/ NOPB WSON DSC 10 4500 367.0 367.0 35.0 Pack Materials-Page 2

www.ti.com PACKAGE OUTLINE C TYP5.05 4.75

1.1 MAX

8X 0.5 10X 0.27 0.17 0.15 0.05 TYP0.23 0.13 0 - 8 0.25 GAGE PLANE 0.7 0.4 A NOTE 3 3.1 2.9 B NOTE 4 3.1 2.9 4221984/A 05/2015 VSSOP - 1.1 mm max heightDGS0010A SMALL OUTLINE PACKAGE NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0.15 mm per side. 4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm per side. 5. Reference JEDEC registration MO-187, variation BA.

0.1 C A B

0.1 C SEE DETAIL A DETAIL A TYPICAL SCALE 3.200

www.ti.com EXAMPLE BOARD LAYOUT (4.4)

0.05 MAX

0.05 MIN

10X (1.45) 10X (0.3) 8X (0.5) (R ) TYP 0.05 4221984/A 05/2015 VSSOP - 1.1 mm max heightDGS0010A SMALL OUTLINE PACKAGE SYMM SYMM LAND PATTERN EXAMPLE SCALE:10X 5 6 NOTES: (continued) 6. Publication IPC-7351 may have alternate designs. 7. Solder mask tolerances between and around signal pads can vary based on board fabrication site. METALSOLDER MASK OPENING NON SOLDER MASK DEFINED SOLDER MASK DETAILS NOT TO SCALE SOLDER MASK OPENING METAL UNDER SOLDER MASK SOLDER MASK DEFINED

www.ti.com EXAMPLE STENCIL DESIGN (4.4) 8X (0.5) 10X (0.3) 10X (1.45) (R ) TYP0.05 4221984/A 05/2015 VSSOP - 1.1 mm max heightDGS0010A SMALL OUTLINE PACKAGE NOTES: (continued) 8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 9. Board assembly site may have different recommendations for stencil design. SYMM SYMM 5 6 SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL SCALE:10X

www.ti.com SDA10A (Rev A)

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